Texas Instruments CY74FCT157CTSOCT, CY74FCT157CTSOC, CY74FCT157CTQCT, CY74FCT157CTQC, CY74FCT157ATSOCT Datasheet

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Texas Instruments CY74FCT157CTSOCT, CY74FCT157CTSOC, CY74FCT157CTQCT, CY74FCT157CTQC, CY74FCT157ATSOCT Datasheet

Data sheet acquired from Cypress Semiconductor Corporation.

Data sheet modified to remove devices not offered.

CY54/74FCT157T

SCCS014 - May 1994 - Revised February 2000

Features

Function, pinout, and drive compatible with FCT and F logic

FCT-C speed at 4.3 ns max. (Com’l), FCT-A speed at 5.0 ns max. (Com’l)

Reduced VOH (typically = 3.3V) versions of equivalent FCT functions

Edge-rate control circuitry for significantly improved noise characteristics

Power-off disable feature

Matched rise and fall times

Fully compatible with TTL input and output logic levels

ESD > 2000V

Extended commercial range of 40˚C to +85˚C

• Sink current

64 mA (Com’l),

 

32 mA (Mil)

Source current

32 mA (Com’l),

 

12 mA (Mil)

Quad 2-Input Multiplexer

Functional Description

The FCT157T is a quad two-input multiplexer that selects four bits of data from two sources under the control of a common data Select input (S). The Enable input (E) is Active LOW. When (E) is HIGH, all of the outputs (Y) are forced LOW regardless of all other input conditions.

Moving data from two groups of registers to four common output buses is a common use of the FCT157T. The state of the Select input determines the particular register from which the data comes. It can also be used as a function generator. The device is useful for implementing highly irregular logic by generating any four of the sixteen different functions of two variables with one variable common.

The FCT157T is a logic implementation of a four-pole, two-position switch where the position of the switch is determined by the logic levels supplied to the Select input.

The outputs are designed with a power-off disable feature to allow for live insertion of boards.

Logic Block Diagram, FCT157T

 

 

Pin Configurations

I0a

I1a

I0b I1b I0c

I1c

I0d I1d

 

S

E

Ya

Yb

Yc

Yd

LCC

Top View

 

1b

0b

NC

a

 

1a

 

 

 

 

 

I

I

Y

I

 

 

 

 

Yb

8

7

6

5

 

4

 

 

I0a

9

 

 

 

 

3

 

GND

10

FCT157T

2

 

 

S

NC

11

1

 

 

NC

Yc

12

 

 

 

 

20

 

 

VCC

I1c

13

 

 

 

 

19

 

 

E

 

 

14

1516

17 18

 

 

 

 

 

 

0c

 

 

 

 

 

 

 

 

 

 

 

 

d

NC

1d

 

 

0d

 

 

 

 

 

I

Y

I

 

I

 

 

 

 

SOIC/QSOP

Top View

S

1

 

16

 

VCC

 

I0a

2

 

15

 

 

E

 

I

3

14

 

I0d

 

1a

 

 

 

 

 

Ya

4

FCT157T 13

 

I1d

 

I0b

5

12

 

Yd

 

I1b

6

11

 

I0c

 

Yb

7

 

I1c

10

 

 

GND

8

9

 

Yc

 

Logic Symbol

 

 

 

 

 

 

 

E I0a

I1a I0b

I1b I0c I1c

I0d I1d

 

S

FCT157T

 

 

 

Ya

Yb

Yc

Yd

FCT157T–1

Copyright © 2000, Texas Instruments Incorporated

CY54/74FCT157T

Pin Description

 

 

Name

Description

 

 

 

 

S

Common Select Input

 

 

 

 

 

 

 

Enable Inputs (Active LOW)

 

E

 

 

 

 

I0

Data Inputs from Source 0

 

I1

Data Inputs from Source 1

 

Y

Non-Inverted Output

 

 

 

 

Function Table[1]

 

 

Inputs

 

Outputs

 

 

 

 

 

 

E

S

 

I0

I1

Y

H

X

 

X

X

L

 

 

 

 

 

 

L

H

 

X

L

L

 

 

 

 

 

 

L

H

 

X

H

H

 

 

 

 

 

 

L

L

 

L

X

L

 

 

 

 

 

 

L

L

 

H

X

H

 

 

 

 

 

 

Electrical Characteristics Over the Operating Range

Maximum Ratings[2,3]

(Above which the useful life may be impaired. For user guidelines, not tested.)

Storage Temperature .....................................

−65°C to +150°C

Ambient Temperature with

−65°C to +135°C

Power Applied ..................................................

Supply Voltage to Ground Potential..................

−0.5V to +7.0V

DC Input Voltage .................................................

−0.5V to +7.0V

DC Output Voltage ..............................................

−0.5V to +7.0V

DC Output Current (Maximum Sink Current/Pin) ......

120 mA

Power Dissipation ..........................................................

 

0.5W

Static Discharge Voltage............................................

 

>2001V

(per MIL-STD-883, Method 3015)

Operating Range

 

 

Ambient

 

Range

Range

Temperature

VCC

Commercial

All

−40°C to +85°C

5V ± 5%

 

 

 

 

Military[4]

All

−55°C to +125°C

5V ± 10%

Parameter

Description

 

 

Test Conditions

 

Min.

Typ.[5]

Max.

Unit

VOH

Output HIGH Voltage

VCC=Min., IOH=−32 mA

Com’l

2.0

 

 

V

 

 

 

VCC=Min., IOH=−15 mA

Com’l

2.4

3.3

 

V

 

 

 

VCC=Min., IOH=−12 mA

Mil

2.4

3.3

 

V

VOL

Output LOW Voltage

VCC=Min., IOL=64 mA

Com’l

 

0.3

0.55

V

 

 

 

VCC=Min., IOL=32 mA

Mil

 

0.3

0.55

V

VIH

Input HIGH Voltage

 

 

 

 

2.0

 

 

V

VIL

Input LOW Voltage

 

 

 

 

 

 

0.8

V

VH

Hysteresis[6]

All inputs

 

 

0.2

 

V

VIK

Input Clamp Diode Voltage

VCC=Min., IIN=−18 mA

 

 

−0.7

−1.2

V

II

Input HIGH Current

VCC=Max., VIN=VCC

 

 

 

5

µA

IIH

Input HIGH Current

VCC=Max., VIN=2.7V

 

 

 

±1

µA

IIL

Input LOW Current

VCC=Max., VIN=0.5V

 

 

 

±1

µA

IOZH

Off State HIGH-Level Output

VCC = Max., VOUT = 2.7V

 

 

 

10

µA

 

 

Current

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IOZL

Off State LOW-Level

VCC = Max., VOUT = 0.5V

 

 

 

−10

µA

 

 

Output Current

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I

OS

Output Short Circuit Current[7]

V

CC

=Max., V =0.0V

 

−60

−120

−225

mA

 

 

 

OUT

 

 

 

 

 

IOFF

Power-Off Disable

VCC=0V, VOUT=4.5V

 

 

 

±1

µA

Note:

1.H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care

2.Unless otherwise noted, these limits are over the operating free-air temperature range.

3.Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.

4.TA is the “instant on” case temperature.

5.Typical values are at VCC=5.0V, TA=+25˚C ambient.

6.This parameter is specified but not tested.

7.Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last.

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