Texas Instruments TLV5625CD, TLV5625IDR, TLV5625ID, TLV5625CDR Datasheet

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TLV5625 2.7-V TO 5.5-V LOW-POWER DUAL 8-BIT DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN

SLAS233A ± JULY 1999 ± REVISED MARCH 2000

features

DDual 8-Bit Voltage Output DAC

DProgrammable Internal Reference

DProgrammable Settling Time

±2.5 s in Fast Mode

±12 s in Slow Mode

DCompatible With TMS320 and SPI Serial

Ports

DDifferential Nonlinearity <0.2 LSB Max

DMonotonic Over Temperature

description

The TLV5625 is a dual 8-bit voltage output DAC with a flexible 3-wire serial interface. The serial interface is compatible with TMS320, SPI , QSPI , and Microwire serial ports. It is programmed with a 16-bit serial string containing 4 control and 8 data bits.

applications

DDigital Servo Control Loops

DDigital Offset and Gain Adjustment

DIndustrial Process Control

DMachine and Motion Control Devices

DMass Storage Devices

D PACKAGE (TOP VIEW)

DIN

 

1

8

 

VDD

 

 

SCLK

 

 

 

 

 

2

7

 

OUTB

 

 

 

 

 

 

 

REF

 

CS

 

 

3

6

 

OUTA

 

4

5

 

AGND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

The resistor string output voltage is buffered by an x2 gain rail-to-rail output buffer. The buffer features a Class-AB output stage to improve stability and reduce settling time. The programmable settling time of the DAC allows the designer to optimize speed versus power dissipation.

Implemented with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It is available in an 8-pin SOIC package in standard commercial and industrial temperature ranges.

AVAILABLE OPTIONS

 

PACKAGE

TA

 

SOIC

 

(D)

 

 

0°C to 70°C

TLV5625CD

 

 

± 40°C to 85°C

TLV5625ID

 

 

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

SPI and QSPI are trademarks of Motorola, Inc.

Microwire is a trademark of National Semiconductor Corporation.

PRODUCT PREVIEW information concerns products in the formative or

Copyright 2000, Texas Instruments Incorporated

design phase of development. Characteristic data and other

 

specifications are design goals. Texas Instruments reserves the right to

 

change or discontinue these products without notice.

 

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

1

PRODUCT PREVIEW

Texas Instruments TLV5625CD, TLV5625IDR, TLV5625ID, TLV5625CDR Datasheet

TLV5625

2.7-V TO 5.5-V LOW-POWER DUAL 8-BIT DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN

SLAS233A ± JULY 1999 ± REVISED MARCH 2000

functional block diagram

REF AGND VDD

PRODUCT PREVIEW

Power-On

 

Power and

Reset

 

Speed Control

 

 

 

 

 

2

DIN

 

 

 

 

8

SCLK

Serial

 

 

8

 

Interface

 

and

Buffer

CS

Control

 

 

 

8

x2 OUTA

8-Bit

8

DAC A

 

 

Latch

 

 

 

8-Bit

8

 

 

 

DAC B

 

 

Latch

x2

OUTB

 

 

 

 

 

Terminal Functions

 

 

 

 

 

 

 

TERMINAL

I/O/P

DESCRIPTION

 

NAME

NO.

 

 

 

 

 

 

 

 

 

 

AGND

5

P

Ground

 

 

 

 

 

 

 

 

3

I

Chip select. Digital input active low, used to enable/disable inputs.

 

CS

 

 

 

 

 

 

 

DIN

1

I

Digital serial data input

 

 

 

 

 

 

OUTA

4

O

DAC A analog voltage output

 

 

 

 

 

 

OUTB

7

O

DAC B analog voltage output

 

 

 

 

 

 

REF

6

I

Analog reference voltage input

 

 

 

 

 

 

SCLK

2

I

Digital serial clock input

 

 

 

 

 

 

VDD

8

P

Positive power supply

2

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

TLV5625 2.7-V TO 5.5-V LOW-POWER DUAL 8-BIT DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN

SLAS233A ± JULY 1999 ± REVISED MARCH 2000

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)²

Supply voltage (VDD to AGND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . 7

V

Reference input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

± 0.3 V to VDD + 0.3

V

Digital input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

± 0.3 V to VDD + 0.3

V

Operating free-air temperature range, TA: TLV5625C . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . 0°C to 70°C

TLV5625I . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . ±40°C to 85°C

Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . ±65°C to 150°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . 260°C

²Stresses beyond those listed under ªabsolute maximum ratingsº may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ªrecommended operating conditionsº is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

recommended operating conditions

 

 

MIN

NOM

MAX

UNIT

 

 

 

 

 

 

Supply voltage, VDD

VDD = 5 V

4.5

5

5.5

V

VDD = 3 V

2.7

3

3.3

 

 

 

Power on reset, POR

 

0.55

 

2

V

 

 

 

 

 

 

High-level digital input voltage, VIH

VDD = 2.7 V to 5.5 V

2

 

 

V

Low-level digital input voltage, VIL

VDD = 2.7 V to 5.5 V

 

 

0.8

V

Reference voltage, Vref to REF terminal

VDD = 5 V (see Note 1)

AGND

2.048

VDD ±1.5

V

Reference voltage, Vref to REF terminal

VDD = 3 V (see Note 1)

AGND

1.024

VDD ± 1.5

V

Load resistance, RL

 

2

 

 

Load capacitance, CL

 

 

 

100

pF

Clock frequency, fCLK

 

 

 

20

MHz

Operating free-air temperature, TA

TLV5625C

0

 

70

°C

 

 

 

 

TLV5625I

±40

 

85

 

 

 

 

 

 

 

 

 

NOTE 1: Due to the x2 output buffer, a reference input voltage ≥ (VDD±0.4 V)/2 causes clipping of the transfer function.

PRODUCT PREVIEW

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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PRODUCT PREVIEW

TLV5625

2.7-V TO 5.5-V LOW-POWER DUAL 8-BIT DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN

SLAS233A ± JULY 1999 ± REVISED MARCH 2000

electrical characteristics over recommended operating conditions (unless otherwise noted)

power supply

 

PARAMETER

 

TEST CONDITIONS

 

MIN TYP

MAX

UNIT

 

 

 

 

 

 

 

 

IDD

Power supply current

No load,

All inputs = AGND or VDD,

Fast

1.8

2.3

mA

 

 

 

DAC latch

= 0x800

Slow

0.8

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Power-down supply current

 

 

 

1

3

µA

 

 

 

 

 

 

 

PSRR

Power supply rejection ratio

Zero scale, See Note 2

 

±65

 

dB

 

 

 

 

 

Full scale,

See Note 3

 

±65

 

 

 

 

 

 

NOTES: 2. Power supply rejection ratio at zero scale is measured by varying VDD and is given by:

PSRR = 20 log [(EZS(VDDmax) ± EZS(VDDmin)/VDDmax]

3. Power supply rejection ratio at full scale is measured by varying VDD and is given by: PSRR = 20 log [(EG(VDDmax) ± EG(VDDmin)/VDDmax]

static DAC specifications

 

PARAMETER

TEST CONDITIONS

MIN TYP

MAX

UNIT

 

 

 

 

 

 

 

Resolution

 

8

 

bits

 

 

 

 

 

 

INL

Integral nonlinearity

See Note 4

± 0.3

± 0.5

LSB

 

 

 

 

 

 

DNL

Differential nonlinearity

See Note 5

± 0.07

± 0.2

LSB

EZS

Zero-scale error (offset error at zero scale)

See Note 6

 

± 12

mV

EZS TC

Zero-scale-error temperature coefficient

See Note 7

10

 

ppm/°C

EG

Gain error

See Note 8

 

± 0.5

% full

 

scale V

 

 

 

 

 

 

 

 

 

 

 

EG TC

Gain-error temperature coefficient

See Note 9

10

 

ppm/°C

NOTES: 4. The relative accuracy of integral nonlinearity (INL), sometimes referred to as linearity error, is the maximum deviation of the output from the line between zero and full scale, excluding the effects of zero-code and full-scale errors.

5.The differential nonlinearity (DNL), sometimes referred to as differential error, is the difference between the measured and ideal 1-LSB amplitude change of any two adjacent codes.

6.Zero-scale error is the deviation from zero voltage output when the digital input code is zero.

7.Zero-scale error temperature coefficient is given by: EZS TC = [EZS (Tmax) ± EZS (Tmin)]/2Vref ×106/(Tmax ± Tmin).

8.Gain error is the deviation from the ideal output (2Vref ± 1 LSB) with an output load of 10 kΩ.

9.Gain temperature coefficient is given by: EG TC = [EG (Tmax) ± Eg (Tmin)]/2Vref ×106/(Tmax ± Tmin).

output specifications

 

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

 

 

 

 

 

 

 

VO

Output voltage range

RL = 10 kΩ

0

 

VDD±0.4

V

 

Output load regulation accuracy

VO = 4.096 V, 2.048 V RL = 2 kΩ

 

 

± 0.29

% FS

reference input

 

PARAMETER

TEST CONDITIONS

MIN TYP

MAX

UNIT

 

 

 

 

 

 

 

VI

Input voltage range

 

 

0

VDD±1.5

V

RI

Input resistance

 

 

10

 

CI

Input capacitance

 

 

5

 

pF

 

Reference input bandwidth

REF = 0.2 Vpp + 1.024 V dc

Fast

1.3

 

MHz

 

 

 

 

 

 

Slow

525

 

kHz

 

 

 

 

 

 

 

 

 

 

 

 

Reference feedthrough

REF = 1 Vpp at 1 kHz + 1.024 V dc (see Note 10)

± 80

 

dB

NOTE 10: Reference feedthrough is measured at the DAC output with an input code = 0x000.

4

POST OFFICE BOX 655303 DALLAS, TEXAS 75265

TLV5625 2.7-V TO 5.5-V LOW-POWER DUAL 8-BIT DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN

SLAS233A ± JULY 1999 ± REVISED MARCH 2000

electrical characteristics over recommended operating conditions (unless otherwise noted) (Continued)

digital inputs

 

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

 

 

 

 

 

 

 

IIH

High-level digital input current

VI = VDD

 

 

1

µA

IIL

Low-level digital input current

VI = 0 V

±1

 

 

µA

Ci

Input capacitance

 

 

8

 

pF

analog output dynamic performance

 

PARAMETER

TEST CONDITIONS

 

MIN

TYP

MAX

UNIT

 

 

 

 

 

 

 

 

 

ts(FS)

Output settling time, full scale

RL = 10 kΩ,

CL = 100 pF,

Fast

 

2.5

 

µs

See Note 11

 

Slow

 

12

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ts(CC)

Output settling time, code to code

RL = 10 kΩ,

CL = 100 pF,

Fast

 

1

 

µs

See Note 12

 

Slow

 

2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SR

Slew rate

RL = 10 kΩ,

CL = 100 pF,

Fast

 

3

 

V/µs

 

 

 

 

Slow

 

0.5

 

 

 

See Note 13

 

 

 

 

 

 

 

 

 

 

 

 

 

Glitch energy

DIN = 0 to 1, FCLK = 100 kHz,

 

5

 

nV±s

 

CS = VDD

 

 

 

 

 

 

 

 

 

 

 

 

SNR

Signal-to-noise ratio

 

 

 

52

54

 

 

 

 

 

 

 

 

 

 

 

SINAD

Signal-to-noise + distortion

fs = 102 kSPS,

fout = 1 kHz,

 

48

49

 

dB

THD

Total harmonic distortion

RL = 10 kΩ,

CL = 100 pF

 

 

±50

±48

 

 

 

SFDR

Spurious free dynamic range

 

 

 

48

50

 

 

NOTES: 11. Settling time is the time for the output signal to remain within ± 0.5 LSB of the final measured value for a digital input code change of 0x020 to 0xFDF and 0xFDF to 0x020 respectively. Not tested, assured by design.

12.Settling time is the time for the output signal to remain within ± 0.5 LSB of the final measured value for a digital input code change of one count. Not tested, assured by design.

13.Slew rate determines the time it takes for a change of the DAC output from 10% to 90% of full-scale voltage.

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