Fairchild Semiconductor MM74HCT00SJ, MM74HCT00MX, MM74HCT00MTC, MM74HCT00CW, MM74HCT00SJX Datasheet

February 1984

Revised February 1999

MM74HCT00

Quad 2 Input NAND Gate

General Description

The MM74HCT00 is a NAND gates fabricated using advanced silicon-gate CMOS technology which provides the inherent benefits of CMOS—low quiescent power and wide power supply range. This device is input and output characteristic and pin-out compatible with standard 74LS logic families. All inputs are protected from static discharge damage by internal diodes to VCC and ground.

MM74HCT devices are intended to interface between TTL and NMOS components and standard CMOS devices.

These parts are also plug-in replacements for LS-TTL devices and can be used to reduce power consumption in existing designs.

Features

■TTL, LS pin-out and threshold compatible

■Fast switching: tPLH, tPHL=14 ns (typ)

■Low power: 10 μW at DC

■High fan out, 10 LS-TTL loads

Ordering Code:

Order Number	Package Number	Package Description
MM74HCT00M	M14A	14-Lead Small Outline Integrate Circuit (SOIC), JEDEC MS-120, 0.150” Narrow
MM74HCT00SJ	M14D	14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HCT00MTC	MTC14	14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HCT00N	N14A	14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide

Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Connection Diagram	Logic Diagram
Pin Assignments for DIP, SOIC, SOP and TSSOP	(1 of 4 gates)

Top View

Gate NAND Input 2 Quad MM74HCT00

© 1999 Fairchild Semiconductor Corporation

DS005356.prf

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MM74HCT00

Absolute Maximum Ratings(Note 1)

(Note 2)
Supply Voltage (VCC)	−0.5 to +7.0V
DC Input Voltage (VIN)	−1.5 to VCC+1.5V
DC Output Voltage (VOUT)	−0.5 to VCC+0.5V
Clamp Diode Current (IIK, IOK)	±20 mA
DC Output Current, per pin (IOUT)	±25 mA
DC VCC or GND Current, per pin (ICC)	±50 mA
Storage Temperature Range (TSTG)	−65°C to +150°C
Power Dissipation (PD)
(Note 3)	600 mW
S.O. Package only	500 mW
Lead Temperature (TL)	260°C
(Soldering 10 seconds)

Recommended Operating

Conditions

	Min	Max	Units
Supply Voltage (VCC)	4.5	5.5	V
DC Input or Output Voltage	0	VCC	V
(VIN, VOUT)	−40	+85	°C
Operating Temperature Range (TA)
Input Rise or Fall Times
(tr, tf)		500	ns

Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.

Note 2: Unless otherwise specified all voltages are referenced to ground.

Note 3: Power Dissipation temperature derating — plastic “N” package: − 12 mW/°C from 65°C to 85°C.

DC Electrical Characteristics

VCC = 5V ± 10% (unless otherwise specified)
Symbol	Parameter		Conditions	TA = 25°C		TA = −40 to 85°C	TA = -55 to 125°C	Units
				Typ		Guaranteed Limits
VIH	Minimum HIGH Level				2.0	2.0	2.0	V
	Input Voltage
VIL	Maximum LOW Level				0.8	0.8	0.8	V
	Input Voltage
VOH	Minimum HIGH Level		VIN = VIH or VIL
	Output Voltage		|IOUT| = 20 μA	VCC	VCC−0.1	VCC−0.1	VCC−0.1	V
			|IOUT| = 4.0 mA, VCC = 4.5V	4.2	3.98	3.84	3.7	V
			|IOUT| = 4.8 mA, VCC = 5.5V	5.2	4.98	4.84	4.7	V
VOL	Maximum LOW Level		VIN = VIH
	Voltage		|IOUT| = 20 μA	0	0.1	0.1	0.1	V
			|IOUT| = 4.0 mA, VCC = 4.5V	0.2	0.26	0.33	0.4	V
			|IOUT| = 4.8 mA, VCC = 5.5V	0.2	0.26	0.33	0.4	V
IIN	Maximum Input		VIN = VCC or GND,		±0.05	±0.5	±1.0	μA
	Current		VIH or VIL
ICC	Maximum Quiescent		VIN = VCC or GND,		1.0	10	40	μA
	Supply Current		IOUT = 0 μA
			VIN = 2.4V or 0.5V (Note 4)	0.18	0.3	0.4	0.5	mA

Note 4: This is measured per input with all other inputs held at VCC or ground.

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