Fairchild Semiconductor 74F1071SCX, 74F1071SC, 74F1071MTCX, 74F1071MTC, 74F1071MSAX Datasheet

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Fairchild Semiconductor 74F1071SCX, 74F1071SC, 74F1071MTCX, 74F1071MTC, 74F1071MSAX Datasheet

October 1994

Revised August 1999

74F1071

18-Bit Undershoot/Overshoot Clamp and ESD Protection Device

General Description

The 74F1071 is an 18-bit undershoot/overshoot clamp which is designed to limit bus voltages and also to protect more sensitive devices from electrical overstress due to electrostatic discharge (ESD). The inputs of the device aggressively clamp voltage excursions nominally at 0.5V below and 7V above ground.

Features

18-bit array structure in 20-pin package

FASTâ Bipolar voltage clamping action

Dual center pin grounds for min inductance

Robust design for ESD protection

Low input capacitance

Optimum voltage clamping for 5V CMOS/TTL applications

Ordering Code:

Order Number

Package Number

Package Description

 

 

 

74F1071SC

M20B

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide

 

 

 

74F1071MSA

MSA20

20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide

 

 

 

74F1071MTC

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

 

 

 

Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Connection Diagram

Note: Simplified Component Representation

FASTâ is a registered trademark of Fairchild Semiconductor Corporation.

Clamp Undershoot/Overshoot Bit-18 74F1071

© 1999 Fairchild Semiconductor Corporation

DS011685

www.fairchildsemi.com

74F1071

Absolute Maximum Ratings(Note 1)

Storage Temperature

65°C to +150°C

Ambient Temperature under Bias

65°C to +125°C

Junction Temperature under Bias

65°C to +150°C

Input Voltage (Note 2)

0.5V to +6V

Input Current (Note 2)

200 mA to +50 mA

ESD (Note 3)

 

Human Body Model

 

(MIL-STD-883D method 3015.7)

±10 kV

IEC 801-2

±6 kV

Machine Model (EIAJIC-121-1981)

±2 kV

DC Latchup Source Current

 

(JEDEC Method 17)

±500 mA

Package Power Dissipation @+70°C

 

SOIC Package

800 mW

Recommended Operating

Conditions

Free Air Ambient Temperature

0°C to +70°C

Reverse Bias Voltage

0V to 5.25 VDC

Thermal Resistance (θJA in Free Air)

 

SOIC Package

100°C/W

SSOP Package

110°C/W

Note 1: Absolute maximum ratings are DC values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.

Note 2: Voltage ratings may be exceeded if current ratings and junction temperature and power consumption ratings are not exceeded.

Note 3: ESD Rating for Direct contact discharge using ESD Simulation Tester. Higher rating may be realized in the actual application.

DC Electrical Characteristics

Symbol

Parameter

 

TA = +25°C

 

TA = 0°C to +70°C

Units

Conditions

Min

Typ

Max

Min

Max

 

 

 

 

 

 

 

 

 

 

 

 

 

IIH

Input HIGH Current

 

1.5

10

 

50

μA

VIN = 5.25V; Untested Input @ GND

 

 

 

3

20

 

100

VIN = 5.5V; Untested Input @ GND

 

 

 

 

 

VZ

Reverse Voltage

6.6

6.9

7.2

5.9

7.7

V

IZ = 1 mA; Untested Inputs @ GND

 

 

 

7.1

7.5

 

8.0

IZ = 50 mA; Untested Inputs @ GND

 

 

 

 

 

VF

Forward Voltage

0.3

0.6

0.9

0.3

0.9

V

IF = −18 mA; Untested Inputs @ 5V

 

 

0.5

1.1

1.5

0.5

1.5

IF = −200 mA; Untested Inputs @ 5V

 

 

 

ICT

Adjacent Input Crosstalk

 

 

3

 

 

%

 

CIN

Input Capacitance

 

25

 

 

 

pF

VBIAS = 0 VDC

 

(small signal @ 1 MHz)

 

13

 

 

 

VBIAS = 5 VDC

 

 

 

 

 

 

www.fairchildsemi.com

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