Texas Instruments SN74AC241DBLE, SN74AC241DBR, SN74AC241DW, SN74AC241DWR, SN74AC241N Datasheet

						SN54AC241, SN74AC241
				OCTAL BUFFERS/DRIVERS
						WITH 3-STATE OUTPUTS
	SCAS513C ± JUNE 1995 ± REVISED SEPTEMBER 1996
D EPIC (Enhanced-Performance Implanted	SN54AC241 . . . J OR W PACKAGE
CMOS) 1- m Process	SN74AC241 . . . DB, DW, N, OR PW PACKAGE
D Package Options Include Plastic						(TOP VIEW)
Small-Outline (DW), Shrink Small-Outline
	1OE					1	20		VCC
(DB), and Thin Shrink Small-Outline (PW)
	1A1					2	19		2OE
Packages, Ceramic Chip Carriers (FK), Flat
	2Y4					3	18		1Y1
(W), and DIP (J, N) Packages
	1A2					4	17		2A4
description	2Y3					5	16		1Y2
	1A3					6	15		2A3
These octal buffers and line drivers are designed	2Y2					7	14		1Y3
specifically to improve the performance and	1A4					8	13		2A2
density of 3-state memory address drivers, clock	2Y1					9	12		1Y4
drivers, and bus-oriented receivers and	GND					10	11		2A1
transmitters.

The 'AC241 are organized as two 4-bit buffers/drivers with separate complementary output-enable (1OE and 2OE) inputs. When 1OE is low or 2OE is high, the device passes noninverted data from the A inputs to the Y

outputs. When 1OE is high or 2OE is low, the outputs are in the high-impedance state.

The SN54AC241 is characterized for operation over the full military temperature range of ±55°C to 125°C. The SN74AC241 is characterized for operation from ±40°C to 85°C.

SN54AC241 . . . FK PACKAGE

(TOP VIEW)

	2Y4	1A1	1OE	CC	2OE
				V
1A2	3	2	1	20 19		1Y1
	4				18
2Y3	5				17	2A4
1A3	6				16	1Y2
2Y2	7				15	2A3
1A4	8				14	1Y3
	9	10 11 12 13
	2Y1	GND	2A1	1Y4	2A2

FUNCTION TABLES

	INPUTS		OUTPUT
		1A	1Y
1OE
	L	H	H
	L	L	L
	H	X	Z

INPUTS		OUTPUT
2OE	2A	2Y
H	H	H
H	L	L
L	X	Z

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

EPIC is a trademark of Texas Instruments Incorporated.

UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 1996, Texas Instruments Incorporated

POST OFFICE BOX 655303 •DALLAS, TEXAS 75265

1

SN54AC241, SN74AC241

OCTAL BUFFERS/DRIVERS

WITH 3-STATE OUTPUTS

SCAS513C ± JUNE 1995 ± REVISED SEPTEMBER 1996

logic symbol²

			1						19
1OE				EN					2OE		EN
			2				18		11					9
1A1								1Y1	2A1						2Y1
			4				16		13					7
1A2								1Y2	2A2						2Y2
			6				14		15					5
1A3								1Y3	2A3						2Y3
			8				12		17					3
1A4								1Y4	2A4						2Y4

² This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.

logic diagram (positive logic)

1OE	1			19
				2OE
1A1	2	18	1Y1	11	9
				2A1	2Y1
1A2	4	16	1Y2	13	7
				2A2	2Y2
1A3	6	14	1Y3	15	5
				2A3	2Y3
1A4	8	12	1Y4	17	3
				2A4	2Y4

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)³

Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	. . . . . . . ±0.5 V to 7	V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	±0.5 V to VCC + 0.5	V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	±0.5 V to VCC + 0.5	V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	. . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	. . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	. . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	. . . . . . . . . . ±200 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DB package . . . . .	. . . . . . . . . . . . . 0.6 W
DW package . . . . .	. . . . . . . . . . . . . 1.6 W
N package . . . . . . .	. . . . . . . . . . . . . 1.3 W
PW package . . . . .	. . . . . . . . . . . . . 0.7 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .	. . . . ±65°C to 150°C

³Stresses beyond those listed under ªabsolute maximum ratingsº may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ªrecommended operating conditionsº is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

2.The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils, except for the N package, which has a trace length of zero.

2	POST OFFICE BOX 655303 •DALLAS, TEXAS 75265