Fairchild Semiconductor 74ABT16543CMTD, 74ABT16543CSSCX, 74ABT16543CSSC, 74ABT16543CMTDX Datasheet

0 (0)

October 1993

Revised January 1999

74ABT16543

16-Bit Registered Transceiver with 3-STATE Outputs

General Description

The ABT16543 16-bit transceiver contains two sets of D- type latches for temporary storage of data flowing in either direction. Separate Latch Enable and Output Enable inputs are provided for each register to permit independent control of inputting and outputting in either direction of data flow. Each byte has separate control inputs, which can be shorted together for full 16-bit operation.

Features

Back-to-back registers for storage

Bidirectional data path

A and B outputs have current sourcing capability of 32 mA and current sinking capability of 64 mA

Separate control logic for each byte

16-bit version of the ABT543

Separate controls for data flow in each direction

Guaranteed latchup protection

High impedance glitch free bus loading during entire power up and power down cycle

Nondestructive hot insertion capability

Ordering Code:

Order Number

Package Number

Package Description

 

 

 

74ABT16543CSSC

MS56A

56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300” Wide

 

 

 

74ABT16543CMTD

MTD56

56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide

 

 

 

Devices also available on Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Connection Diagram

Pin Descriptions

 

 

 

 

 

Pin Assignment for SSOP and TSSOP

 

 

Pin Names

Description

 

 

 

 

 

 

 

 

 

 

 

 

 

 

n

A-to-B Output Enable Input (Active LOW)

 

 

 

OEAB

 

 

 

 

 

 

n

B-to-A Output Enable Input (Active LOW)

 

 

 

OEBA

 

 

 

 

 

n

A-to-B Enable Input (Active LOW)

 

 

 

CEAB

 

 

 

 

 

n

B-to-A Enable Input (Active LOW)

 

 

 

CEBA

 

 

 

 

n

A-to-B Latch Enable Input (Active LOW)

 

 

 

LEAB

 

 

 

 

n

B-to-A Latch Enable Input (Active LOW)

 

 

 

LEBA

 

 

 

A0–A15

A-to-B Data Inputs or

 

 

 

 

 

 

 

B-to-A 3-STATE Outputs

 

 

 

B0–B15

B-to-A Data Inputs or

 

 

 

 

 

 

 

A-to-B 3-STATE Outputs

 

 

 

 

 

 

 

 

Outputs STATE-3 with Transceiver Registered Bit-16 74ABT16543

© 1999 Fairchild Semiconductor Corporation

DS011646.prf

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Fairchild Semiconductor 74ABT16543CMTD, 74ABT16543CSSCX, 74ABT16543CSSC, 74ABT16543CMTDX Datasheet

74ABT16543

Logic Symbol

Functional Description

The ABT16543 contains two sets of D-type latches, with separate input and output controls for each. For data flow from A to B, for example, the A to B Enable (CEAB) input must be low in order to enter data from the A port or take data from the B-Port as indicated in the Data I/O Control Table. With CEAB low, a low signal on (LEAB) input makes the A to B latches transparent; a subsequent low to high transition of the LEAB line puts the A latches in the storage

Logic Diagrams

Byte 1 (0:7)

Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

Data I/O Control Table

 

 

 

Inputs

 

 

Latch Status

Output Buffers

 

 

 

 

 

 

 

 

 

 

 

n

 

n

 

n

 

 

 

CEAB

LEAB

OEAB

(Byte n)

(Byte n)

 

 

 

 

 

 

 

 

H

 

X

X

Latched

HIGH Z

 

X

 

H

X

Latched

 

L

 

L

X

Transparent

 

X

 

X

H

HIGH Z

 

L

 

X

L

Driving

 

 

 

 

 

 

 

 

 

H = HIGH Voltage Level

L = LOW Voltage Level X = Immaterial

A-to-B data flow shown;

B-to-A flow control is the same, except using CEBAn, LEBAn and OEBAn

mode and their outputs no longer change with the A inputs. With CEAB and OEAB both low, the B output buffers are active and reflect the data present on the output of the A latches. Control of data flow from B to A is similar, but using the CEBA, LEBA and OEBA. Each byte has separate control inputs, allowing the device to be used as two 8-bit transceivers or as one 16-bit transceiver.

Byte 2 (8:15)

Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

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2

Absolute Maximum Ratings(Note 1)

Storage Temperature

65°C to +150°C

Ambient Temperature under Bias

55°C to +125°C

Junction Temperature under Bias

55°C to +150°C

VCC Pin Potential to

0.5V to +7.0V

Ground Pin

Input Voltage (Note 2)

0.5V to +7.0V

Input Current (Note 2)

30 mA to +5.0 mA

Voltage Applied to Any Output

 

in the Disable or

 

Power-Off State

0.5V to +5.5V

in the HIGH State

0.5V to VCC

Current Applied to Output

 

in LOW State (Max)

twice the rated IOL (mA)

DC Latchup Source Current

500 mA

Over Voltage Latchup (I/O)

10V

Recommended Operating

Conditions

Free Air Ambient Temperature

40°C to +85°C

Supply Voltage

+4.5V to +5.5V

Minimum Input Edge Rate ( V/

t)

Data Input

50 mV/ns

Enable Input

20 mV/ns

Clock Input

100 mV/ns

Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.

Note 2: Either voltage limit or current limit is sufficient to protect inputs.

DC Electrical Characteristics

Symbol

Parameter

 

Min

Typ

Max

Units

VCC

 

 

 

 

 

 

Conditions

 

 

 

 

 

 

 

 

 

 

VIH

Input HIGH Voltage

 

2.0

 

 

V

 

 

Recognized HIGH Signal

VIL

Input LOW Voltage

 

 

 

0.8

V

 

Recognized LOW Signal

VCD

Input Clamp Diode Voltage

 

 

1.2

V

Min

 

IIN = −18 mA (Non I/O Pins)

VOH

Output HIGH Voltage

 

2.5

 

 

 

 

 

IOH = −3 mA, (An, Bn)

 

 

 

2.0

 

 

 

 

 

IOH = −32 mA, (An, Bn)

VOL

Output LOW Voltage

 

 

 

0.55

V

Min

IOL = 64 mA, (An, Bn)

VID

Input Leakage Test

 

4.75

 

 

V

0.0

 

IID = 1.9 μA, (Non-I/O Pins)

 

 

 

 

 

 

 

 

 

All Other Pins Grounded

 

 

 

 

 

 

 

 

 

 

IIH

Input HIGH Current

 

 

 

1

μA

Max

 

VIN = 2.7V (Non-I/O Pins) ((Note 3)

 

 

 

 

 

1

 

 

 

VIN = VCC (Non-I/O Pins)

IBVI

Input HIGH Current Breakdown Test

 

 

7

μA

Max

 

VIN = 7.0V (Non-I/O Pins)

IBVIT

Input HIGH Current

 

 

 

100

μA

Max

 

VIN = 5.5V (An, Bn)

 

Breakdown Test (I/O)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IIL

Input LOW Current

 

 

 

1

μA

Max

 

VIN = 0.5V (Non-I/O Pins) (Note 3)

 

 

 

 

 

1

 

 

 

VIN = 0.0V (Non-I/O Pins)

IIH + IOZH

Output Leakage Current

 

 

 

10

μA

0V–5.5V

 

VOUT = 2.7V (An, Bn);

 

 

 

 

 

 

 

 

 

 

 

or

 

 

= 2V

 

 

 

 

 

 

 

 

 

OEAB

CEAB

 

 

 

 

 

 

 

 

 

 

IIL + IOZL

Output Leakage Current

 

 

 

10

μA

0V–5.5V

 

VOUT = 0.5V (An, Bn);

 

 

 

 

 

 

 

 

 

 

 

or

 

 

= 2V

 

 

 

 

 

 

 

 

 

OEAB

CEAB

 

 

 

 

 

 

 

 

 

IOS

Output Short-Circuit Current

100

 

275

mA

Max

 

VOUT = 0V (An, Bn)

ICEX

Output HIGH Leakage Current

 

 

50

μA

Max

 

VOUT = VCC (An, Bn)

IZZ

Bus Drainage Test

 

 

 

100

μA

0.0V

 

VOUT = 5.5V (An, Bn); All Others GND

ICCH

Power Supply Current

 

 

 

1.0

mA

Max

All Outputs HIGH

ICCL

Power Supply Current

 

 

 

60

mA

Max

All Outputs LOW

ICCZ

Power Supply Current

 

 

 

1.0

mA

Max

Outputs 3-STATE

 

 

 

 

 

 

 

 

 

All Others at VCC or GND

ICCT

Additional ICC/Input

 

 

 

2.5

mA

Max

VI = VCC 2.1V

 

 

 

 

 

 

 

 

 

All Others at VCC or GND

ICCD

Dynamic ICC

No Load

 

 

 

 

 

 

Outputs Open,

 

 

 

 

 

 

= GND,

 

 

 

 

 

 

CEAB,

OEAB,

LEAB

 

(Note 3)

 

 

 

0.25

mA/MHz

Max

 

 

= VCC, One Bit Toggling,

 

 

 

 

 

CEBA

 

 

 

 

 

 

 

 

 

50% Duty Cycle

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Note 3: Guaranteed but not tested.

74ABT16543

3

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