Texas Instruments CY74FCT2257CTSOCT, CY74FCT2257CTSOC, CY74FCT2257CTQCT, CY74FCT2257CTQC, CY74FCT2257ATQCT Datasheet

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Texas Instruments CY74FCT2257CTSOCT, CY74FCT2257CTSOC, CY74FCT2257CTQCT, CY74FCT2257CTQC, CY74FCT2257ATQCT Datasheet

Data sheet acquired from Cypress Semiconductor Corporation.

Data sheet modified to remove devices not offered.

CY74FCT2257T

SCCS038 - September 1994 - Revised March 2000

Features

Function and pinout compatible with FCT and F logic

25Ω output series resistors to reduce transmission line reflection noise

FCT-C speed at 4.3 ns max.,

FCT-A speed at 5.0 ns max.

TTL output level versions of equivalent FCT functions

Edge-rate control circuitry for significantly improved noise characteristics

Power-off disable feature

Fully compatible with TTL input and output logic levels

ESD > 2000V

Sink current 12 mA Source current15 mA

Extended commercial temp. range of –40˚C to +85˚C

Three-state outputs

Quad 2-Input Multiplexer

Functional Description

The FCT2257T has four identical two-input multiplexers that select four bits of data from two sources under the control of a common data Select input (S). The I0 inputs are selected when the Select input is LOW and the I1 inputs are selected when the Select input is HIGH. Data appears at the output in true non-inverted form for the FCT2257T. On-chip termination resistors have been added to the outputs to reduce system noise caused by reflections. The FCT2257T can be used to replace the FCT257T to reduce noise in an existing design.

The FCT2257T is a logic implementation of a four-pole, two-position switch where the position of the switch is determined by the logic levels supplied to the select input. Outputs are forced to a high-impedance “OFF” state when the Output Enable input (OE) is HIGH.

All but one device must be in the high-impedance state to avoid currents exceeding the maximum ratings if outputs are tied together. Design of the output enable signals must ensure that there is no overlap when outputs of three-state devices are tied together.

The outputs are designed with a power-off disable feature to allow for live insertion of boards.

Logic Block Diagram

Pin Configurations

I0a

I1a

I0b

I1b

I0c

I1c

I0d

I1d

S

 

 

 

 

 

 

 

 

 

 

 

 

SOIC/QSOP

 

 

 

 

 

 

 

 

 

 

 

Top View

 

OE

 

 

 

 

 

 

 

S

1

16

VCC

 

 

 

 

 

 

 

I0a

 

 

 

 

 

 

 

 

 

 

 

2

15

OE

 

 

 

 

 

 

 

 

I1a

3

14

I0c

 

 

 

 

 

 

 

 

Ya

4

13

I1c

 

 

 

 

 

 

 

 

I0b

5

12

Yc

 

 

 

 

 

 

 

 

I1b

6

11

I0d

 

 

 

 

 

 

 

 

 

 

Yb

7

10

 

 

I1d

GND

 

Yd

8

9

 

 

 

 

 

 

 

 

 

FCT2257T–3

Ya

Yb

Yc

Yd

FCT2257T–1

Pin Description

 

Name

Description

 

 

 

 

I

Data Inputs

 

 

 

 

S

Common Select Input

 

 

 

 

 

 

 

Enable Inputs (Active LOW)

 

OE

 

 

 

 

Y

Data Outputs

 

 

 

 

Function Table[1]

 

 

 

 

Inputs

 

Output

 

 

 

 

 

 

 

 

 

 

 

S

 

I0

I1

Y

OE

 

H

X

 

X

X

Z

 

L

H

 

X

L

L

 

L

H

 

X

H

H

 

L

L

 

L

X

L

 

L

L

 

H

X

H

 

 

 

 

 

 

 

 

Note:

1.H = HIGH Voltage Level, L = LOW Voltage Level, X = Don’t Care, Z = High impedance (OFF) state.

Copyright © 2000, Texas Instruments Incorporated

CY74FCT2257T

Maximum Ratings[2, 3]

(Above which the useful life may be impaired. For user guidelines, not tested.)

Storage Temperature .................................

–65°C to +150°C

Ambient Temperature with

–65°C to +135°C

Power Applied .............................................

Supply Voltage to Ground Potential ...............

–0.5V to +7.0V

DC Input Voltage............................................

–0.5V to +7.0V

DC Output Voltage .........................................

–0.5V to +7.0V

Electrical Characteristics Over the Operating Range

DC Output Current (Maximum Sink Current/Pin) ......

120 mA

Power Dissipation ..........................................................

0.5W

Static Discharge Voltage............................................

>2001V

(per MIL-STD-883, Method 3015)

 

Operating Range

 

Ambient

 

Range

Temperature

VCC

Commercial

–40°C to +85°C

5V ± 5%

 

 

 

Parameter

Description

 

Test Conditions

Min.

Typ.[5]

Max.

Unit

VOH

Output HIGH Voltage

VCC=Min., IOH=–15 mA

2.4

3.3

 

V

VOL

Output LOW Voltage

VCC=Min., IOL=12 mA

 

0.3

0.55

V

ROUT

Output Resistance

VCC=Min., IOL=12 mA

20

25

40

Ω

VIH

Input HIGH Voltage

 

 

2.0

 

 

V

VIL

Input LOW Voltage

 

 

 

 

0.8

V

VH

Hysteresis[6]

All inputs

 

0.2

 

V

VIK

Input Clamp Diode Voltage

VCC=Min., IIN=–18 mA

 

–0.7

–1.2

V

IIH

Input HIGH Current

VCC=Max., VIN=2.7V

 

 

±1

µA

IIL

Input LOW Current

VCC=Max., VIN=0.5V

 

 

±1

µA

IOZH

Off State HIGH-Level Output

VCC=Max., VOUT=2.7V

 

 

10

µA

 

 

Current

 

 

 

 

 

 

 

 

 

 

 

 

 

IOZL

Off State LOW-Level

VCC=Max., VOUT=0.5V

 

 

–10

µA

 

 

Output Current

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I

OS

Output Short Circuit Current[7]

V

=Max., V =0.0V

–60

–120

–225

mA

 

 

CC

OUT

 

 

 

 

IOFF

Power-Off Disable

VCC=0V, VOUT=4.5V

 

 

±1

µA

Capacitance[6]

Parameter

Description

Test Conditions

Typ.[5]

Max.

Unit

CIN

Input Capacitance

 

5

10

pF

COUT

Output Capacitance

 

9

12

pF

Notes:

 

 

 

 

 

2.Unless otherwise noted, these limits are over the operating free-air temperature range.

3.Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.

4.TA is the “instant on” case temperature.

5.Typical values are at VCC=5.0V, TA=+25˚C ambient.

6.This parameter is specified but not tested.

7.Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last.

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