Fairchild Semiconductor MM74HC175N, MM74HC175SJ, MM74HC175SJX, MM74HC175MTC, MM74HC175MTCX Datasheet
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September 1983
Revised February 1999
MM74HC175
Quad D-Type Flip-Flop With Clear
General Description
The MM74HC175 high speed D-type flip-flop with complementary outputs utilizes advanced silicon-gate CMOS technology to achieve the high noise immunity and low power consumption of standard CMOS integrated circuits, along with the ability to drive 10 LS-TTL loads.
Information at the D inputs of the MM74HC175 is transferred to the Q and Q outputs on the positive going edge of the clock pulse. Both true and complement outputs from each flip flop are externally available. All four flip-flops are controlled by a common clock and a common CLEAR. Clearing is accomplished by a negative pulse at the CLEAR input. All four Q outputs are cleared to a logical “0” and all four Q outputs to a logical “1.”
The 74HC logic family is functionally as well as pin-out compatible with the standard 74LS logic family. All inputs are protected from damage due to static discharge by internal diode clamps to VCC and ground.
Features
■Typical propagation delay: 15 ns
■Wide operating supply voltage range: 2–6V
■Low input current: 1 μA maximum
■Low quiescent supply current: 80 μA maximum (74HC)
■High output drive current: 4 mA minimum (74HC)
Ordering Code:
Order Number |
Package Number |
Package Description |
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MM74HC175M |
M16A |
16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150” Narrow |
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MM74HC175SJ |
M16D |
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide |
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MM74HC175MTC |
MTC16 |
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide |
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MM74HC175N |
N16E |
16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide |
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Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagram
Pin Assignments for DIP, SOIC, SOP and TSSOP
Truth Table
(Each Flip-Flop)
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Inputs |
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Outputs |
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Clear |
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Clock |
D |
Q |
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Q |
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L |
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X |
X |
L |
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H |
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H |
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− |
H |
H |
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L |
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H |
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− |
L |
L |
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H |
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H |
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L |
X |
Q0 |
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Q |
0 |
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H = HIGH Level (steady state) L = LOW Level (steady state) X = Irrelevant
− = Transition from LOW-to-HIGH level
Q0 = The level of Q before the indicated steady-state input conditions were established
Top View
Clear With Flop-Flip Type-D Quad MM74HC175
© 1999 Fairchild Semiconductor Corporation |
DS005319.prf |
www.fairchildsemi.com |
MM74HC175
Logic Diagram
www.fairchildsemi.com |
2 |
Absolute Maximum Ratings(Note 1)
(Note 2) |
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Supply Voltage (VCC) |
−0.5 to +7.0V |
DC Input Voltage (VIN) |
−1.5 to VCC +1.5V |
DC Output Voltage (VOUT) |
−0.5 to VCC +0.5V |
Clamp Diode Current (IIK, IOK) |
±20 mA |
DC Output Current, per pin (IOUT) |
±25 mA |
DC VCC or GND Current, per pin (ICC) |
±50 mA |
Storage Temperature Range (TSTG) |
−65°C to +150°C |
Power Dissipation (PD) |
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(Note 3) |
600 mW |
S.O. Package only |
500 mW |
Lead Temperature (TL) |
260°C |
(Soldering 10 seconds) |
Recommended Operating
Conditions
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Min |
Max |
Units |
Supply Voltage (VCC) |
2 |
6 |
V |
DC Input or Output Voltage |
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(VIN,VOUT) |
0 |
VCC |
V |
Operating Temperature Range (TA) |
−40 |
+85 |
°C |
Input Rise or Fall Times |
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(tr, tf) VCC = 2.0V |
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1000 |
ns |
VCC = 4.5V |
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500 |
ns |
VCC = 6.0V |
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400 |
ns |
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating — plastic “N” package: − 12 mW/°C from 65°C to 85°C.
DC Electrical Characteristics |
(Note 4) |
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Symbol |
Parameter |
Conditions |
VCC |
TA = 25°C |
TA = −40 to 85°C |
TA = −55 to 125°C |
Units |
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Typ |
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Guaranteed Limits |
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VIH |
Minimum HIGH Level |
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2.0V |
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1.5 |
1.5 |
1.5 |
V |
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Input Voltage |
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4.5V |
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3.15 |
3.15 |
3.15 |
V |
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6.0V |
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4.2 |
4.2 |
4.2 |
V |
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VIL |
Maximum LOW Level |
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2.0V |
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0.5 |
0.5 |
0.5 |
V |
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Input Voltage |
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4.5V |
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1.35 |
1.35 |
1.35 |
V |
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6.0V |
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1.8 |
1.8 |
1.8 |
V |
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VOH |
Minimum HIGH Level |
VIN = VIH or VIL |
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Output Voltage |
|IOUT| ≤ 20 μA |
2.0V |
2.0 |
1.9 |
1.9 |
1.9 |
V |
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4.5V |
4.5 |
4.4 |
4.4 |
4.4 |
V |
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6.0V |
6.0 |
5.9 |
5.9 |
5.9 |
V |
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VIN = VIH or VIL |
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|IOUT| ≤ 4.0 mA |
4.5V |
4.2 |
3.98 |
3.84 |
3.7 |
V |
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|IOUT| ≤ 5.2 mA |
6.0V |
5.7 |
5.48 |
5.34 |
5.2 |
V |
VOL |
Maximum LOW Level |
VIN = VIH or VIL |
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Output Voltage |
|IOUT| ≤ 20 μA |
2.0V |
0 |
0.1 |
0.1 |
0.1 |
V |
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4.5V |
0 |
0.1 |
0.1 |
0.1 |
V |
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6.0V |
0 |
0.1 |
0.1 |
0.1 |
V |
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VIN = VIH or VIL |
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|IOUT| ≤ 4.0 mA |
4.5V |
0.2 |
0.26 |
0.33 |
0.4 |
V |
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|IOUT| ≤ 5.2 mA |
6.0V |
0.2 |
0.26 |
0.33 |
0.4 |
V |
IIN |
Maximum Input |
VIN = VCC or GND |
6.0V |
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±0.1 |
±1.0 |
±1.0 |
μA |
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Current |
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ICC |
Maximum Quiescent |
VIN = VCC or GND |
6.0V |
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8 |
80 |
160 |
μA |
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Supply Current |
IOUT = 0 μA |
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Note 4: For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
MM74HC175
3 |
www.fairchildsemi.com |
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