Texas Instruments TLV5638QDR, TLV5638QD, TLV5638MJGB, TLV5638MFKB, TLV5638MJG Datasheet

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TLV5638

 

2.7 V TO 5.5 V LOW POWER DUAL 12-BIT DIGITAL-TO-ANALOG

 

CONVERTER WITH INTERNAL REFERENCE AND POWER DOWN

 

SLAS225A ± JUNE 1999 ± REVISED JANUARY 2000

 

 

 

features

D, JG PACKAGE

 

(TOP VIEW)

DDual 12-Bit Voltage Output DAC

D

Programmable Internal Reference

DIN

 

 

 

1

8

 

 

VDD

D

Programmable Settling Time:

SCLK

 

 

 

2

7

 

 

OUTB

 

1 s in Fast Mode,

 

CS

 

 

 

3

6

 

 

REF

 

3.5 s in Slow Mode

OUTA

 

 

 

4

5

 

 

AGND

DCompatible With TMS320 and SPI Serial

Ports

D Differential Nonlinearity <0.5 LSB Typ

 

 

 

FK PACKAGE

 

 

 

 

(TOP VIEW)

 

 

 

 

 

 

 

 

 

 

 

D

Monotonic Over Temperature

 

 

NC

DIN

NC

DD

NC

 

 

 

 

 

 

applications

 

 

V

 

 

 

 

 

 

 

 

 

 

 

 

 

3

2

1

20

19

 

 

Digital Servo Control Loops

 

 

 

D

NC

4

 

 

 

 

18

NC

D

Digital Offset and Gain Adjustment

SCLK

5

 

 

 

 

17

OUTB

D

Industrial Process Control

NC

6

 

 

 

 

16

NC

 

 

 

 

 

 

D Machine and Motion Control Devices

 

 

 

 

 

 

 

 

 

REF

 

CS

7

 

 

 

 

15

 

Mass Storage Devices

 

 

 

 

 

D

NC

8

 

 

 

 

14

NC

 

 

 

 

 

 

description

 

 

9

10

11

12

13

 

 

 

NC

OUTA

NC

 

 

 

NC

 

 

 

AGND

 

 

 

 

 

 

 

 

The TLV5638 is a dual 12-bit voltage output DAC with a flexible 3-wire serial interface. The serial interface allows glueless interface to TMS320 and

SPI , QSPI , and Microwire serial ports. It is programmed with a 16-bit serial string containing 4 control and 12 data bits.

The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer. The buffer features a Class AB output stage to improve stability and reduce settling time. The programmable settling time of the DAC allows the designer to optimize speed vs power dissipation. With its on-chip programmable precision voltage reference, the TLV5638 simplifies overall system design.

Because of its ability to source up to 1 mA, the reference can also be used as a system reference. Implemented with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It is available in an 8-pin SOIC package to reduce board space in standard commercial, industrial, and automotive temperature ranges. It is also available in JG and FK packages in the military temperature range.

AVAILABLE OPTIONS

 

 

PACKAGE

 

TA

 

 

 

SOIC

CERAMIC DIP

20 PAD LCCC

 

(D)

(JG)

(FK)

 

 

 

 

0°C to 70°C

TLV5638CD

Ð

Ð

 

 

 

 

±40°C to 85°C

TLV5638ID

Ð

Ð

 

 

 

 

±40°C to 125°C

TLV5638QD

Ð

Ð

TLV5638QDR

 

 

 

 

 

 

 

±55°C to 125°C

Ð

TLV5638MJG

TLV5638MFK

 

 

 

 

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

SPI and QSPI are trademarks of Motorola, Inc.

Microwire is a trademark of National Semiconductor Corporation.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 2000, Texas Instruments Incorporated

On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

1

Texas Instruments TLV5638QDR, TLV5638QD, TLV5638MJGB, TLV5638MFKB, TLV5638MJG Datasheet

TLV5638

2.7 V TO 5.5 V LOW POWER DUAL 12-BIT DIGITAL-TO-ANALOG CONVERTER WITH INTERNAL REFERENCE AND POWER DOWN

SLAS225A ± JUNE 1999 ± REVISED JANUARY 2000

functional block diagram

REF AGND VDD

 

 

 

PGA With

 

 

 

 

 

Output Enable

 

 

 

 

Voltage

 

 

 

 

 

Bandgap

 

 

 

 

Power-On

Power

 

 

 

 

and Speed

 

 

 

 

Reset

 

 

 

 

Control

 

 

 

 

 

 

 

 

 

 

2

 

 

 

 

 

2

 

 

 

 

 

2-Bit

 

 

 

 

 

Control

 

 

 

DIN

 

Latch

 

x2

OUTA

 

 

 

 

 

 

 

12

12-Bit

12

 

 

 

 

DAC A

 

 

SCLK

Serial

 

Latch

 

 

 

 

 

 

 

12

 

 

 

 

Interface

 

 

 

 

and

Buffer

 

 

 

CS

Control

 

 

 

 

 

 

 

 

 

12

12-Bit

12

 

 

 

 

 

 

 

 

 

DAC B

 

 

 

 

 

Latch

x2

OUTB

 

 

 

 

 

Terminal Functions

 

 

 

 

 

 

 

TERMINAL

I/O/P

DESCRIPTION

 

NAME

NO.

 

 

 

 

 

 

 

 

 

 

AGND

5

P

Ground

 

 

 

 

 

 

 

 

3

I

Chip select. Digital input active low, used to enable/disable inputs

 

CS

 

 

 

 

 

 

 

DIN

1

I

Digital serial data input

 

 

 

 

 

 

OUT A

4

O

DAC A analog voltage output

 

 

 

 

 

 

OUT B

7

O

DAC B analog voltage output

 

 

 

 

 

 

REF

6

I/O

Analog reference voltage input/output

 

 

 

 

 

 

SCLK

2

I

Digital serial clock input

 

 

 

 

 

 

VDD

8

P

Positive power supply

2

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

TLV5638 2.7 V TO 5.5 V LOW POWER DUAL 12-BIT DIGITAL-TO-ANALOG CONVERTER WITH INTERNAL REFERENCE AND POWER DOWN

SLAS225A ± JUNE 1999 ± REVISED JANUARY 2000

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)²

Supply voltage (VDD to AGND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . 7

V

Reference input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±0.3 V to VDD + 0.3

V

Digital input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±0.3 V to VDD + 0.3

V

Operating free-air temperature range, TA: TLV5638C . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . 0°C to 70°C

TLV5638I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . ±40°C to 85°C

TLV5638Q . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . ±40°C to 125°C

TLV5638M . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . ±55°C to 125°C

Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . ±65°C to 150°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . 260°C

²Stresses beyond those listed under ªabsolute maximum ratingsº may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ªrecommended operating conditionsº is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATING TABLE

PACKAGE

TA 25°C

DERATING FACTOR

TA = 70°C

TA = 85°C

TA = 125°C

POWER RATING

ABOVE T = 25°C³

POWER RATING

POWER RATING

POWER RATING

 

 

 

A

 

 

 

D

635 mW

5.08 mW/°C

407 mW

330 mW

127 mW

FK

1375 mW

11.00 mW/°C

880 mW

715 mW

275 mW

JG

1050 mW

8.40 mW/°C

672 mW

546 mW

210 mW

³This is the inverse of the traditional Junction-to-Ambient thermal Resistance (RΘJA). Thermal Resistances are not production tested and are for informational purposes only.

recommended operating conditions

 

 

MIN

NOM

MAX

UNIT

 

 

 

 

 

 

Supply voltage, VDD

VDD = 5 V

4.5

5

5.5

V

VDD = 3 V

2.7

3

3.3

V

 

Power on reset, POR

 

*0.55

 

*2

V

 

 

 

 

 

 

High-level digital input voltage, VIH

VDD = 2.7 V to 5.5 V

2

 

 

V

Low-level digital input voltage, VIL

VDD = 2.7 V to 5.5 V

 

 

0.8

V

Reference voltage, Vref to REF terminal

VDD = 5 V (see Note 1)

AGND

2.048

VDD ±1.5

V

Reference voltage, Vref to REF terminal

VDD = 3 V (see Note 1)

AGND

1.024

VDD ± 1.5

V

Load resistance, RL

 

2

 

 

Load capacitance, CL

 

 

 

100

pF

Clock frequency, fCLK

 

 

 

20

MHz

 

TLV5638C

0

 

70

 

 

 

 

 

 

 

Operating free-air temperature, TA

TLV5638I

±40

 

85

°C

 

 

 

 

TLV5638Q

±40

 

125

 

 

 

 

 

 

 

 

 

 

TLV5638M

±55

 

125

 

 

 

 

 

 

 

*This parameter is not tested for Q and M suffix devices.

NOTE 1: Due to the x2 output buffer, a reference input voltage ≥ (VDD±0.4 V)/2 causes clipping of the transfer function. The output buffer of the internal reference must be disabled, if an external reference is used.

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

3

TLV5638

2.7 V TO 5.5 V LOW POWER DUAL 12-BIT DIGITAL-TO-ANALOG CONVERTER WITH INTERNAL REFERENCE AND POWER DOWN

SLAS225A ± JUNE 1999 ± REVISED JANUARY 2000

electrical characteristics over recommended operating conditions, Vref = 2.048 V, Vref = 1.024 V (unless otherwise noted)

power supply

 

 

 

 

 

 

TLV5638C,

TLV5638Q,

 

 

 

PARAMETER

 

TEST CONDITIONS

 

 

TLV5638I

 

TLV5638M

 

UNIT

 

 

 

 

 

 

MIN

TYP

MAX

MIN TYP MAX

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VDD = 5 V,

Fast

 

4.3

5.2

4.3

5.4

mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Int. ref.

Slow

 

2.2

2.7

2.2

2.7

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

No load,

 

VDD = 3 V,

Fast

 

3.8

4.7

3.8

4.9

mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IDD

Power supply current

All inputs = AGND

Int. ref.

Slow

 

1.8

2.3

1.8

2.3

 

or VDD,

 

VDD = 5 V,

Fast

 

3.9

4.8

3.9

5.0

mA

 

 

 

 

 

 

DAC latch = 0x800

 

 

 

 

 

 

 

 

Ext. ref.

Slow

 

1.8

2.2

1.8

2.2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VDD = 3 V,

Fast

 

3.5

4.3

3.5

4.5

mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ext. ref.

Slow

 

1.5

1.9

1.5

1.9

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Power-down supply current

 

 

 

 

 

0.01

10

0.01

10

µA

 

 

 

 

 

 

 

 

 

 

PSRR

Power supply rejection ratio

Zero scale, See Note 2

 

 

±65

 

±65

 

dB

 

 

 

 

 

 

 

 

 

Full scale,

See Note 3

 

 

±65

 

±65

 

 

 

 

 

 

 

 

NOTES: 2. Power supply rejection ratio at zero scale is measured by varying VDD and is given by:

PSRR = 20 log [(EZS(VDDmax) ± EZS(VDDmin))/VDDmax]

3. Power supply rejection ratio at full scale is measured by varying VDD and is given by: PSRR = 20 log [(EG(VDDmax) ± EG(VDDmin))/VDDmax]

static DAC specifications

 

PARAMETER

TEST CONDITIONS

MIN TYP

MAX

UNIT

 

 

 

 

 

 

 

 

Resolution

 

 

12

 

bits

 

 

 

 

 

 

 

INL

Integral nonlinearity, end point adjusted

See Note 4

C and I suffixes

±1.7

±4

LSB

Q and M suffixes

±1.7

±6

LSB

 

 

 

 

 

 

 

 

 

 

DNL

Differential nonlinearity

See Note 5

±0.4

±1

LSB

EZS

Zero-scale error (offset error at zero scale)

See Note 6

 

±24

mV

EZS TC

Zero-scale-error temperature coefficient

See Note 7

10

 

ppm/°C

EG

Gain error

See Note 8

 

±0.6

% full

 

scale V

 

 

 

 

 

 

 

 

 

 

 

 

EG TC

Gain error temperature coefficient

See Note 9

10

 

ppm/°C

NOTES: 4. The relative accuracy or integral nonlinearity (INL) sometimes referred to as linearity error, is the maximum deviation of the output from the line between zero and full scale excluding the effects of zero code and full-scale errors. Tested from code 32 to 4095.

5.The differential nonlinearity (DNL) sometimes referred to as differential error, is the difference between the measured and ideal 1 LSB amplitude change of any two adjacent codes. Monotonic means the output voltage changes in the same direction (or remains constant) as a change in the digital input code.

6.Zero-scale error is the deviation from zero voltage output when the digital input code is zero.

7.Zero-scale-error temperature coefficient is given by: EZS TC = [EZS (Tmax) ± EZS (Tmin)]/Vref × 106/(Tmax ± Tmin).

8.Gain error is the deviation from the ideal output (2Vref ± 1 LSB) with an output load of 10 kΩ excluding the effects of the zero-error.

9.Gain temperature coefficient is given by: EG TC = [EG(Tmax) ± EG (Tmin)]/Vref × 106/(Tmax ± Tmin).

4

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

TLV5638 2.7 V TO 5.5 V LOW POWER DUAL 12-BIT DIGITAL-TO-ANALOG CONVERTER WITH INTERNAL REFERENCE AND POWER DOWN

SLAS225A ± JUNE 1999 ± REVISED JANUARY 2000

electrical characteristics over recommended operating conditions, Vref = 2.048 V, Vref = 1.024 V (unless otherwise noted) (continued)

output specifications

 

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

 

 

 

 

 

 

 

VO

Output voltage

RL = 10 kΩ

0

 

VDD±0.4

V

 

Output load regulation accuracy

VO = 4.096 V, 2.048 V, RL = 2 kΩ

 

 

± 0.25

% full

 

 

 

scale V

 

 

 

 

 

 

reference pin configured as output (REF)

 

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

 

 

 

 

 

 

 

Vref(OUTL)

Low reference voltage

 

1.003

1.024

1.045

V

Vref(OUTH)

High reference voltage

VDD > 4.75 V

2.027

2.048

2.069

V

Iref(source)

Output source current

 

 

 

1

mA

Iref(sink)

Output sink current

 

±1

 

 

mA

 

Load capacitance

 

 

 

100

pF

 

 

 

 

 

 

 

PSRR

Power supply rejection ratio

 

 

±65

 

dB

reference pin configured as input (REF)

 

PARAMETER

TEST CONDITIONS

MIN TYP

MAX

UNIT

 

 

 

 

 

 

 

VI

Input voltage

 

 

0

VDD±1.5

V

RI

Input resistance

 

 

10

 

CI

Input capacitance

 

 

5

 

pF

 

Reference input bandwidth

REF = 0.2 Vpp + 1.024 V dc

Fast

1.3

 

MHz

 

 

 

 

 

 

Slow

525

 

kHz

 

 

 

 

 

 

 

 

 

 

 

 

Reference feedthrough

REF = 1 Vpp at 1 kHz + 1.024 V dc (see Note 10)

± 80

 

dB

NOTE 10: Reference feedthrough is measured at the DAC output with an input code = 0x000.

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5

TLV5638

2.7 V TO 5.5 V LOW POWER DUAL 12-BIT DIGITAL-TO-ANALOG CONVERTER WITH INTERNAL REFERENCE AND POWER DOWN

SLAS225A ± JUNE 1999 ± REVISED JANUARY 2000

electrical characteristics over recommended operating conditions (unless otherwise noted) (Continued)

digital inputs

 

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

 

 

 

 

 

 

 

IIH

High-level digital input current

VI = VDD

 

 

1

µA

IIL

Low-level digital input current

VI = 0 V

±1

 

 

µA

Ci

Input capacitance

 

 

8

 

pF

analog output dynamic performance

 

PARAMETER

TEST CONDITIONS

 

MIN

TYP

MAX

UNIT

 

 

 

 

 

 

 

 

 

ts(FS)

Output settling time, full scale

RL = 10 kΩ,

CL = 100 pF,

Fast

 

1

3

µs

See Note 11

 

Slow

 

3.5

7

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ts(CC)

Output settling time, code to code

RL = 10 kΩ,

CL = 100 pF,

Fast

 

0.5

1.5

µs

See Note 12

 

Slow

 

1

2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SR

Slew rate

RL = 10 kΩ,

CL = 100 pF,

Fast

 

12

 

V/µs

 

 

 

 

Slow

 

1.8

 

 

 

See Note 13

 

 

 

 

 

 

 

 

 

 

 

 

 

Glitch energy

DIN = 0 to 1, FCLK = 100 kHz,

 

5

 

nV±s

 

CS = VDD

 

 

 

 

 

 

 

 

 

 

 

 

SNR

Signal-to-noise ratio

 

 

 

69

74

 

 

 

 

 

 

 

 

 

 

 

S/(N+D)

Signal-to-noise + distortion

fs = 480 kSPS,

fout = 1 kHz,

 

58

67

 

dB

THD

Total harmonic distortion

RL = 10 kΩ,

CL = 100 pF

 

 

±69

±57

 

 

 

 

Spurious free dynamic range

 

 

 

57

72

 

 

NOTES: 11. Settling time is the time for the output signal to remain within ± 0.5 LSB of the final measured value for a digital input code change of 0x020 to 0xFDF and 0xFDF to 0x020 respectively. Not tested, assured by design.

12.Settling time is the time for the output signal to remain within ± 0.5 LSB of the final measured value for a digital input code change of one count. Not tested, assured by design.

13.Slew rate determines the time it takes for a change of the DAC output from 10% to 90% full-scale voltage.

digital input timing requirements

 

 

 

 

 

 

MIN NOM MAX

UNIT

 

 

 

 

 

 

tsu(CS±CK)

Setup time,

 

low before first negative SCLK edge

10

ns

CS

t

Setup time, 16th negative SCLK edge (when D0 is sampled) before

 

rising edge

10

ns

CS

su(C16-CS)

 

 

 

 

 

 

 

twH

SCLK pulse width high

25

ns

twL

SCLK pulse width low

25

ns

tsu(D)

Setup time, data ready before SCLK falling edge

10

ns

th(D)

Hold time, data held valid after SCLK falling edge

5

ns

6

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