Motorola MC74HCT140ASD, MC74HCT140ADT, MC74HCT140ADW, MC74HCT140AN Datasheet

4 (1)
Motorola MC74HCT140ASD, MC74HCT140ADT, MC74HCT140ADW, MC74HCT140AN Datasheet

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Octal 3-State Inverting Buffer/ MC74HCT240A

Line

Driver/Line

Receiver

with

 

 

 

LSTTL-Compatible

Inputs

 

 

 

 

N SUFFIX

High±Performance Silicon±Gate CMOS

 

20

PLASTIC PACKAGE

 

 

CASE 738±03

The MC74HCT240A is identical in pinout to the LS240. This device may

1

 

 

 

 

 

DW SUFFIX

be used as a level converter for interfacing TTL or NMOS outputs to

20

 

High±Speed CMOS inputs. The HCT240A is an octal inverting buffer line

 

SOIC PACKAGE

1

 

driver line receiver designed to be used with 3±state memory address

 

CASE 751D±04

 

 

 

 

 

 

drivers, clock drivers, and other bus±oriented systems. The device has

 

 

 

 

inverting outputs and two active±low output enables.

 

 

20

 

SD SUFFIX

The HCT240A is the inverting version of the HCT244. See also HCT241.

 

SSOP PACKAGE

Output Drive Capability: 15 LSTTL Loads

 

 

 

 

1

 

CASE 940C±03

 

 

 

 

 

 

 

 

TTL NMOS±Compatible Input Levels

 

 

 

 

 

 

DT SUFFIX

Outputs Directly Interface to CMOS, NMOS, and TTL

 

 

20

 

 

 

TSSOP PACKAGE

Operating Voltage Range: 4.5 to 5.5 V

 

 

 

 

1

 

 

 

 

 

CASE 948E±02

Low Input Current: 1 μA

 

 

 

 

 

 

 

 

In Compliance with the Requirements Defined by JEDEC Standard

 

ORDERING INFORMATION

No. 7A

 

 

 

 

 

 

MC74HCTXXXAN

 

Plastic

Chip Complexity: 110 FETs or 27.5 Equivalent Gates

 

 

 

 

 

MC74HCTXXXADW

SOIC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MC74HCTXXXASD

SSOP

 

 

 

 

 

 

 

MC74HCTXXXADT

TSSOP

 

 

LOGIC DIAGRAM

 

 

 

 

 

 

 

 

A1

2

 

18

YA1

 

PIN ASSIGNMENT

 

 

 

 

 

 

 

 

 

4

 

16

 

 

ENABLE A

1

20

VCC

 

A2

 

YA2

 

A1

2

19

ENABLE B

 

 

 

 

 

 

 

 

A3

6

 

14

YA3

 

YB4

3

18

YA1

 

 

 

A2

4

17

B4

 

 

 

 

 

 

 

 

A4

8

 

12

YA4

 

YB3

5

16

YA2

DATA INPUTS

 

 

 

INVERTING

A3

6

15

B3

11

 

9

OUTPUTS

 

 

 

 

 

 

 

 

B1

 

YB1

 

YB2

7

14

YA3

 

B2

13

 

7

YB2

 

A4

8

13

B2

 

 

 

YB1

9

12

YA4

 

 

 

 

 

 

 

 

B3

15

 

5

YB3

 

GND

10

11

B1

 

B4

17

 

3

YB4

 

 

 

 

 

 

 

 

 

 

 

 

FUNCTION TABLE

 

 

1

 

PIN 20 = VCC

 

 

Inputs

Outputs

OUTPUT

ENABLE A

 

PIN 10 = GND

 

Enable A,

 

 

ENABLES

ENABLE B

19

 

 

 

 

 

 

 

 

 

 

Enable B A, B

YA, YB

 

 

 

 

 

 

 

 

 

 

 

 

 

 

L

L

 

H

 

 

 

 

 

 

 

L

H

 

L

 

 

 

 

 

 

 

H

X

 

Z

 

 

 

 

 

 

 

Z = High Impedance

 

 

 

 

 

 

 

 

X = Don't Care

 

 

2/97

 

 

 

 

 

 

 

 

 

 

Motorola, Inc. 1997

1

 

 

 

 

REV 7

 

 

 

MC74HCT240A

MAXIMUM RATINGS*

Symbol

Parameter

 

Value

Unit

 

 

 

 

VCC

DC Supply Voltage (Referenced to GND)

± 0.5 to + 7.0

V

Vin

DC Input Voltage (Referenced to GND)

 

± 0.5 to VCC + 0.5

V

Vout

DC Output Voltage (Referenced to GND)

± 0.5 to VCC + 0.5

V

Iin

DC Input Current, per Pin

 

± 20

mA

Iout

DC Output Current, per Pin

 

± 35

mA

ICC

DC Supply Current, VCC and GND Pins

 

± 75

mA

PD

Power Dissipation in Still Air

Plastic DIP²

750

mW

 

SOIC Package²

500

 

 

TSSOP or SSOP Package²

450

 

 

 

 

 

 

Tstg

Storage Temperature

 

± 65 to + 150

_C

TL

Lead Temperature, 1 mm from Case for 10 Seconds

 

_C

 

(Plastic DIP, SOIC, TSSOP or SSOP Package)

260

 

 

 

 

 

 

This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high±impedance circuit. For proper operation, Vin and Vout should be constrained to the

range GND v (Vin or Vout) v VCC. Unused inputs must always be

tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.

*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions.

²Derating Ð Plastic DIP: ± 10 mW/ _C from 65_ to 125_C SOIC Package: ± 7 mW/_C from 65_ to 125_C

TSSOP or SSOP Package: ± 6.1 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

 

 

 

 

 

VCC

DC Supply Voltage (Referenced to GND)

4.5

5.5

V

Vin, Vout

DC Input Voltage, Output Voltage (Referenced to GND)

0

VCC

V

TA

Operating Temperature, All Package Types

± 55

+ 125

_C

tr, tf

Input Rise and Fall Time (Figure 1)

0

500

ns

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

 

 

 

 

Guaranteed Limit

 

 

 

 

VCC

 

 

 

 

 

 

 

± 55 to

 

 

 

Symbol

Parameter

Test Conditions

V

25_C

v 85_C

v 125_C

Unit

 

 

 

 

 

 

 

 

VIH

Minimum High±Level Input

Vout = 0.1 V or VCC ± 0.1 V

4.5

2

2

2

V

 

Voltage

|Iout| v 20 μA

5.5

2

2

2

 

VIL

Maximum Low±Level Input

Vout = 0.1 V or VCC ± 0.1 V

4.5

0.8

0.8

0.8

V

 

Voltage

|Iout| v 20 μA

5.5

0.8

0.8

0.8

 

VOH

Minimum High±Level Output

Vin = VIH or VIL

4.5

4.4

4.4

4 4

V

 

Voltage

|Iout| v 20 μA

5.5

5.4

5.4

5.4

 

 

 

Vin = VIH or VIL

 

 

 

 

 

 

 

|Iout| v 6 mA

4.5

3.98

3.84

3.7

 

VOL

Maximum Low±Level Output

Vin = VIH or VIL

4.5

0.1

0.1

0.1

V

 

Voltage

|Iout| v 20 μA

5.5

0.1

0.1

0.1

 

 

 

Vin = VIH or VIL

 

 

 

 

 

 

 

|Iout| v 6 mA

4.5

0.26

0.33

0.4

 

Iin

Maximum Input Leakage Current

Vin = VCC or GND

5.5

± 0.1

± 1.0

± 1.0

μA

IOZ

Maximum Three State

Output in High±Impedance State

5.5

± 0.5

± 5.0

± 10

μA

 

Leakage Current

Vin = VIL or VIH

 

 

 

 

 

 

 

Vout = VCC or GND

 

 

 

 

 

MOTOROLA

2

High±Speed CMOS Logic Data

 

 

DL129 Ð Rev 6

MC74HCT240A

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

 

 

 

 

Guaranteed Limit

 

 

 

 

VCC

 

 

 

 

 

 

 

 

 

± 55 to

 

 

 

 

 

Symbol

Parameter

Test Conditions

V

25_C

 

v 85_C

v 125_C

Unit

 

 

 

 

 

 

 

 

 

 

ICC

Maximum Quiescent Supply

Vin = VCC or GND

5.5

4

 

40

160

μA

 

Current (per Package)

Iout = 0 μA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ICC

Additional Quiescent Supply

Vin = 2.4 V, Any One Input

 

±55_C

 

25_C to 125_C

 

 

Current

Vin = VCC or GND, Other Inputs

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

lout = 0 μA

5.5

2.9

 

 

 

2.4

mA

NOTES:

1.Information on typical parametric values along with frequency or heavy load considerations can be found in Chapter 2 of the Motorola High± Speed CMOS Data Book (DL129/D).

2.Total Supply Current = ICC + ΣΔICC.

AC ELECTRICAL CHARACTERISTICS (VCC = 5.0 V ± 10%, CL = 50 pF, Input tr = tf = 6 ns)

 

 

 

Guaranteed Limit

 

 

 

 

 

 

 

 

 

 

± 55 to

 

 

 

 

Symbol

Parameter

25_C

 

v 85_C

v 125_C

Unit

 

 

 

 

 

 

 

tPLH,

Maximum Propagation Delay, A to YA or B to YB

20

 

25

30

ns

tPHL

(Figures 1 and 3)

 

 

 

 

 

tPLZ,

Maximum Propagation Delay, Output Enable to YA or YB

28

 

35

42

ns

tPHZ

(Figures 2 and 4)

 

 

 

 

 

tPZL,

Maximum Propagation Delay, Output Enable to YA or YB

25

 

31

38

ns

tPZH

(Figures 2 and 4)

 

 

 

 

 

tTLH,

Maximum Output Transition Time, Any Output

12

 

15

18

ns

tTHL

(Figures 1 and 3)

 

 

 

 

 

Cin

Maximum Input Capacitance

10

 

10

10

pF

Cout

Maximum Three±State Output Capacitance (Output in High±Impedance

15

 

15

15

pF

 

State)

 

 

 

 

 

 

 

 

 

 

 

 

NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High± Speed CMOS Data Book (DL129/D).

 

 

Typical @ 25°C, VCC = 5.0 V

 

CPD

Power Dissipation Capacitance (Per Enabled Output)*

55

pF

*Used to determine the no±load dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D).

High±Speed CMOS Logic Data

3

MOTOROLA

DL129 Ð Rev 6

 

 

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