Fairchild Semiconductor MM74HCT245WMX, MM74HCT245N, MM74HCT245SJ, MM74HCT245MTC, MM74HCT245WM Datasheet

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February 1984

Revised February 1999

MM74HCT245

Octal 3-STATE Transceiver

General Description

The MM74HCT245 3-STATE bi-directional buffer utilizes advanced silicon-gate CMOS technology and is intended for two-way asynchronous communication between data buses. It has high drive current outputs which enable high speed operation even when driving large bus capacitances. This circuit possesses the low power consumption of CMOS circuitry, yet has speeds comparable to low power Schottky TTL circuits.

This device is TTL input compatible and can drive up to 15 LS-TTL loads, and all inputs are protected from damage due to static discharge by diodes to VCC and ground.

The MM74HCT245 has one active low enable input (G), and a direction control (DIR). When the DIR input is HIGH,

data flows from the A inputs to the B outputs. When DIR is LOW, data flows from B to A.

MM74HCT devices are intended to interface between TTL and NMOS components and standard CMOS devices. These parts are also plug-in replacements for LS-TTL devices and can be used to reduce power consumption in existing designs.

Features

TTL input compatible

3-STATE outputs for connection to system busses

High output drive current: 6 mA (min)

High speed: 16 ns typical propagation delay

Low power: 80 μA (74HCT Series)

Ordering Code:

Order Number

Package Number

Package Description

 

 

 

MM74HCT245WM

M20B

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide

 

 

 

MM74HCT245SJ

M20D

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

 

 

 

MM74HCT245MTC

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

 

 

 

MM74HCT245N

N20A

20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide

 

 

 

Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Connection Diagram

Truth Table

 

 

 

 

 

 

 

Pin Assignments for DIP, SOIC, SOP and TSSOP

 

 

Control

Operation

 

 

 

Inputs

 

 

 

 

 

 

 

 

 

 

 

 

 

DIR

245

 

 

 

G

 

 

 

 

 

 

 

 

 

L

L

B data to A bus

 

 

 

 

 

 

 

 

 

L

H

A data to B bus

 

 

 

 

 

 

 

 

 

H

X

isolation

 

H = HIGH Level

 

 

 

 

 

 

 

 

L = LOW Level

 

 

 

X = Irrelevant

 

 

Top View

Transceiver STATE-3 Octal MM74HCT245

© 1999 Fairchild Semiconductor Corporation

DS005366.prf

www.fairchildsemi.com

Fairchild Semiconductor MM74HCT245WMX, MM74HCT245N, MM74HCT245SJ, MM74HCT245MTC, MM74HCT245WM Datasheet

MM74HCT245

Logic Diagram

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2

Absolute Maximum Ratings(Note 1)

(Note 2)

 

Supply Voltage (VCC)

0.5 to +7.0V

DC Input Voltage (VIN)

1.5 to VCC +1.5V

DC Output Voltage (VOUT)

0.5 to VCC +0.5V

Clamp Diode Current (IIK, IOK)

±20 mA

DC Output Current,

±35 mA

DC VCC or GND Current, per pin (ICC)

±70 mA

Storage Temperature Range (TSTG)

65°C to +150°C

Power Dissipation (PD)

 

(Note 3)

600 mW

S.O. Package only

500 mW

Lead Temperature (TL)

260°C

(Soldering 10 seconds)

Recommended Operating

Conditions

 

Min

Max

Units

Supply Voltage (VCC)

4.5

5.5

V

DC Input or Output Voltage

 

 

 

(VIN, VOUT)

0

VCC

V

Operating Temperature Range (TA)

40

+85

°C

Input Rise or Fall Times

 

 

 

(tr, tf)

 

500

ns

Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.

Note 2: Unless otherwise specified all voltages are referenced to ground.

Note 3: Power Dissipation temperature derating — plastic “N” package: 12 mW/°C from 65°C to 85°C.

DC Electrical Characteristics

(VCC = 5V ± 10%, unless otherwise specified.)

 

 

 

 

 

Symbol

Parameter

 

 

Conditions

TA = 25°C

TA = −40 to 85°C

TA = −55 to 125°C

Units

 

 

 

 

 

Typ

 

Guaranteed Limits

 

 

 

 

 

 

 

 

 

 

 

VIH

Minimum HIGH Level

 

 

 

 

2.0

2.0

2.0

V

 

Input Voltage

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VIL

Maximum LOW Level

 

 

 

 

0.8

0.8

0.8

V

 

Input Voltage

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VOH

Minimum HIGH Level

 

VIN = VIH or VIL

 

 

 

 

 

 

Output Voltage

|IOUT| = 20 μA

VCC

VCC0.1

VCC0.1

VCC0.1

V

 

 

 

|IOUT| = 6.0 mA, VCC = 4.5V

4.2

3.98

3.84

3.7

V

 

 

 

|IOUT| = 7.2 mA, VCC = 5.5V

5.2

4.98

4.84

4.7

V

VOL

Maximum LOW Level

 

VIN = VIH or VIL

 

 

 

 

 

 

Voltage

|IOUT| = 20 μA

0

0.1

0.1

0.1

V

 

 

 

|IOUT| = 6.0 mA, VCC = 4.5V

0.2

0.26

0.33

0.4

V

 

 

 

|IOUT| = 7.2 mA, VCC = 5.5V

0.2

0.26

0.33

0.4

V

IIN

Maximum Input

 

VIN = VCC or GND,

 

±0.1

±1.0

±1.0

μA

 

Current

 

VIH or VIL, Pin 1 or 19

 

 

 

 

 

IOZ

Maximum 3-STATE

 

VOUT = VCC or GND

 

±0.5

±5.0

±10

μA

 

Output Leakage

 

 

= VIH

 

 

 

 

 

 

 

G

 

 

 

 

 

 

Current

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ICC

Maximum Quiescent

 

VIN = VCC or GND

 

8

80

160

μA

 

Supply Current

 

IOUT = 0 μA

 

 

 

 

 

 

 

 

VIN = 2.4V or 0.5V (Note 4)

0.6

1.0

1.3

1.5

mA

Note 4: Measured per input. All other inputs at VCC or ground.

MM74HCT245

3

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