September 1983
Revised February 1999
MM74HC125/MM74HC126
3-STATE Quad Buffers
General Description
The MM74HC125 and MM74HC126 are general purpose 3-STATE high speed non-inverting buffers utilizing advanced silicon-gate CMOS technology. They have high drive current outputs which enable high speed operation even when driving large bus capacitances. These circuits possess the low power dissipation of CMOS circuitry, yet have speeds comparable to low power Schottky TTL circuits. Both circuits are capable of driving up to 15 low power Schottky inputs.
The MM74HC125 require the 3-STATE control input C to be taken high to put the output into the high impedance
condition, whereas the MM74HC126 require the control input to be low to put the output into high impedance.
All inputs are protected from damage due to static discharge by diodes to VCC and ground.
Features
■Typical propagation delay: 13 ns
■Wide operating voltage range: 2–6V
■Low input current: 1 μA maximum
■Low quiescent current: 80 μA maximum (74HC)
■Fanout of 15 LS-TTL loads
Ordering Code:
Order Number |
Package Number |
Package Description |
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MM74HC125M |
M14A |
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150” Narrow Body |
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MM74HC125SJ |
M14D |
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide |
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MM74HC125MTC |
MTC14 |
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide |
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MM74HC125N |
N14A |
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide |
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MM74HC126M |
M14A |
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150” Narrow Body |
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MM74HC126SJ |
M14D |
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide |
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MM74HC126MTC |
MTC14 |
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide |
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MM74HC126N |
N14A |
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide |
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Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. (Tape and Reel not available in N14A.)
Connection Diagrams
Pin Assignments for DIP, SOIC, SOP and TSSOP
Top View (MM74HC125) |
Top View (MM74HC126) |
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Truth Tables
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Inputs |
Output |
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Inputs |
Output |
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Y |
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Y |
A |
C |
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A |
C |
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H |
L |
H |
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H |
H |
H |
L |
L |
L |
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L |
H |
L |
X |
H |
Z |
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X |
L |
Z |
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Buffers Quad STATE-3 MM74HC125/MM74HC126
© 1999 Fairchild Semiconductor Corporation |
DS005308.prf |
www.fairchildsemi.com |
MM74HC125/MM74HC126
Absolute Maximum Ratings(Note 1)
(Note 2) |
|
Supply Voltage (VCC) |
−0.5 to +7.0V |
DC Input Voltage (VIN) |
−1.5 to VCC +1.5V |
DC Output Voltage (VOUT) |
−0.5 to VCC +0.5V |
Clamp Diode Current (IIK, IOK) |
±20 mA |
DC Output Current, per pin (IOUT) |
±35 mA |
DC VCC or GND Current, per pin |
±70 mA |
(ICC) |
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Storage Temperature Range (TSTG) |
−65°C to +150°C |
Power Dissipation (PD) |
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(Note 3) |
600 mW |
S.O. Package only |
500 mW |
Lead Temperature (TL) |
260°C |
(Soldering 10 seconds) |
DC Electrical Characteristics (Note 4)
Recommended Operating
Conditions
|
Min |
Max |
Units |
Supply Voltage (VCC) |
2 |
6 |
V |
DC Input or Output Voltage |
0 |
VCC |
V |
(VIN, VOUT) |
−40 |
+85 |
°C |
Operating Temperature Range (TA) |
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Input Rise or Fall Times (tr, tf) |
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VCC = 2.0V |
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1000 |
ns |
VCC = 4.5V |
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500 |
ns |
VCC = 6.0V |
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400 |
ns |
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating — plastic “N” package: − 12 mW/°C from 65°C to 85°C.
Symbol |
Parameter |
Conditions |
VCC |
TA = 25°C |
TA = −40 to 85°C |
TA = −40 to 125°C |
Units |
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Typ |
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Guaranteed Limits |
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VIH |
Minimum HIGH Level |
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2.0V |
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1.5 |
1.5 |
1.5 |
V |
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Input Voltage |
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4.5V |
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3.15 |
3.15 |
3.15 |
V |
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6.0V |
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4.2 |
4.2 |
4.2 |
V |
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VIL |
Maximum LOW Level |
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2.0V |
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0.5 |
0.5 |
0.5 |
V |
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Input Voltage |
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4.5V |
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1.35 |
1.35 |
1.35 |
V |
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6.0V |
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1.8 |
1.8 |
1.8 |
V |
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VOH |
Minimum HIGH Level |
VIN = VIH or VIL |
2.0V |
2.0 |
1.9 |
1.9 |
1.9 |
V |
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Output Voltage |
|IOUT| ≤ 20 μA |
4.5V |
4.5 |
4.4 |
4.4 |
4.4 |
V |
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6.0V |
6.0 |
5.9 |
5.9 |
5.9 |
V |
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VIN = VIH or VIL |
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|IOUT| ≤ 6.0 mA |
4.5V |
4.2 |
3.98 |
3.84 |
3.7 |
V |
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|IOUT| ≤ 7.8 mA |
6.0V |
5.7 |
5.48 |
5.34 |
5.2 |
V |
VOL |
Maximum LOW Level |
VIN = VIH or VIL |
2.0V |
0 |
0.1 |
0.1 |
0.1 |
V |
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Output Voltage |
|IOUT| ≤ 20 μA |
4.5V |
0 |
0.1 |
0.1 |
0.1 |
V |
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6.0V |
0 |
0.1 |
0.1 |
0.1 |
V |
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VIN = VIH or VIL |
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|IOUT| ≤ 6.0 mA |
4.5V |
0.2 |
0.26 |
0.33 |
0.4 |
V |
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|IOUT| ≤ 7.8 mA |
6.0V |
0.2 |
0.26 |
0.33 |
0.4 |
V |
IOZ |
Maximum 3-STATE Output |
VIN = VIH or VIL |
6.0V |
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±0.5 |
±5 |
±10 |
μA |
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Leakage Current |
VOUT = VCC or GND |
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Cn = Disabled |
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IIN |
Maximum Input Current |
VIN = VCC or GND |
6.0V |
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±0.1 |
±1.0 |
±1.0 |
μA |
ICC |
Maximum Quiescent |
VIN = VCC or GND |
6.0V |
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8.0 |
80 |
160 |
μA |
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Supply Current |
IOUT = 0 μA |
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Note 4: For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC=5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
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