Texas Instruments TPS3831A09DQNR, TPS3831E16DQNR, TPS3831G12DQNR, TPS3831G18DQNR, TPS3831G33DQNR Schematic [ru]

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TPS3831, TPS3839

SBVS193D –JUNE 2012–REVISED JULY 2015

TPS383x 150-nA, Ultralow Power, Supply Voltage Monitor

1 Features

•Ultralow Supply Current: 150 nA (Typical)

•Operating Supply Voltage: 0.9 V to 6.5 V

•Valid Reset for VDD > 0.6 V

•Push-Pull RESET Output

•Factory-Trimmed Reset Threshold Voltages

•Temperature Range: –40°C to 85°C

•Packages: 1-mm × 1-mm X2SON or 3-Pin SOT23

2 Applications

•Portable and Battery-Powered Equipment

•Metering

•Industrial Equipment

•Cell Phones

•Glucose Monitors

•Tablets

•Wearables

3 Description

The TPS3831 and TPS3839 devices (both referred to as TPS383x) are ultralow current (150 nA, typical), voltage supervisory circuits that monitor a single voltage. Both devices initiate an active-low reset signal whenever the VDD supply voltage drops below the factory-trimmed reset threshold voltage. The reset output remains low for 200 ms (typical) after the VDD voltage rises above the threshold voltage and hysteresis. These devices are designed to ignore fast transients on the VDD pin. The TPS3831 device includes a manual reset input that forces RESET low

when MR is low.

The ultralow current consumption of 150 nA makes these voltage supervisors ideal for use in low-power and portable applications. The TPS383x devices are specified to have the correct output logic state for supply voltages down to 0.6 V.

The TPS383x devices feature precision factorytrimmed threshold voltages and extremely low-power operation. The TPS3831 device is available in a 4- pin, 1-mm × 1-mm (DQN) X2SON package. The TPS3839 device is available in a 3-pin SOT23 (DBZ) package or a 4-pin, 1-mm × 1-mm (DQN) X2SON package.

Device Information(1)

	PART NUMBER	PACKAGE	PACKAGE SIZE
			(NOM)
	TPS3831	X2SON (4)	1.00 mm x 1.00 mm
	TPS3839	SOT-23 (3)	2.92 mm x 2.37 mm
		X2SON (4)	1.00 mm x 1.00 mm

(1)For all available packages, see the orderable addendum at the end of the data sheet.

Typical Application Circuit

Supply Current vs Temperature

	3.3 V			200	VDD = 1.2 V
				190
					VDD = 3.3 V
C1
				180	VDD = 5.0 V
0.1 mF			(nA)	170	VDD = 6.5 V
	VDD		Current	160
TPS383xK33		MICROPROCESSOR		150
			Supply
				140
MR	RESET	RST		130
TPS3831	GND			120
Only				110
				100	−15	10	35	60	85
				−40
						Temperature (°C)			G001

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPS3831, TPS3839

SBVS193D –JUNE 2012 –REVISED JULY 2015 www.ti.com

Table of Contents

1	Features ..................................................................		1		8.4	Device Functional Modes........................................	12
2	Applications ...........................................................		1	9	Applications and Implementation ......................		13
3	Description .............................................................		1		9.1	Application Information............................................	13
4	Revision History.....................................................		2		9.2	Typical Application ..................................................	13
5	Device Options.......................................................		4	10	Power Supply Recommendations .....................		15
6	Pin Configuration and Functions .........................		5	11	Layout...................................................................		15
7	Specifications		6		11.1	Layout Guidelines .................................................	15
					11.2	Layout Example	15
	7.1	Absolute Maximum Ratings	6
				12 Device and Documentation Support			16
	7.2	ESD Ratings..............................................................	6
	7.3	Recommended Operating Conditions	6		12.1	Device Support......................................................	16
					12.2	Documentation Support	16
	7.4	Thermal Information	6
					12.3	Related Links	16
	7.5	Electrical Characteristics	7
					12.4	Community Resources	16
	7.6	Timing Requirements	8
					12.5	Trademarks	16
	7.7	Typical Characteristics	9
					12.6	Electrostatic Discharge Caution	16
8	Detailed Description		11
					12.7	Glossary	17
	8.1	Overview	11
				13 Mechanical, Packaging, and Orderable
	8.2	Functional Block Diagram .......................................	11				17
	8.3	Feature Description	11		Information ...........................................................

4	Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (February 2015) to Revision D		Page
•	Changed µA to nA in document title.......................................................................................................................................	1
•	Added TPS3839G25 to document .........................................................................................................................................	1
•	Changed Applications section: moved Metering bullet to second in list, changed Tablets bullet, added Wearables bullet .. 1
•	Changed first paragraph of Description section ....................................................................................................................	1
•	Changed Device Information table: changed Package Size column heading and value of SOT-23 row .............................	1
•	Added TPS3839G25 row to Device Options table ................................................................................................................	4
•	Changed Thermal Information table ......................................................................................................................................	6

•Changed VIT– and Vhys parameters in Electrical Characteristics table: changed test conditions, added TPS3839G25 rows 7

Changes from Revision B (April 2013) to Revision C

Page

•Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section .................................................................................................	1
• Changed title of data sheet ...................................................................................................................................................	1
• Changed Operating Supply Voltage bullet from 0.6 V to 0.9 V..............................................................................................	1
• Changed last sentence of Description section ......................................................................................................................	1
• Changed front page figure .....................................................................................................................................................	1
• Added MR parameter to Absolute Maximum Ratings ...........................................................................................................	6
• Changed condition statement for Electrical Characteristics ..................................................................................................	7
• Changed V(VO) parameter symbol to VPOR .............................................................................................................................	7
• Changed Figure 1...................................................................................................................................................................	8
• Changed Functional Block Diagram; added hysteresis symbol to op amp ..........................................................................	11
• Deleted Typical Application Circuit figure .............................................................................................................................	13

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	TPS3831, TPS3839
www.ti.com	SBVS193D – JUNE 2012 – REVISED JULY 2015
Changes from Revision A (September 2012) to Revision B	Page
• Changed VDD test conditions for high-level output voltage parameter	................................................................................... 7
Changes from Original (June 2012) to Revision A	Page
• Changed data sheet status from product preview to production data....................................................................................	1

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SBVS193D –JUNE 2012 –REVISED JULY 2015				www.ti.com
5 Device Options
PRODUCT		THRESHOLD	PACKAGE-LEAD	PACKAGE
		VOLTAGE (V)		DESIGNATOR(1)
TPS3831A09		0.9	X2SON-4	DQN
TPS3831G12		1.1	X2SON-4	DQN
TPS3831E16		1.52	X2SON-4	DQN
TPS3831G18		1.67	X2SON-4	DQN
TPS3831L30		2.63	X2SON-4	DQN
TPS3831K33		2.93	X2SON-4	DQN
TPS3831G33		3.08	X2SON-4	DQN
TPS3831K50		4.38	X2SON-4	DQN
TPS3839A09		0.9	SOT23-3	DBZ
			X2SON-4	DQN
TPS3839G12		1.1	SOT23-3	DBZ
			X2SON-4	DQN
TPS3839E16		1.52	SOT23-3	DBZ
			X2SON-4	DQN
TPS3839G18		1.67	SOT23-3	DBZ
			X2SON-4	DQN
TPS3839G25		2.325	SOT23-3	DBZ
TPS3839L30		2.63	SOT23-3	DBZ
			X2SON-4	DQN
TPS3839K33		2.93	SOT23-3	DBZ
			X2SON-4	DQN
TPS3839G33		3.08	SOT23-3	DBZ
			X2SON-4	DQN
TPS3839K50		4.38	SOT23-3	DBZ
			X2SON-4	DQN

(1)For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com.

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6 Pin Configuration and Functions

TPS3831 DQN Package

1-mm × 1-mm X2SON

Top View

RESET	1	4	VDD
		THERMAL
		PAD
MR	2	3	GND

TPS3839 DQN Package

1-mm × 1-mm X2SON

Top View

RESET	1	4	VDD
		THERMAL
		PAD
NC	2	3	GND

TPS3839 DBZ Package

SOT23-3

Top View

GND

1

3

VDD

2

RESET

Pin Functions

PIN

NAME

NO.

I/O

DESCRIPTION

TPS3839

TPS3839

TPS3831

(SOT23-3)

(X2SON)

(X2SON)

GND

1

3

3

—

Ground

Manual reset. Pull this pin to a logic low to assert the

output.

RESET

MR

N/A

N/A

2

I

After the MR pin is deasserted, the

RESET

output deasserts after the

reset delay (td) elapses.

NC

N/A

2

N/A

—

No internal connection.

Active-low reset output.

has a push-pull output drive and is

RESET

2

1

1

O

capable of directly driving input pins.

RESET

is low as long as VDD

RESET

remains below the factory threshold voltage, and until the delay time

(td) elapses after VDD rises above the threshold voltage.

Thermal pad

N/A

Available

Available

—

Connect to ground or to a floating copper plane for mechanical

stability.

VDD

3

4

4

I

Supply voltage

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range, unless otherwise noted(1)

							MIN	MAX	UNIT
Voltage		VDD,		RESET			–0.3	7	V
		MR					–0.3	VDD + 0.3	V
Current					pin		–10	10	mA
		RESET
Temperature(2)		Operating ambient, TA					–40	85	°C
		Storage, Tstg					–65	150

(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)As a result of the low dissipated power in this device, the junction temperature is assumed to be equal to the ambient temperature.

	7.2	ESD Ratings
					VALUE	UNIT
	V(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)		±2000	V
			Charged device model (CDM), per JEDEC specification JESD22-C101	(2)	±500

(1)JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

								MIN	NOM	MAX	UNIT
VDD						Input supply voltage		0.9		6.5	V
V						Manual reset pin voltage		0		VDD	V
		MR
V							pin voltage	0		6.5	V
						RESET
		RESET
I							pin current	0		8	mA
						RESET
	RESET

7.4 Thermal Information

		TPS3839	TPS3831,
			TPS3839
	THERMAL METRIC(1)			UNIT
		DBZ (SOT23-3)	DQN (X2SON)
		3 PINS	4 PINS
RθJA	Junction-to-ambient thermal resistance	346.6	216.1	°C/W
RθJC(top)	Junction-to-case (top) thermal resistance	124.4	161.7	°C/W
RθJB	Junction-to-board thermal resistance	78.9	162.1	°C/W
ψJT	Junction-to-top characterization parameter	11.5	5.1	°C/W
ψJB	Junction-to-board characterization parameter	77.3	161.7	°C/W
RθJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	123.0	°C/W

(1)For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

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7.5 Electrical Characteristics

At TA = –40°C to 85°C, 0.9 V < VDD < 6.5 V, and C1 = 0.1 µF, unless otherwise noted. Typical values are at 25°C.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VDD

Input supply voltage

0.9

6.5

V

V(POR)

Minimum VDD voltage for valid output

IOL = 1 µA

0.6

V

IDD

Supply current (into VDD pin)

Output not connected

150

500

nA

VDD = 0.9 V to 1.2 V, IOL = 120 µA

0.4

VOL

Low-level output voltage

pin)

VDD = 1.2 V to 2.8 V, IOL = 0.5 mA

0.4

V

(RESET

VDD = 2.8 V to 6.5 V, IOL = 2 mA

0.4

VDD = 0.9 V to 1.2 V, IOH = –50 µA

VDD – 0.4

VOH

High-level output voltage

pin)

VDD = 1.2 V to 3.3 V, IOH = –0.5 mA

VDD – 0.4

V

(RESET

VDD = 3.3 V to 6.5 V, IOH = –2 mA

VDD – 0.4

VIL

Low-level input voltage

pin)

0.3VDD

V

(MR

VIH

High-level input voltage

pin)

0.7VDD

V

(MR

R

MR pin pullup resistance

10

20

30

kΩ

MR

Negative-going input threshold accuracy

TA = 25°C

±1%

TPS383xA09

0.874

0.9

0.914

TPS383xG12

1.073

1.1

1.117

TPS383xE16

1.482

1.52

1.543

TPS383xG18

1.628

1.67

1.695

VIT–

Negative-going threshold voltage

TPS3839G25

2.267

2.325

2.360

V

TPS383xL30

2.564

2.63

2.669

TPS383xK33

2.857

2.93

2.974

TPS383xG33

3.003

3.08

3.126

TPS383xK50

4.271

4.38

4.446

TPS383xA09

54

TPS383xG12

11

TPS383xE16

15

TPS383xG18

17

Vhys

Hysteresis voltage

TPS383xL30

26

mV

TPS3839G25

23

TPS383xK33

29

TPS383xG33

31

TPS383xK50

44

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7.6 Timing Requirements

At TA = –40°C to 85°C, 0.9 V < VDD < 6.5 V, and C1 = 0.1 µF, unless otherwise noted. Typical values are at 25°C.

							MIN	TYP	MAX	UNIT
td		delay time (power-up delay)					120	200	350	ms
	RESET
tPD_VDD	Propagation delay, VDD falling (power-down delay)							20		µs
tPD_MR	Propagation delay from			low to		low		46		ns
			MR		RESET

	VDD
VIT- + VHYS
VIT-
0.6 V
MR
0.7VDD
0.3VDD
			TD = RESET DELAY
TD	TD	TD	= UNDEFINED STATE
	RESET

TIME

Figure 1. MR and VDD Reset Timing

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7.7 Typical Characteristics

At TA = 25°C and C1 = 0.1 µF, unless otherwise noted.
	200	VDD = 1.2 V						220
	190											TPS3839K33
		VDD = 3.3 V
	180	VDD = 5.0 V					Reset Delay Time (ms)	210
Supply Current (nA)	170	VDD = 6.5 V
	160
	150							200
	140
	130							190
	120
	110
	100	−15	10	35	60	85		180	−15	10	35	60	85
	−40							−40
			Temperature (°C)			G001				Temperature (°C)			G002

Figure 2. Supply Current vs Temperature

Figure 3. Reset Delay vs Temperature

	0.2							1.8						VDD = 1.8 V
	0							1.6
(%)	−0.2
IT–							(V)	1.4
V	−0.4
in							OH
Change							V	1.2
	−0.6								TA = −40 °C
	−0.8							1	TA = 0°C
					TPS3839A09				TA = +25°C
					TPS3839K50				TA = +85°C
	−1	−15	10	35	60	85		0.8	0.5	1	1.5	2	2.5	3	3.5
	−40							0
			Temperature (°C)			G003					IOH (mA)				G004

Figure 4. Threshold Voltage vs Temperature

Figure 5. VOH vs IOH and Temperature for VDD = 1.8 V

3.5				VDD = 3.3 V			4					VDD =4.0 V
							3.5
2.5
(V)						(V)	3
OH						OH
V						V
1.5	TA = −40 °C							TA = −40 °C
							2.5
	TA = 0°C							TA = 0°C
	TA = +25°C							TA = +25°C
	TA = +85°C							TA = +85°C
0.5	2	4	6	8	10		2	2	4	6	8	10	12
0							0

IOH (mA)

G005

IOH (mA)

G006

Figure 6. VOH vs IOH and Temperature for VDD = 3.3 V

Figure 7. VOH vs IOH and Temperature for VDD = 4.0 V

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Typical Characteristics (continued)

At TA = 25°C and C1 = 0.1 µF, unless otherwise noted.
	1.6	TA = −40 °C						1.6	TA = −40 °C
	1.4	TA = 0°C						1.4	TA = 0°C
	1.2	TA = +25°C						1.2	TA = +25°C
		TA = +25°C							TA = +85°C
(V)	1						(V)	1
	0.8							0.8
OL							OL
V	0.6						V	0.6
	0.4							0.4
	0.2				VDD = 1.8 V			0.2				VDD = 3.3 V
	0	1	2	3	4	5		0	2	4	6	8	10
	0							0

IOL (mA)

G007

IOL (mA)

G008

Figure 8. VOL vs IOL and Temperature for VDD = 1.8 V

Figure 9. VOL vs IOL and Temperature for VDD = 3.3 V

	1.4	TA = −40 °C					(µs)	50
							Reset		Reset Occurs Above Line
		TA = +25°C
	1.2	TA = 0°C						45
(V)	1	TA = +85°C					Trigger	40
	0.8							35
V							Duration
								30
OL
	0.6
								25
							Pulse
	0.4							20
							Minimum
	0							10
	0.2							15
					VDD = 4.0 V
	0	2	4	6	8	10		0	5	10	15	20	25	30	35
				IOL (mA)		G009				VDD voltage drop below VIT−			(%)		G010

Figure 10. VOL vs IOL and Temperature for VDD = 4.0 V

Figure 11. Maximum Pulse Duration vs Percent of

Threshold Overdrive

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