Motorola MC74ACT646DWR2, MC74ACT646DW, MC74AC646N, MC74AC646DW, MC74AC646DWR2 Datasheet

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MC74AC646

MC74ACT646

Octal Transceiver/Register with

OCTAL

 

3!State Outputs (Non!inverting)

TRANSCEIVER/REGISTER

WITH 3-STATE OUTPUTS

 

 

(NON-INVERTING)

The MC74AC646/74ACT646 consist of registered bus transceiver circuits,

with outputs, D-type flip-flops and control circuitry providing multiplexed transmission of data directly from the input bus or from the internal storage registers. Data on the A or B bus will be loaded into the respective registers on the LOW-to-HIGH transition of the appropriate clock pin (CAB or CBA). The four fundamental data handling functions available are illustrated in the following figures.

REAL TIME TRANSFER

REAL TIME TRANSFER

N SUFFIX

A-BUS TO B-BUS

B-BUS TO A-BUS

CASE 724-03

 

 

 

 

 

A-BUS

A-BUS

 

PLASTIC

REG

REG

REG

REG

 

 

B-BUS

B-BUS

 

 

Figure 1

Figure 2

 

 

 

DW SUFFIX

STORAGE

TRANSFER

CASE 751E-04

SOIC PACKAGE

FROM BUS TO REGISTER

FROM REGISTER TO BUS

 

A-BUS

A-BUS

 

LOGIC SYMBOL

REG

REG

REG

REG

B-BUS

B-BUS

Figure 3

Figure 4

Independent Registers for A and B Buses

Multiplexed Real-Time and Stored Data Transfers

Choice of True and Inverting Data Paths

3-State Outputs

300 mil Slim Dual In-Line Package

Outputs Source/Sink 24 mA

′ACT646 Has TTL Compatible Inputs

CAB A0 A1 A2 A3 A4 A5 A6 A7

SAB

DIR

CBA

SBA

G

B0

B1 B2 B3 B4

B5 B6 B7

 

FACT DATA

5-1

Motorola MC74ACT646DWR2, MC74ACT646DW, MC74AC646N, MC74AC646DW, MC74AC646DWR2 Datasheet

MC74AC646 MC74ACT646

FUNCTION TABLE

 

 

 

 

 

 

Inputs

 

 

 

Data I/O*

Operation or Function

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

G

DIR

CAB

CBA

SAB

SBA

A0±A7

 

B0±B7

 

 

 

H

X

H or L

H or L

X

X

Input

 

Input

Isolation

 

H

X

 

 

 

 

 

 

 

 

X

X

 

Store A and B Data

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

L

L

 

X

 

X

X

L

Output

 

Input

Real Time B Data to A Bus

 

L

L

 

X

 

X

X

H

 

Stored B Data to A Bus

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

L

H

 

X

 

X

L

X

Input

 

Output

Real Time A Data to B Bus

 

L

H

H or L

 

X

H

X

 

Stored A Data to B Bus

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

*The data output functions may be enabled or disabled by various signals at the G and DIR inputs. Data input functions are always enabled; i.e., data at the bus pins will be stored on every LOW-to-HIGH transition of the appropriate clock inputs.

H = HIGH Voltage Level

L = LOW Voltage Level

X = Immaterial

= LOW-to-HIGH Transition

CAB

 

 

 

 

 

 

VCC

1

 

 

 

24

 

SAB

 

 

 

 

 

 

CBA

2

 

 

 

23

 

DIR

 

 

 

 

 

 

SBA

3

 

 

 

22

 

 

 

 

 

 

 

 

 

 

A0

 

 

 

 

 

 

G

4

 

 

 

21

 

A1

 

 

 

 

 

 

B0

5

 

 

 

20

 

A2

 

 

 

 

 

 

B1

6

 

 

 

19

 

A3

 

 

 

 

 

 

B2

7

 

 

 

18

 

A4

 

 

 

 

 

 

B3

8

 

 

 

17

 

A5

 

 

 

 

 

 

B4

9

 

 

 

16

 

A6

 

 

 

 

 

 

B5

10

 

 

 

15

 

A7

 

 

 

 

 

 

B6

11

 

 

 

14

 

GND

 

 

 

 

 

 

B7

12

 

 

 

13

 

 

 

 

 

 

 

 

 

 

PIN NAMES

 

A0±A7

Data Register Inputs

 

Data Register A Outputs

B0±B7

Data Register B Inputs

 

Data Register B Outputs

CAB, CBA

Clock Pulse Inputs

SAB, SBA

Transmit/Receive Inputs

DIR, G

Output Enable Inputs

LOGIC DIAGRAM

G

DIR

CBA

SBA

CAB

SAB

1 OF 8 CHANNELS

D0

C0

A0 B0

D0 C0

TO 7 OTHER CHANNELS

Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

FACT DATA

5-2

MC74AC646 MC74ACT646

MAXIMUM RATINGS*

Symbol

Parameter

Value

Unit

 

 

 

 

VCC

DC Supply Voltage (Referenced to GND)

±0.5 to +7.0

V

Vin

DC Input Voltage (Referenced to GND)

±0.5 to VCC +0.5

V

Vout

DC Output Voltage (Referenced to GND)

±0.5 to VCC +0.5

V

Iin

DC Input Current, per Pin

±20

mA

Iout

DC Output Sink/Source Current, per Pin

±50

mA

ICC

DC VCC or GND Current per Output Pin

±50

mA

Tstg

Storage Temperature

±65 to +150

°C

*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions.

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

 

Min

Typ

Max

Unit

 

 

 

 

 

 

 

VCC

Supply Voltage

′AC

2.0

5.0

6.0

V

 

 

 

 

′ACT

4.5

5.0

5.5

 

 

 

 

 

 

 

 

 

 

Vin, Vout

DC Input Voltage, Output Voltage (Ref. to GND)

 

0

 

VCC

V

 

Input Rise and Fall Time (Note 1)

VCC @ 3.0 V

 

150

 

 

tr, tf

VCC @ 4.5 V

 

40

 

ns/V

′AC Devices except Schmitt Inputs

 

 

 

 

VCC @ 5.5 V

 

25

 

 

tr, tf

Input Rise and Fall Time (Note 2)

VCC @ 4.5 V

 

10

 

ns/V

′ACT Devices except Schmitt Inputs

VCC @ 5.5 V

 

8.0

 

 

 

 

 

 

TJ

Junction Temperature (PDIP)

 

 

 

140

°C

TA

Operating Ambient Temperature Range

 

±40

25

85

°C

IOH

Output Current Ð High

 

 

 

±24

mA

IOL

Output Current Ð Low

 

 

 

24

mA

1.Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.

2.Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.

FACT DATA

5-3

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