September 1983
Revised February 1999
MM74HC138
3-to-8 Line Decoder
General Description
The MM74HC138 decoder utilizes advanced silicon-gate CMOS technology and is well suited to memory address decoding or data routing applications. The circuit features high noise immunity and low power consumption usually associated with CMOS circuitry, yet has speeds comparable to low power Schottky TTL logic.
The MM74HC138 has 3 binary select inputs (A, B, and C). If the device is enabled, these inputs determine which one of the eight normally HIGH outputs will go LOW. Two active LOW and one active HIGH enables (G1, G2A and G2B) are provided to ease the cascading of decoders.
The decoder’s outputs can drive 10 low power Schottky TTL equivalent loads, and are functionally and pin equivalent to the 74LS138. All inputs are protected from damage due to static discharge by diodes to VCC and ground.
Features
■Typical propagation delay: 20 ns
■Wide power supply range: 2V–6V
■Low quiescent current: 80 μA maximum (74HC Series)
■Low input current: 1 μA maximum
■Fanout of 10 LS-TTL loads
Ordering Code:
Order Number |
Package Number |
Package Description |
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MM74HC138M |
M16A |
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow |
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MM74HC138SJ |
M16D |
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide |
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MM74HC138MTC |
MTC16 |
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide |
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MM74HC138N |
N16E |
16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide |
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Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Connection Diagram
Pin Assignment for DIP, SOIC, SOP and TSSOP
Decoder Line 8-to-3 MM74HC138
© 1999 Fairchild Semiconductor Corporation |
DS005120.prf |
www.fairchildsemi.com |
MM74HC138
Truth Table
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Inputs |
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Outputs |
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Enable |
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Select |
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G1 |
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G2 (Note 1) |
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C |
B |
A |
Y0 |
Y1 |
Y2 |
Y3 |
Y4 |
Y5 |
Y6 |
Y7 |
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X |
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H |
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X |
X |
X |
H |
H |
H |
H |
H |
H |
H |
H |
L |
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X |
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X |
X |
X |
H |
H |
H |
H |
H |
H |
H |
H |
H |
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L |
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L |
L |
L |
L |
H |
H |
H |
H |
H |
H |
H |
H |
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L |
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L |
L |
H |
H |
L |
H |
H |
H |
H |
H |
H |
H |
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L |
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L |
H |
L |
H |
H |
L |
H |
H |
H |
H |
H |
H |
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L |
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L |
H |
H |
H |
H |
H |
L |
H |
H |
H |
H |
H |
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L |
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H |
L |
L |
H |
H |
H |
H |
L |
H |
H |
H |
H |
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L |
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H |
L |
H |
H |
H |
H |
H |
H |
L |
H |
H |
H |
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L |
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H |
H |
L |
H |
H |
H |
H |
H |
H |
L |
H |
H |
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L |
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H |
H |
H |
H |
H |
H |
H |
H |
H |
H |
L |
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H = HIGH Level, L = LOW Level, X = don’t care
Note 1: G2 = G2A+G2B
Logic Diagram
www.fairchildsemi.com |
2 |
DC Output Voltage (VOUT) |
− 0.5 to VCC + 0.5V |
DC Input or Output Voltage |
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0 |
V |
V |
MM74HC138 |
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Absolute Maximum Ratings(Note 2) |
Recommended Operating |
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(Note 3) |
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Conditions |
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Supply Voltage (VCC) |
− 0.5 to + 7.0V |
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Min |
Max |
Units |
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DC Input Voltage (VIN) |
− 1.5 to VCC + 1.5V |
Supply Voltage (VCC) |
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2 |
6 |
V |
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Clamp Diode Current (IIK, IOK) |
± 20 mA |
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CC |
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(V |
IN |
, V |
OUT |
) |
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DC Output Current, per pin (IOUT) |
± 25 mA |
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−40 |
+85 |
°C |
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Operating Temperature Range (TA) |
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DC VCC or GND Current, per pin (ICC) |
± 50 mA |
Input Rise or Fall Times |
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Storage Temperature Range (TSTG) |
− 65°C to + 150°C |
(t , t ) V |
CC |
= 2.0V |
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1000 |
ns |
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Power Dissipation (PD) |
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f |
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VCC = 4.5V |
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500 |
ns |
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(Note 4) |
600 mW |
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VCC = 6.0V |
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400 |
ns |
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S.O. Package only |
500 mW |
Note 2: Absolute Maximum Ratings are those values beyond which dam- |
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Lead Temperature (TL) |
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age to the device may occur. |
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260°C |
Note 3: Unless otherwise specified all voltages are referenced to ground. |
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(Soldering 10 seconds) |
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Note 4: Power Dissipation temperature derating — plastic “N” package: − |
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12 mW/°C from 65°C to 85°C. |
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DC Electrical Characteristics (Note 5) |
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Symbol |
Parameter |
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Conditions |
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VCC |
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TA = 25°C |
TA = −40 to 85°C |
Units |
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Typ |
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Guaranteed Limits |
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VIH |
Minimum HIGH Level |
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2.0V |
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1.5 |
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1.5 |
V |
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Input Voltage |
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4.5V |
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3.15 |
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3.15 |
V |
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6.0V |
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4.2 |
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4.2 |
V |
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VIL |
Maximum LOW Level |
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2.0V |
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0.5 |
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0.5 |
V |
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Input Voltage |
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4.5V |
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1.35 |
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1.35 |
V |
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6.0V |
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1.8 |
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1.8 |
V |
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VOH |
Minimum HIGH Level |
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VIN = VIH or VIL |
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Output Voltage |
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| IOUT | ≤ 20 μA |
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2.0V |
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2.0 |
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1.9 |
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1.9 |
V |
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4.5V |
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4.5 |
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4.4 |
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4.4 |
V |
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6.0V |
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6.0 |
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5.9 |
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5.9 |
V |
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VIN = VIH or VIL |
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|IOUT | ≤ 4.0 mA |
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4.5V |
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4.2 |
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3.98 |
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3.84 |
V |
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| IOUT | ≤ 5.2 mA |
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6.0V |
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5.7 |
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5.48 |
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5.34 |
V |
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VOL |
Maximum LOW Level |
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VIN = VIH or VIL |
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Output Voltage |
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| IOUT | ≤ 20 μA |
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2.0V |
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0 |
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0.1 |
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0.1 |
V |
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4.5V |
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0 |
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0.1 |
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0.1 |
V |
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6.0V |
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0 |
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0.1 |
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0.1 |
V |
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VIN = VIH or VIL |
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| IOUT | ≤ 4.0 mA |
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4.5V |
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0.2 |
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0.26 |
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0.33 |
V |
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| IOUT | ≤ 5.2 mA |
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6.0V |
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0.2 |
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0.26 |
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0.33 |
V |
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IIN |
Maximum Input |
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VIN = VCC or GND |
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6.0V |
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±0.1 |
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±1.0 |
μA |
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Current |
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ICC |
Maximum Quiescent |
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VIN = VCC or GND |
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6.0V |
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8.0 |
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80 |
μA |
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Supply Current |
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IOUT = 0 μA |
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Note 5: For |
a power supply of 5V ± 10% the worst |
case output voltages (VOH, and VOL) |
occur for HC |
at 4.5V. Thus the 4.5V values should be used when |
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designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage cur- |
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rent (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used. |
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3 |
www.fairchildsemi.com |