MC74HC132A
Quad 2-Input NAND Gate with Schmitt-Trigger Inputs
High±Performance Silicon±Gate CMOS
The MC74HC132A is identical in pinout to the LS132. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.
The HC132A can be used to enhance noise immunity or to square up slowly changing waveforms.
•Output Drive Capability: 10 LSTTL Loads
•Outputs Directly Interface to CMOS, NMOS, and TTL
•Operating Voltage Range: 2.0 to 6.0 V
•Low Input Current: 1.0 μA
•High Noise Immunity Characteristic of CMOS Devices
•In Compliance with the Requirements Defined by JEDEC Standard No. 7A
•Chip Complexity: 72 FETs or 18 Equivalent Gates
LOGIC DIAGRAM
A1 1
3
Y1
2
B1
A2 4
6
Y2
5
B2
Y = AB
A3 9
8
Y3
B3 10
A4 12
11 Y4
B4 13
PIN 14 = VCC
PIN 7 = GND
FUNCTION TABLE
Inputs |
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Output |
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A |
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B |
Y |
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L |
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L |
H |
L |
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H |
H |
H |
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L |
H |
H |
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H |
L |
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MARKING |
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DIAGRAMS |
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14 |
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PDIP±14 |
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MC74HC132AN |
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N SUFFIX |
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AWLYYWW |
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CASE 646 |
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1 |
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14 |
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SOIC±14 |
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HC132A |
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D SUFFIX |
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AWLYWW |
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CASE 751A |
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1 |
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A |
= Assembly Location |
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WL or L = Wafer Lot |
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YY or Y |
= Year |
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WW or W = Work Week |
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PIN ASSIGNMENT |
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A1 |
1 |
14 |
VCC |
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B1 |
2 |
13 |
B4 |
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Y1 |
3 |
12 |
A4 |
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A2 |
4 |
11 |
Y4 |
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B2 |
5 |
10 |
B3 |
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Y2 |
6 |
9 |
A3 |
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GND |
7 |
8 |
Y3 |
ORDERING INFORMATION
Device |
Package |
Shipping |
MC74HC132AN |
PDIP±14 |
2000 / Box |
MC74HC132AD |
SOIC±14 |
55 / Rail |
MC74HC132ADR2 |
SOIC±14 |
2500 / Reel |
Semiconductor Components Industries, LLC, 2000 |
1 |
Publication Order Number: |
March, 2000 ± Rev. 7 |
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MC74HC132A/D |
MC74HC132A
MAXIMUM RATINGS*
Symbol |
Parameter |
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Value |
Unit |
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VCC |
DC Supply Voltage (Referenced to GND) |
± 0.5 to + 7.0 |
V |
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Vin |
DC Input Voltage (Referenced to GND) |
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± 1.5 to VCC + 1.5 |
V |
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Vout |
DC Output Voltage (Referenced to GND) |
± 0.5 to VCC + 0.5 |
V |
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Iin |
DC Input Current, per Pin |
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± 20 |
mA |
Iout |
DC Output Current, per Pin |
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± 25 |
mA |
ICC |
DC Supply Current, VCC and GND Pins |
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± 50 |
mA |
PD |
Power Dissipation in Still Air, |
Plastic DIP² |
750 |
mW |
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SOIC Package² |
500 |
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Tstg |
Storage Temperature |
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± 65 to + 150 |
_C |
TL |
Lead Temperature, 1 mm from Case for 10 Seconds |
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_C |
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(Plastic DIP or SOIC Package) |
260 |
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This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high±impedance circuit. For proper operation, Vin and Vout should be constrained to the
range GND v (Vin or Vout) v VCC. Unused inputs must always be
tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions.
²Derating Ð Plastic DIP: ± 10 mW/ _C from 65_ to 125_C SOIC Package: ± 7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol |
Parameter |
Min |
Max |
Unit |
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VCC |
DC Supply Voltage (Referenced to GND) |
2.0 |
6.0 |
V |
Vin, Vout |
DC Input Voltage, Output Voltage |
0 |
VCC |
V |
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(Referenced to GND) |
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TA |
Operating Temperature, All Package Types |
± 55 |
+ 125 |
_C |
tr, tf |
Input Rise and Fall Time (Figure 1) |
Ð |
no |
ns |
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limit* |
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*When Vin X 0.5 VCC, ICC >> quiescent current.
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
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Guaranteed Limit |
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VCC |
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± 40_C to |
± 55_C to |
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Symbol |
Parameter |
Test Conditions |
V |
_ |
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+ 85 |
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C |
+ 125 |
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C |
Unit |
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25 C |
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VT+ max |
Maximum Positive±Going |
Vout = 0.1 V |
2.0 |
1.5 |
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1.5 |
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1.5 |
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V |
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Input Threshold Voltage |
|Iout| v 20 μA |
4.5 |
3.15 |
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3.15 |
3.15 |
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(Figure 3) |
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6.0 |
4.2 |
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4.2 |
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4.2 |
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VT+ min |
Minimum Positive±Going |
Vout = 0.1 V |
2.0 |
1.0 |
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0.95 |
0.95 |
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V |
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Input Threshold Voltage |
|Iout| v 20 μA |
4.5 |
2.3 |
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2.25 |
2.25 |
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(Figure 3) |
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6.0 |
3.0 |
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2.95 |
2.95 |
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VT± max |
Maximum Negative±Going |
Vout = VCC ± 0.1 V |
2.0 |
0.9 |
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0.95 |
0.95 |
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V |
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Input Threshold Voltage |
|Iout| v 20 μA |
4.5 |
2.0 |
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2.05 |
2.05 |
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(Figure 3) |
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6.0 |
2.6 |
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2.65 |
2.65 |
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VT± min |
Minimum Negative±Going |
Vout = VCC ± 0.1 V |
2.0 |
0.3 |
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0.3 |
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0.3 |
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V |
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Input Threshold Voltage |
|Iout| v 20 μA |
4.5 |
0.9 |
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0.9 |
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0.9 |
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(Figure 3) |
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6.0 |
1.2 |
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1.2 |
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1.2 |
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VHmax |
Maximum Hysteresis Voltage |
Vout = 0.1 V or VCC ± 0.1 V |
2.0 |
1.2 |
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1.2 |
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1.2 |
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V |
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Note 2 |
(Figure 3) |
|Iout| v 20 μA |
4.5 |
2.25 |
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2.25 |
2.25 |
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6.0 |
3.0 |
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3.0 |
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3.0 |
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VHmin |
Minimum Hysteresis Voltage |
Vout = 0.1 V or VCC ± 0.1 V |
2.0 |
0.2 |
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0.2 |
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0.2 |
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V |
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Note 2 |
(Figure 3) |
|Iout| v 20 μA |
4.5 |
0.4 |
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0.4 |
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0.4 |
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6.0 |
0.5 |
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0.5 |
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0.5 |
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NOTE: 1. VHmin > (VT+ min) ± (VT± max); VHmax = (VT+ max) + (VT± min).
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).
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MC74HC132A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
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Guaranteed Limit |
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VCC |
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± 55 to |
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Symbol |
Parameter |
Test Conditions |
V |
25_C |
v 85_C |
v 125_C |
Unit |
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VOH |
Minimum High±Level Output |
VinvVT± min or VT+ max |
2.0 |
1.9 |
1.9 |
1.9 |
V |
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Voltage |
|Iout| v 20 μA |
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4.5 |
4.4 |
4.4 |
4.4 |
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6.0 |
5.9 |
5.9 |
5.9 |
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Vinv±VT± min or VT+ max |
4.5 |
3.98 |
3.84 |
3.7 |
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|Iout| v 4.0 mA |
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|Iout| v 5.2 mA |
6.0 |
5.48 |
5.34 |
5.2 |
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VOL |
Maximum Low±Level Output |
Vin ≥ VT+ max |
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2.0 |
0.1 |
0.1 |
0.1 |
V |
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Voltage |
|Iout| v 20 μA |
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4.5 |
0.1 |
0.1 |
0.1 |
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6.0 |
0.1 |
0.1 |
0.1 |
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Vin≥ VT+ max |
|Iout| v 4.0 mA |
4.5 |
0.26 |
0.33 |
0.4 |
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|Iout| v 5.2 mA |
6.0 |
0.26 |
0.33 |
0.4 |
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Iin |
Maximum Input Leakage |
Vin = VCC or GND |
6.0 |
± 0.1 |
± 1.0 |
± 1.0 |
μA |
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Current |
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ICC |
Maximum Quiescent Supply |
Vin = VCC or GND |
6.0 |
1.0 |
10 |
40 |
μA |
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Current (per Package) |
Iout = 0 μA |
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AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns)
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Guaranteed Limit |
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VCC |
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± 55 to |
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Symbol |
Parameter |
V |
25_C |
v 85_C |
v 125_C |
Unit |
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tPLH, |
Maximum Propagation Delay, Input A or B to Output Y |
2.0 |
125 |
155 |
190 |
ns |
tPHL |
(Figures 1 and 2) |
4.5 |
25 |
31 |
38 |
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6.0 |
21 |
26 |
32 |
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tTLH, |
Maximum Output Transition Time, Any Output |
2.0 |
75 |
95 |
110 |
ns |
tTHL |
(Figures 1 and 2) |
4.5 |
15 |
19 |
22 |
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6.0 |
13 |
16 |
19 |
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Cin |
Maximum Input Capacitance |
Ð |
10 |
10 |
10 |
pF |
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).
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Typical @ 25°C, VCC = 5.0 V |
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CPD |
Power Dissipation Capacitance (Per Gate)* |
24 |
pF |
*Used to determine the no±load dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).
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tr |
tf |
VCC |
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TEST POINT |
INPUT |
90% |
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50% |
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OUTPUT |
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A OR B |
10% |
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GND |
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DEVICE |
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tPHL |
tPLH |
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UNDER |
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90% |
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CL* |
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Y |
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TEST |
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50% |
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10% |
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tTHL |
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tTLH |
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*Includes all probe and jig capacitance |
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Figure 1. Switching Waveforms |
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Figure 2. Test Circuit |
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