Texas Instruments CY74FCT273TSOCT, CY74FCT273TSOC, CY74FCT273TQCT, CY74FCT273TQC, CY74FCT273CTSOCT Datasheet

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CY54/74FCT273T
SCCS020 - March 1995 - Revised February 2000
Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
Copyright © 2000, Texas Instruments Incorporated
Features
Function, pinout, and drive compatible with FCT and
FCT-C speed at 5.8 ns max. (Com’l)
FCT-A speed at 7.2 ns max. (Com’l)
Reduced V
OH
(typically = 3.3V) versions of equivalent
FCT functions
Edge-rate control circuitry for significantly improved
noise characteristics
Power-off disable feature
Matched rise and fall times
ESD > 2000V
Fully compatible with TTL input and output logic levels
Extended commercial range of 40˚C to +85˚C
Sink current 64 mA (Com’l), 32 mA (Mil)
Source current 32 mA (Com’l), 12 mA (Mil)
Functional Description
The FCT273T consists of eight edge-triggered D-type
flip-flops with individual D inputs and Q outputs. The common
buffered clock (CP) and master reset (MR) load and reset all
flip-flops simultaneously. The FCT273T is an edge-triggered
register.The state of each D input (one set-up time before the
LOW-to-HIGH clock transition) is transferred to the corre-
sponding flip-flop’sQ output. All outputs will be forcedLOWby
a low voltage level on the
MR input.
The outputs are designed with a power-off disable feature to
allow for liv e insertion of boards.
Note:
1. H = HIGH Voltage Level steady state
h = HIGH Voltage Level one set-up time prior to LOW-to-HIGH clock transition
L = LOW Voltage Level steady state
l = LOW Voltage Level one set-up time prior to the LOW-to-HIGH transition
X = Don’t Care
= LOW-to-HIGH clock transition
Logic Block Diagram
PinConfigurations
FCT273T–1
CP
D Q
D
0
Q
0
R
D
CP
D Q
D
1
Q
1
R
D
CP
D Q
D
2
Q
2
R
D
CP
D Q
D
3
Q
3
R
D
CP
D Q
D
4
Q
4
R
D
CP
D Q
D
5
Q
5
R
D
CP
D Q
D
6
Q
6
R
D
CP
D Q
D
7
Q
7
R
D
CP
MR
FCT273T–2
4
8
9
10
11
12
765
1516 17 18
3
2
1
20
13
14
19
D
3
D
2
Q
1
D
6
D
5
D
7
CP
V
CC
GND
Q
5
Top View
D
1
LCC
MR
Q
0
D
0
Q
3
D
4
Q
4
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
13
14
V
CC
FCT273T–3
15
Top View
Q
6
Q
2
Q
7
Q
0
D
0
D
1
Q
1
Q
2
D
2
D
3
Q
3
D
7
D
6
Q
6
Q
5
D
5
D
4
Q
4
CP
MR
GND
Q
7
DIP/SOIC/QSOP
FCT273T–4
CP
MR
D
0
Q
0
D
1
Q
1
D
2
Q
2
D
3
Q
3
D
4
Q
4
D
5
Q
5
D
6
Q
6
D
7
Q
7
Logic Symbol
Function Table
[1]
Operating Mode
Inputs Output
MR CP D Q
Reset (clear) L X X L
Load ‘1’ H h H
Load ‘0’ H l L
CY54/74FCT273T
2
Maximum Ratings
[2, 3]
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature .....................................65°C to +150°C
Ambient Temperature with
Power Applied..................................................65°C to +135°C
Supply Voltage to Ground Potential..................−0.5V to +7.0V
DC Input Voltage .................................................−0.5V to +7.0V
DC Output Voltage..............................................−0.5V to +7.0V
DC Output Current (Maximum Sink Current/Pin).......120 mA
Power Dissipation..........................................................0.5W
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Operating Range
Range Range
Ambient
Temperature V
CC
Commercial All –40°C to +85°C 5V ± 5%
Military
[4]
All –55°C to +125°C 5V ± 10%
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions Min. Typ.
[5]
Max. Unit
V
OH
Output HIGH Voltage V
CC
=Min., I
OH
=–32 mA Com’l 2.0 V
V
CC
=Min., I
OH
=–15 mA Com’l 2.4 3.3 V
V
CC
=Min., I
OH
=–12 mA Mil 2.4 3.3 V
V
OL
Output LOW Voltage V
CC
=Min., I
OL
=64 mA Com’l 0.3 0.55 V
V
CC
=Min., I
OL
=32mA Mil 0.3 0.55 V
V
IH
Input HIGH Voltage 2.0 V
V
IL
Input LOW Voltage 0.8 V
V
H
Hysteresis
[6]
All inputs 0.2 V
V
IK
Input Clamp Diode Voltage V
CC
=Min., I
IN
=–18 mA –0.7 –1.2 V
I
I
Input HIGH Current V
CC
=Max., V
IN
=V
CC
5 µA
I
IH
Input HIGH Current V
CC
=Max., V
IN
=2.7V ±1 µA
I
IL
Input LOW Current V
CC
=Max., V
IN
=0.5V ±1 µA
I
OS
Output Short Circuit Current
[7]
V
CC
=Max., V
OUT
=0.0V –60 –120 –225 mA
I
OFF
Power-Off Disable V
CC
=0V, V
OUT
=4.5V ±1 µA
Capacitance
[6]
Parameter Description Typ.
[5]
Max. Unit
C
IN
Input Capacitance 5 10 pF
C
OUT
Output Capacitance 9 12 pF
Notes:
2. Unless otherwise noted, these limits are over the operating free-air temperature range.
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either V
CC
or ground.
4. T
A
is the “instant on” case temperature
5. Typical values are at V
CC
=5.0V, T
A
=+25˚C ambient.
6. This parameter is specified but not tested.
7. Not more than one output should beshorted at a time.Duration of short should not exceedone second. The use of high-speed testapparatus and/or sample
and hold techniquesare preferable in order tominimize internal chip heating and more accuratelyreflect operational values. Otherwiseprolongedshorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, I
OS
tests should be performed last.
CY54/74FCT273T
3
Power Supply Characteristics
Parameter Description Test Conditions Typ.
[5]
Max. Unit
I
CC
Quiescent Power Supply Current V
CC
=Max., V
IN
0.2V, V
IN
V
CC
-0.2V 0.1 0.2 mA
I
CC
Quiescent Power Supply Current
(TTL inputs HIGH)
V
CC
=Max., V
IN
=3.4V, f
1
=0, Outputs Open
[8]
0.5 2.0 mA
I
CCD
Dynamic Power Supply Current
[9]
V
CC
=Max., One Bit Toggling, 50% Duty Cycle,
Outputs Open,
MR=V
CC
,
V
IN
0.2V or V
IN
V
CC
-0.2V
0.06 0.12 mA/MHz
I
C
Total Power Supply Current
[10]
V
CC
=Max., f
0
=10 MHz, 50% Duty Cycle,
Outputs Open, One Bit Toggling at f
1
=5 MHz,
MR=V
CC
, V
IN
0.2V or V
IN
V
CC
-0.2V
0.7 1.4 mA
V
CC
=Max., f
0
=10 MHz, 50% Duty Cycle,
Outputs Open, One Bit Toggling at f
1
=5 MHz,
MR=V
CC
, V
IN
=3.4V or V
IN
=GND
1.2 3.4 mA
V
CC
=Max., f
0
=10 MHz, 50% Duty Cycle,
Outputs Open, Eight Bits Toggling
at f
1
=2.5MHz, MR=V
CC
,
V
IN
0.2V or V
IN
V
CC
-0.2V
1.6 3.2
[11]
mA
V
CC
=Max., f
0
=10 MHz, 50% Duty Cycle,
Outputs Open, Eight Bits Toggling
at f
1
=2.5 MHz, MR=V
CC
,
V
IN
=3.4V or V
IN
=GND
3.9 12.2
[11]
mA
Notes:
8. Per TTL driven input (V
IN
=3.4V); all other inputs at V
CC
or GND.
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
10. I
C
=I
QUIESCENT
+ I
INPUTS
+ I
DYNAMIC
I
C
=I
CC
+I
CC
D
H
N
T
+I
CCD
(f
0
/2 + f
1
N
1
)
I
CC
= Quiescent Current with CMOS input levels
I
CC
= Power Supply Current for a TTL HIGH input (V
IN
=3.4V)
D
H
= Duty Cycle for TTL inputs HIGH
N
T
= Number of TTL inputs at D
H
I
CCD
= Dynamic Current caused by an input transition pair (HLH or LHL)
f
0
= Clock frequency for registered devices, otherwise zero
f
1
= Input signal frequency
N
1
= Number of inputs changing at f
1
All currents are in milliamps and all frequencies are in megahertz.
11. Values for these conditions are examples of the I
CC
formula. These limits are specified but not tested.
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