MOTOROLA MC74HC244AH, MC74HC244AFR1, MC74HC244ADWR2, MC74HC244AF, MC74HC244AFL1 Datasheet

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MOTOROLA MC74HC244AH, MC74HC244AFR1, MC74HC244ADWR2, MC74HC244AF, MC74HC244AFL1 Datasheet

MC74HC244A

Octal 3-State Noninverting

Buffer/Line Driver/

Line Receiver

High±Performance Silicon±Gate CMOS

The MC74HC244A is identical in pinout to the LS244. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.

This octal noninverting buffer/line driver/line receiver is designed to be used with 3±state memory address drivers, clock drivers, and other bus±oriented systems. The device has noninverting outputs and two active±low output enables.

The HC244A is similar in function to the HC240A.

Output Drive Capability: 15 LSTTL Loads

Outputs Directly Interface to CMOS, NMOS, and TTL

Operating Voltage Range: 2 to 6 V

Low Input Current: 1 μA

High Noise Immunity Characteristic of CMOS Devices

In Compliance with the Requirements Defined by JEDEC Standard No. 7A

Chip Complexity: 136 FETs or 34 Equivalent Gates

LOGIC DIAGRAM

A1

2

18

YA1

A2

4

16

YA2

A3

6

14

YA3

A4

8

12

YA4

DATA

 

 

NONINVERTING

INPUTS

11

9

OUTPUTS

B1

YB1

B2

13

7

YB2

B3

15

5

YB3

B4

17

3

YB4

OUTPUT

 

ENABLE A

1

 

PIN 20

= VCC

 

 

PIN 10

= GND

19

 

ENABLES

 

ENABLE B

 

 

 

 

 

 

 

 

 

FUNCTION TABLE

Inputs

Outputs

Enable A,

 

 

Enable B

A, B

YA, YB

L

L

L

L

H

H

H

X

Z

Z = high impedance

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MARKING

 

 

DIAGRAMS

 

 

20

 

 

PDIP±20

MC74HC244AN

 

N SUFFIX

 

 

AWLYYWW

20

CASE 738

 

 

 

 

 

 

1

 

1

 

 

20

 

 

 

SOIC WIDE±20

 

HC244A

20

DW SUFFIX

 

 

AWLYYWW

1

CASE 751D

 

 

 

 

 

 

1

20

 

TSSOP±20

 

HC

20

DT SUFFIX

 

244A

1

CASE 948G

 

ALYW

 

 

 

1

A = Assembly Location

WL = Wafer Lot

YY = Year

WW = Work Week

PIN ASSIGNMENT

ENABLE A

1

20

VCC

A1

2

19

ENABLE B

YB4

3

18

YA1

A2

4

17

B4

YB3

5

16

YA2

A3

6

15

B3

YB2

7

14

YA3

A4

8

13

B2

YB1

9

12

YA4

GND

10

11

B1

 

 

 

 

 

 

 

 

ORDERING INFORMATION

Device

Package

Shipping

MC74HC244AN

PDIP±20

1440 / Box

MC74HC244ADW

SOIC±WIDE

38 / Rail

MC74HC244ADWR2

SOIC±WIDE

1000 / Reel

MC74HC244ADT

TSSOP±20

75 / Rail

MC74HC244ADTR2

TSSOP±20

2500 / Reel

Semiconductor Components Industries, LLC, 2000

1

Publication Order Number:

March, 2000 ± Rev. 8

 

MC74HC244A/D

MC74HC244A

MAXIMUM RATINGS*

Symbol

Parameter

 

Value

Unit

 

 

 

 

VCC

DC Supply Voltage (Referenced to GND)

± 0.5 to + 7.0

V

Vin

DC Input Voltage (Referenced to GND)

± 0.5 to VCC + 0.5

V

Vout

DC Output Voltage (Referenced to GND)

± 0.5 to VCC + 0.5

V

Iin

DC Input Current, per Pin

 

± 20

mA

Iout

DC Output Current, per Pin

 

± 35

mA

ICC

DC Supply Current, VCC and GND Pins

± 75

mA

PD

Power Dissipation in Still Air,

Plastic DIP²

750

mW

 

 

SOIC Package²

500

 

 

 

TSSOP Package²

450

 

 

 

 

 

 

Tstg

Storage Temperature

 

± 65 to + 150

_C

TL

Lead Temperature, 1 mm from Case for 10 Seconds

 

_C

 

(Plastic DIP, SOIC, SSOP or TSSOP Package)

260

 

 

 

 

 

 

This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high±impedance circuit. For proper operation, Vin and Vout should be constrained to the

range GND v (Vin or Vout) v VCC. Unused inputs must always be

tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.

*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions.

²Derating Ð Plastic DIP: ± 10 mW/ _C from 65_ to 125_C SOIC Package: ± 7 mW/_C from 65_ to 125_C

TSSOP Package: ± 6.1 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

 

Min

Max

Unit

 

 

 

 

 

 

VCC

DC Supply Voltage (Referenced to GND)

 

2.0

6.0

V

Vin, Vout

DC Input Voltage, Output Voltage (Referenced to GND)

0

VCC

V

TA

Operating Temperature, All Package Types

 

± 55

+ 125

_C

tr, tf

Input Rise and Fall Time

VCC = 2.0 V

0

1000

ns

 

(Figure 1)

VCC = 4.5 V

0

500

 

 

 

VCC = 6.0 V

0

400

 

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

 

 

 

 

 

Guaranteed Limit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCC

± 55 to

 

 

 

Symbol

Parameter

Test Conditions

V

25_C

v 85_C

v 125_C

Unit

 

 

 

 

 

 

 

 

VIH

Minimum High±Level Input

Vout = VCC ± 0.1 V

2.0

1.5

1.5

1.5

V

 

Voltage

|Iout| v 20

μA

3.0

2.1

2.1

2.1

 

 

 

 

 

4.5

3.15

3.15

3.15

 

 

 

 

 

6.0

4.2

4.2

4.2

 

 

 

 

 

 

 

 

 

VIL

Maximum Low±Level Input

Vout = 0.1 V

2.0

0.5

0.5

0.5

V

 

Voltage

|Iout| v 20 μA

3.0

0.9

0.9

0.9

 

 

 

 

 

4.5

1.35

1.35

1.35

 

 

 

 

 

6.0

1.8

1.8

1.8

 

 

 

 

 

 

 

 

 

 

VOH

Minimum High±Level Output

Vin = VIH

μA

2.0

1.9

1.9

1.9

V

 

Voltage

|Iout| v 20

4.5

4.4

4.4

4.4

 

 

 

 

 

6.0

5.9

5.9

5.9

 

 

 

 

 

 

 

 

 

 

 

 

Vin = VIH

|Iout| v 2.4 mA

3.0

2.48

2.34

2.2

 

 

 

 

|Iout| v 6.0 mA

4.5

3.98

3.84

3.7

 

 

 

 

|Iout| v 7.8 mA

6.0

5.48

5.34

5.2

 

VOL

Maximum Low±Level Output

Vin = VIL

μA

2.0

0.1

0.1

0.1

V

 

Voltage

|Iout| v 20

4.5

0.1

0.1

0.1

 

 

 

 

 

6.0

0.1

0.1

0.1

 

 

 

 

 

 

 

 

 

 

 

 

Vin = VIL

|Iout| v 2.4 mA

3.0

0.26

0.33

0.4

 

 

 

 

|Iout| v 6.0 mA

4.5

0.26

0.33

0.4

 

 

 

 

|Iout| v 7.8 mA

6.0

0.26

0.33

0.4

 

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MC74HC244A

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

 

 

 

 

Guaranteed Limit

 

 

 

 

 

 

 

 

 

 

 

 

VCC

± 55 to

 

 

 

Symbol

Parameter

Test Conditions

V

25_C

v 85_C

v 125_C

Unit

 

 

 

 

 

 

 

 

Iin

Maximum Input Leakage

Vin = VCC or GND

6.0

± 0.1

± 1.0

± 1.0

μA

 

Current

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IOZ

Maximum Three±State

Output in High±Impedance State

6.0

± 0.5

± 5.0

± 10

μA

 

Leakage Current

Vin = VIL or VIH

 

 

 

 

 

 

 

Vout = VCC or GND

 

 

 

 

 

ICC

Maximum Quiescent Supply

Vin = VCC or GND

6.0

4.0

40

160

μA

 

Current (per Package)

Iout = 0 μA

 

 

 

 

 

NOTE: Information on typical parametric values and high frequency or heavy load considerations can be found in Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).

AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)

 

 

 

Guaranteed Limit

 

 

 

VCC

 

 

 

 

 

 

± 55 to

 

 

 

Symbol

Parameter

V

25_C

v85_C

v125_C

Unit

 

 

 

 

 

 

 

tPLH,

Maximum Propagation Delay, A to YA or B to YB

2.0

96

115

135

ns

tPHL

(Figures 1 and 3)

3.0

50

60

70

 

 

 

4.5

18

23

27

 

 

 

6.0

15

20

23

 

 

 

 

 

 

 

 

tPLZ,

Maximum Propagation Delay, Output Enable to YA or YB

2.0

110

140

165

ns

tPHZ

(Figures 2 and 4)

3.0

60

70

80

 

 

 

4.5

22

28

33

 

 

 

6.0

19

24

28

 

 

 

 

 

 

 

 

tPZL,

Maximum Propagation Delay, Output Enable to YA or YB

2.0

110

140

165

ns

tPZH

(Figures 2 and 4)

3.0

60

70

80

 

 

 

4.5

22

28

33

 

 

 

6.0

19

24

28

 

 

 

 

 

 

 

 

tTLH,

Maximum Output Transition Time, Any Output

2.0

60

75

90

ns

tTHL

(Figures 1 and 3)

3.0

23

27

32

 

 

 

4.5

12

15

18

 

 

 

6.0

10

13

15

 

 

 

 

 

 

 

 

Cin

Maximum Input Capacitance

Ð

10

10

10

pF

Cout

Maximum Three±State Output Capacitance (Output in

Ð

15

15

15

pF

 

High±Impedance State)

 

 

 

 

 

 

 

 

 

 

 

 

NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).

 

 

Typical @ 25°C, VCC = 5.0 V

 

CPD

Power Dissipation Capacitance (Per Buffer)*

34

pF

*Used to determine the no±load dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).

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