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SN54ABT2244A, SN74ABT2244A |
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OCTAL BUFFERS AND LINE/MOS DRIVERS |
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WITH 3-STATE OUTPUTS |
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SCBS106E ± JANUARY 1991 ± REVISED MAY 1997 |
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D Output Ports Have Equivalent 25-Ω Series |
SN54ABT2244A . . . J OR W PACKAGE |
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Resistors, So No External Resistors Are |
SN74ABT2244A . . . DB, DW, N, OR PW PACKAGE |
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Required |
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(TOP VIEW) |
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D ESD Protection Exceeds 2000 V Per |
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1OE |
1 |
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20 |
VCC |
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MIL-STD-883, Method 3015; Exceeds 200 V |
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1A1 |
2 |
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19 |
2OE |
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Using Machine Model (C = 200 pF, R = 0) |
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2Y4 |
3 |
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18 |
1Y1 |
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D Latch-Up Performance Exceeds 500 mA Per |
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1A2 |
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17 |
2A4 |
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JEDEC Standard JESD-17 |
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2Y3 |
5 |
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16 |
1Y2 |
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D |
State-of-the-Art EPIC-ΙΙB BiCMOS Design |
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1A3 |
6 |
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15 |
2A3 |
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Significantly Reduces Power Dissipation |
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2Y2 |
7 |
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14 |
1Y3 |
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D Typical VOLP (Output Ground Bounce) < 1 V |
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1A4 |
8 |
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13 |
2A2 |
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2Y1 |
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1Y4 |
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at VCC = 5 V, TA = 25°C |
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9 |
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12 |
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D High-Impedance State During Power Up |
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GND |
10 |
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11 |
2A1 |
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and Power Down |
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D Package Options Include Plastic |
SN54ABT2244A . . . FK PACKAGE |
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Small-Outline (DW), Shrink Small-Outline |
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(TOP VIEW) |
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2Y4 |
1A1 |
1OE |
V |
2OE |
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(DB), and Thin Shrink Small-Outline (PW) |
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CC |
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Packages, Ceramic Chip Carriers (FK), |
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Plastic (N) and Ceramic (J) DIPs, and |
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3 |
2 |
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20 19 |
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Ceramic Flat (W) Packages |
1A2 |
1Y1 |
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4 |
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18 |
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description |
2Y3 |
5 |
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17 |
2A4 |
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1A3 |
6 |
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16 |
1Y2 |
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These octal buffers and line drivers are designed |
2Y2 |
7 |
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15 |
2A3 |
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1A4 |
8 |
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14 |
1Y3 |
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specifically to improve both the performance and |
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9 |
10 11 12 13 |
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density of 3-state memory address drivers, clock |
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2Y1 |
GND |
2A1 |
1Y4 |
2A2 |
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drivers, and bus-oriented receivers and |
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transmitters. Together with the SN54ABT2240, |
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SN74ABT2240A, and 'ABT2241, these devices |
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provide the choice of selected combinations of |
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inverting and noninverting outputs, symmetrical |
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active-low output-enable (OE) inputs, and |
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complementary OE and OE inputs. These devices |
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feature high fan-out and improved fan-in. |
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The outputs, which are designed to sink up to 12 mA, include equivalent 25-Ω series resistors to reduce |
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overshoot and undershoot. |
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When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 2.1 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT2244A is characterized for operation over the full military temperature range of ±55°C to 125°C. The SN74ABT2244A is characterized for operation from ±40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC-ΙΙB is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright 1997, Texas Instruments Incorporated
POST OFFICE BOX 655303 •DALLAS, TEXAS 75265 |
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SN54ABT2244A, SN74ABT2244A
OCTAL BUFFERS AND LINE/MOS DRIVERS
WITH 3-STATE OUTPUTS
SCBS106E ± JANUARY 1991 ± REVISED MAY 1997
FUNCTION TABLE (each buffer)
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INPUTS |
OUTPUT |
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A |
Y |
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OE |
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L |
H |
H |
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L |
L |
L |
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H |
X |
Z |
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logic symbol²
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1 |
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19 |
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1OE |
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EN |
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2OE |
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EN |
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2 |
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18 |
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11 |
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9 |
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1 |
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1 |
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1A1 |
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1Y1 |
2A1 |
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2Y1 |
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4 |
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16 |
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13 |
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7 |
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1A2 |
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1Y2 |
2A2 |
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2Y2 |
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6 |
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14 |
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15 |
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5 |
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1A3 |
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1Y3 |
2A3 |
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2Y3 |
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8 |
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12 |
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17 |
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3 |
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1A4 |
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1Y4 |
2A4 |
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2Y4 |
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² This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
logic diagram (positive logic)
1 |
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19 |
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1OE |
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2OE |
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2 |
18 |
11 |
9 |
1A1 |
1Y1 |
2A1 |
2Y1 |
4 |
16 |
13 |
7 |
1A2 |
1Y2 |
2A2 |
2Y2 |
6 |
14 |
15 |
5 |
1A3 |
1Y3 |
2A3 |
2Y3 |
8 |
12 |
17 |
3 |
1A4 |
1Y4 |
2A4 |
2Y4 |
2 |
POST OFFICE BOX 655303 •DALLAS, TEXAS 75265 |
SN54ABT2244A, SN74ABT2244A
OCTAL BUFFERS AND LINE/MOS DRIVERS
WITH 3-STATE OUTPUTS
SCBS106E ± JANUARY 1991 ± REVISED MAY 1997
schematic of Y outputs
VCC
Output
GND
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)²
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. ±0.5 V to 7 |
V |
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. ±0.5 V to 7 |
V |
Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . |
±0.5 V to 5.5 |
V |
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . . . . . 30 mA |
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Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . . . . ±18 mA |
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Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . . . . ±50 mA |
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Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . . . 115°C/W |
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DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . . . . 97°C/W |
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N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . . . . 67°C/W |
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PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . . . 128°C/W |
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Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
±65°C to 150°C |
²Stresses beyond those listed under ªabsolute maximum ratingsº may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ªrecommended operating conditionsº is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2.The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages, which use a trace length of zero.
POST OFFICE BOX 655303 •DALLAS, TEXAS 75265 |
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