MOTOROLA MC74HC139AN, MC74HC139AF, MC74HC139AFEL, MC74HC139AFL1, MC74HC139AFL2 Datasheet

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MOTOROLA MC74HC139AN, MC74HC139AF, MC74HC139AFEL, MC74HC139AFL1, MC74HC139AFL2 Datasheet

MC74HC139A

Dual 1-of-4 Decoder/

Demultiplexer

High±Performance Silicon±Gate CMOS

The MC74HC139A is identical in pinout to the LS139. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.

This device consists of two independent 1±of±4 decoders, each of which decodes a two±bit Address to one±of±four active±low outputs. Active±low Selects are provided to facilitate the demultiplexing and cascading functions. The demultiplexing function is accomplished by using the Address inputs to select the desired device output, and utilizing the Select as a data input.

Output Drive Capability: 10 LSTTL Loads

Outputs Directly Interface to CMOS, NMOS and TTL

Operating Voltage Range: 2.0 to 6.0 V

Low Input Current: 1.0 μA

High Noise Immunity Characteristic of CMOS Devices

In Compliance with the Requirements Defined by JEDEC Standard No. 7A

Chip Complexity: 100 FETs or 25 Equivalent Gates

LOGIC DIAGRAM

ADDRESS

A0a

2

 

 

 

4

Y0a

 

3

 

 

 

5

 

INPUTS

A1

 

 

 

Y1a

ACTIVE±LOW

 

a

 

 

 

 

6

 

 

 

 

 

 

 

Y2a

OUTPUTS

 

 

 

 

 

 

7

 

 

 

 

 

 

 

Y3a

 

 

 

 

 

 

 

 

 

SELECTa

1

 

 

 

 

 

PIN 16 = VCC

 

 

 

 

 

 

PIN 8 = GND

ADDRESS

A0b

14

 

 

 

12

Y0b

 

13

 

 

 

11

 

INPUTS

A1b

 

 

 

Y1b ACTIVE±LOW

 

 

 

 

 

10

 

 

 

 

 

 

Y2b

OUTPUTS

 

 

 

 

 

 

9

 

 

 

 

 

 

 

Y3b

 

 

 

 

 

 

 

 

 

SELECTb

15

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

FUNCTION TABLE

 

 

 

 

Inputs

 

 

Outputs

 

 

Select

A1

A0

Y0

Y1

Y2

Y3

 

H

 

X

X

H

H

H

H

 

L

 

L

L

L

H

H

H

 

L

 

L

H

H

L

H

H

 

L

 

H

L

H

H

L

H

 

L

 

H

H

H

H

H

L

 

X = don't care

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MARKING

 

 

DIAGRAMS

 

 

16

 

PDIP±16

MC74HC139AN

 

N SUFFIX

16

AWLYYWW

CASE 648

 

 

1

 

1

 

 

 

 

16

 

SO±16

HC139A

 

D SUFFIX

16

AWLYWW

CASE 751B

1

 

 

1

 

 

A

= Assembly Location

WL

= Wafer Lot

 

YY

= Year

 

WW = Work Week

PIN ASSIGNMENT

SELECTa

 

1

16

 

VCC

 

 

 

 

A0a

 

2

15

 

SELECTb

 

 

A1a

 

3

14

 

A0b

 

 

Y0a

 

4

13

 

A1b

 

 

Y1a

 

5

12

 

Y0b

 

 

Y2a

 

6

11

 

Y1b

 

 

Y3a

 

7

10

 

Y2b

 

 

GND

 

8

9

 

Y3b

 

 

 

 

 

 

 

 

ORDERING INFORMATION

Device

Package

Shipping

MC74HC139AN

PDIP±16

2000 / Box

MC74HC139AD

SOIC±16

48 / Rail

MC74HC139ADR2

SOIC±16

2500 / Reel

Semiconductor Components Industries, LLC, 2000

1

Publication Order Number:

March, 2000 ± Rev. 7

 

MC74HC139A/D

MC74HC139A

MAXIMUM RATINGS*

Symbol

Parameter

 

Value

Unit

 

 

 

 

VCC

DC Supply Voltage (Referenced to GND)

± 0.5 to + 7.0

V

Vin

DC Input Voltage (Referenced to GND)

 

± 1.5 to VCC + 1.5

V

Vout

DC Output Voltage (Referenced to GND)

± 0.5 to VCC + 0.5

V

Iin

DC Input Current, per Pin

 

± 20

mA

Iout

DC Output Current, per Pin

 

± 25

mA

ICC

DC Supply Current, VCC and GND Pins

 

± 50

mA

PD

Power Dissipation in Still Air,

Plastic DIP²

750

mW

 

SOIC Package²

500

 

 

 

 

 

 

Tstg

Storage Temperature

 

± 65 to + 150

_C

TL

Lead Temperature, 1 mm from Case for 10 Seconds

 

_C

 

(Plastic DIP or SOIC Package)

260

 

 

 

 

 

 

This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high±impedance circuit. For proper operation, Vin and Vout should be constrained to the

range GND v (Vin or Vout) v VCC. Unused inputs must always be

tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.

*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions.

²Derating Ð Plastic DIP: ± 10 mW/ _C from 65_ to 125_C SOIC Package: ± 7 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

 

Min

Max

Unit

 

 

 

 

 

 

VCC

DC Supply Voltage (Referenced to GND)

 

2.0

6.0

V

Vin, Vout

DC Input Voltage, Output Voltage (Referenced to GND)

0

VCC

V

TA

Operating Temperature, All Package Types

 

± 55

+ 125

_C

tr, tf

Input Rise and Fall Time

VCC = 2.0 V

0

1000

ns

 

(Figure 1)

VCC = 4.5 V

0

500

 

 

 

VCC = 6.0 V

0

400

 

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

 

 

 

 

 

Guaranteed Limit

 

 

 

 

 

 

VCC

 

 

 

 

 

 

 

 

 

± 55 to

v _

v

_

 

Symbol

Parameter

Test Conditions

V

_

Unit

 

25 C

85 C

 

125 C

VIH

Minimum High±Level Input

Vout = 0.1 V or VCC ± 0.1 V

2.0

1.5

1.5

 

1.5

V

 

Voltage

|Iout| v 20 μA

 

4.5

3.15

3.15

 

3.15

 

 

 

 

 

6.0

4.2

4.2

 

4.2

 

 

 

 

 

 

 

 

 

 

VIL

Maximum Low±Level Input

Vout = 0.1 V or VCC ± 0.1 V

2.0

0.5

0.5

 

0.5

V

 

Voltage

|Iout| v 20 μA

 

4.5

1.35

1.35

 

1.35

 

 

 

 

 

6.0

1.8

1.8

 

1.8

 

 

 

 

 

 

 

 

 

 

 

VOH

Minimum High±Level Output

Vin = VIH or VIL

 

2.0

1.9

1.9

 

1.9

V

 

Voltage

|Iout| v 20 μA

 

4.5

4.4

4.4

 

4.4

 

 

 

 

 

6.0

5.9

5.9

 

5.9

 

 

 

 

 

 

 

 

 

 

 

 

 

Vin = VIH or VIL

|Iout| v 4.0 mA

4.5

3.98

3.84

 

3.70

 

 

 

 

|Iout| v 5.2 mA

6.0

5.48

5.34

 

5.20

 

VOL

Maximum Low±Level Output

Vin = VIH or VIL

 

2.0

0.1

0.1

 

0.1

V

 

Voltage

|Iout| v 20 μA

 

4.5

0.1

0.1

 

0.1

 

 

 

 

 

6.0

0.1

0.1

 

0.1

 

 

 

 

 

 

 

 

 

 

 

 

 

Vin = VIH or VIL

|Iout| v 4.0 mA

4.5

0.26

0.33

 

0.40

 

 

 

 

|Iout| v 5.2 mA

6.0

0.26

0.33

 

0.40

 

Iin

Maximum Input Leakage

Vin = VCC or GND

6.0

± 0.1

± 1.0

 

± 1.0

μA

 

Current

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ICC

Maximum Quiescent Supply

Vin = VCC or GND

6.0

4

40

 

160

μA

 

Current (per Package)

Iout = 0 μA

 

 

 

 

 

 

 

NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).

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MC74HC139A

AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns)

 

 

 

Guaranteed Limit

 

 

 

VCC

 

 

 

 

 

 

± 55 to

 

 

 

Symbol

Parameter

V

25_C

v 85_C

v 125_C

Unit

 

 

 

 

 

 

 

tPLH,

Maximum Propagation Delay, Select to Output Y

2.0

115

145

175

ns

tPHL

(Figures 1 and 3)

4.5

23

29

35

 

 

 

6.0

20

25

30

 

 

 

 

 

 

 

 

tPLH,

Maximum Propagation Delay, Input A to Output Y

2.0

115

145

175

ns

tPHL

(Figures 2 and 3)

4.5

23

29

35

 

 

 

6.0

20

25

30

 

 

 

 

 

 

 

 

tTLH,

Maximum Output Transition Time, Any Output

2.0

75

95

110

ns

tTHL

(Figures 1 and 3)

4.5

15

19

22

 

 

 

6.0

13

16

19

 

 

 

 

 

 

 

 

Cin

Maximum Input Capacitance

Ð

10

10

10

pF

NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).

 

 

Typical @ 25°C, VCC = 5.0 V

 

CPD

Power Dissipation Capacitance (Per Decoder)*

55

pF

*Used to determine the no±load dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).

SWITCHING WAVEFORMS

 

tf

tr

 

VALID

VALID

 

90%

VCC

 

 

 

 

 

VCC

SELECT

50%

 

INPUT A

50%

10%

GND

GND

 

tPHL

tPLH

 

 

 

90%

 

tPLH

 

tPHL

OUTPUT Y

50%

 

 

 

 

10%

 

OUTPUT Y

50%

 

 

 

 

 

 

tTHL

tTLH

 

 

 

 

Figure 1.

 

 

Figure 2.

 

 

TEST POINT

 

 

 

 

 

 

 

 

 

 

 

OUTPUT

 

 

 

 

 

DEVICE

 

 

 

 

 

 

 

 

 

UNDER

 

 

 

 

 

 

 

 

CL*

TEST

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

*Includes all probe and jig capacitance

Figure 3. Test Circuit

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