Texas Instruments CY74FCT163827CPVCT, CY74FCT163827CPVC, CY74FCT163827CPACT, CY74FCT163827CPAC, CY74FCT163827APVCT Datasheet

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Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.

CY74FCT163827

SCCS049 - March 1997 - Revised March 2000

Features

• Low power, pin-compatible replacement for LCX and
LPT families

• 5V tolerant inputs and outputs

• 24 mA & 6 mA balanced drive outputs

• Power-off disable outputs permits live insertion

• Edge-rate control circuitry for reduced noise

• FCT-C speed at 4.1 ns

• Latch-up performance exceedsJEDEC standard no. 17

• Typical output skew < 250 ps

• Industrial temperature range of –40˚C to +85˚C

• TSSOP (19.6-mil pitch) or SSOP (25-mil pitch)

• Typical
Std 883D

•V

V

olp

= 2.7V to 3.6V

CC

(groundbounce)performanceexceedsMil

Functional Description

The CY74FCT163827 is a 20-bit buffer/linedriver that provides
high-performance bus interf ace b uff ering for wide data/address
paths or buses carrying parity . It can be used as a single 20-bit
bufferortwo 10-bit buffers.Each 10-bitbufferhasa pair of NANDed
OE for increased flexibility.

The CY74FCT163827 has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for
minimal undershoot and reduced ground bounce. The inputs
and outputs were designed to be capable of being driven by

5.0V buses, allowing its use in mixed voltage systems as a
translator. The outputs are also designed with a power-off
disable feature enabling its use in applications requiring live
insertion.

20-Bit Buffe

• ESD (HBM) > 2000V

Logic Block Diagrams CY74FCT163827 Pin Configuration

SSOP/TSSOP

Top View

1OE1
1OE2

1A1

2OE1
2OE2

2A1

TO 9 OTHER CHANNELS

TO 9 OTHER CHANNELS

1Y1

FCT163827-1

2Y1

FCT163827-2

1OE1

1Y1
1Y2

GND

1Y3
1Y4

V

1Y5
1Y6
1Y7

GND

1Y8
1Y9

1Y10

2Y1
2Y2
2Y3

GND

2Y4
2Y5
2Y6

V

2Y7
2Y8

GND

2Y9
2Y10

2OE1

1
2
3
4
5
6

CC

7
8
9
10
11
12

13
14

15
16
17
18
19
20
21

CC

22
23
24
25
26
27
28

56
55
54
53
52
51
50
49
48
47

46
45
44
43
42
41
40
39
38
37
36
35
34
33

32
31

30
29

1OE2
1A1
1A2

GND

1A3
1A4

V

CC
1A5
1A6
1A7

GND

1A8
1A9
1A10

2A1
2A2
2A3

GND

2A4
2A5
2A6

V

CC
2A7
2A8

GND

2A9
2A10
2OE2

Copyright © 2000, Texas Instruments Incorporated

CY74FCT163827

Pin Description

Name Description

OE Output Enable Inputs (Active LOW)
A Data Inputs
Y Three-State Outputs

Function Table

OE

1

L L L L

L L H H
H X X Z
X H X Z

[1]

Inputs Outputs

OE

2

A Y

Maximum Ratings

(Above which the useful life may be impaired. For user
guidelines, not tested.)

Storage Temperature ................................ −55°C to +125°C
Ambient Temperature with

Power Applied............................................ −55°C to +125°C

Supply Voltage Range..................................... 0.5V to +4.6V

DC Input Voltage .................................................−0.5V to +7.0V

DC Output Voltage..............................................−0.5V to +7.0V
DC Output Current

(Maximum Sink Current/Pin)...........................−60 to +120 mA

Power Dissipation..........................................................1.0W

Operating Range

Range

[2, 3]

Ambient

Temperature V

CC

Commercial –40°C to +85°C 2.7V to 3.6V

Electrical Characteristics Over the Operating Range V

Parameter Description Test Conditions Min. Typ.

V

IH

V

IL

V

H

V

IK

I

IH

I

IL

I

OZH

I

OZL

I

OS

I

OFF

I

CC

∆I

CC

Note:

1. H = HIGH Voltage Level, L = LOW Voltage Level, X = Don’t Care, Z = HIGH Impedance.

2. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature
range.

3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either V

4. Typical values are at V

5. This parameter is specified but not tested.

6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internalchip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, I

7. Per TTL driven input; all other inputs at V

Input HIGH Voltage All Inputs 2.0 5.5 V
Input LOW Voltage 0.8 V
Input Hysteresis

[5]

Input Clamp Diode Voltage VCC=Min., IIN=–18 mA –0.7 – 1.2 V
Input HIGH Current VCC=Max., VI=5.5 ±1 µA

Input LOW Current VCC=Max., VI=GND ±1 µA
High Impedance Output Current

VCC=Max., V

(Three-State Output pins)
High Impedance Output Current

VCC=Max., V

(Three-State Output pins)
Short Circuit Current

[6]

VCC=Max., V
Power-Off Disable VCC=0V, V
Quiescent Power Supply Current VIN≤0.2V,

V
Quiescent Power Supply Current

VIN=VCC–0.6V
(TTL inputs HIGH)

=3.3V, TA = +25˚C ambient.

CC

tests should be performed last.

OS

or GND.

CC

CC

IN>VCC

=2.7V to 3.6V

[4]

100 mV

=5.5V ±1 µA

OUT

=GND ±1 µA

OUT

=GND –60 –135 –240 mA

OUT

≤4.5V ±100 µA

OUT

VCC=Max. 0.1 10 µA

–0.2V

[7]

VCC=Max. 2.0 30 µA

or ground.

CC

Max. Unit

2