MOTOROLA MC74HCU04ADTEL, MC74HCU04ADTR2, MC74HCU04AF, MC74HCU04AFEL, MC74HCU04AD Datasheet

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MOTOROLA MC74HCU04ADTEL, MC74HCU04ADTR2, MC74HCU04AF, MC74HCU04AFEL, MC74HCU04AD Datasheet

MC74HCU04A

Hex Unbuffered Inverter

High±Performance Silicon±Gate CMOS

The MC74HCU04A is identical in pinout to the LS04 and the MC14069UB. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.

This device consists of six single±stage inverters. These inverters are well suited for use as oscillators, pulse shapers, and in many other applications requiring a high±input impedance amplifier. For digital applications, the HC04A is recommended.

Output Drive Capability: 10 LSTTL Loads

Outputs Directly Interface to CMOS, NMOS, and TTL

Operating Voltage Range: 2 to 6 V; 2.5 to 6 V in Oscillator Configurations

Low Input Current: 1 μA

High Noise Immunity Characteristic of CMOS Devices

In Compliance with the Requirements Defined by JEDEC Standard No. 7A

Chip Complexity: 12 FETs or 3 Equivalent Gates

 

 

LOGIC DIAGRAM

 

 

 

 

 

1

2

 

 

 

 

 

 

A1

 

 

 

 

Y1

 

 

 

 

 

 

 

 

 

 

3

4

 

Y2

 

 

 

A2

 

 

 

 

 

5

6

 

Y3

 

 

 

A3

 

 

 

 

 

 

 

 

 

 

 

 

Y =

 

 

 

 

 

 

 

 

 

A

9

8

 

Y4

 

 

 

A4

 

 

 

 

 

11

10

 

Y5

 

 

 

A5

 

 

 

 

 

13

12

 

 

 

PIN 14 = VCC

 

Y6

PIN 7 = GND

A6

 

 

 

 

 

 

 

FUNCTION TABLE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Inputs

Outputs

 

 

 

 

 

 

 

A

Y

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

L

H

 

 

 

 

 

 

 

H

L

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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MARKING

 

 

 

DIAGRAMS

 

 

 

14

 

PDIP±14

 

MC74HCU04AN

 

N SUFFIX

 

 

 

AWLYYWW

 

CASE 646

 

 

 

 

1

 

 

 

14

 

SOIC±14

 

HCU04A

 

D SUFFIX

 

 

 

AWLYWW

CASE 751A

 

 

 

 

1

 

 

 

14

 

TSSOP±14

HCU

 

DT SUFFIX

04A

 

CASE 948G

ALYW

 

 

 

1

A

= Assembly Location

WL or L = Wafer Lot

 

YY or Y

= Year

 

 

WW or W = Work Week

PIN ASSIGNMENT

A1

1

14

VCC

Y1

2

13

A6

A2

3

12

Y6

Y2

4

11

A5

A3

5

10

Y5

Y3

6

9

A4

GND

7

8

Y4

ORDERING INFORMATION

Device

Package

Shipping

MC74HCU04AN

PDIP±14

2000 / Box

MC74HCU04AD

SOIC±14

55 / Rail

MC74HCU04ADR2

SOIC±14

2500 / Reel

MC74HCU04ADT

TSSOP±14

96 / Rail

MC74HCU04ADTR2

TSSOP±14

2500 / Reel

Semiconductor Components Industries, LLC, 2000

1

Publication Order Number:

March, 2000 ± Rev. 2

 

MC74HCU04A/D

MC74HCU04A

MAXIMUM RATINGS*

Symbol

Parameter

 

Value

Unit

 

 

 

 

VCC

DC Supply Voltage (Referenced to GND)

± 0.5 to + 7.0

V

Vin

DC Input Voltage (Referenced to GND)

± 0.5 to VCC + 0.5

V

Vout

DC Output Voltage (Referenced to GND)

± 0.5 to VCC + 0.5

V

Iin

DC Input Current, per Pin

 

± 20

mA

Iout

DC Output Current, per Pin

 

± 25

mA

ICC

DC Supply Current, VCC and GND Pins

± 50

mA

PD

Power Dissipation in Still Air

Plastic DIP²

750

mW

 

 

SOIC Package²

500

 

 

 

TSSOP Package²

450

 

 

 

 

 

 

Tstg

Storage Temperature

 

± 65 to + 150

_C

TL

Lead Temperature, 1 mm from case for 10 Seconds

 

_C

 

Plastic DIP, SOIC or TSSOP Package

260

 

 

 

 

 

 

This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high±impedance circuit. For proper operation, Vin and Vout should be constrained to the

range GND v (Vin or Vout) v VCC. Unused inputs must always be

tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.

*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions.

²Derating Ð Plastic DIP: ±10mW/ _C from 65_ to 125_C SOIC Package: ±7mW/_C from 65_ to 125_C

TSSOP Package: ± 6.1 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

 

 

 

 

 

VCC

DC Supply Voltage (Referenced to GND)

2.0

6.0

V

Vin, Vout

DC Input Voltage, Output Voltage (Referenced to GND)

0

VCC

V

TA

Operating Temperature, All Package Types

± 55

+ 125

_C

tr, tf

Input Rise and Fall Time (Figure 1)

Ð

No

ns

 

 

 

Limit

 

 

 

 

 

 

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

 

 

 

 

 

Guaranteed Limit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCC

± 55 to

 

 

 

Symbol

Parameter

Test Conditions

V

25_C

v 85_C

v 125_C

Unit

 

 

 

 

 

 

 

 

VIH

Minimum High±Level Input

Vout = 0.5 V*

2.0

1.7

1.7

l.7

V

 

Voltage

|Iout| v 20 μA

3.0

2.5

2.5

2.5

 

 

 

 

 

4.5

3.6

3.6

3.6

 

 

 

 

 

6.0

4.8

4.8

4.8

 

 

 

 

 

 

 

 

 

VIL

Maximum Low±Level Input

Vout = VCC ± 0.5 V*

2.0

0.3

0.3

0.3

V

 

Voltage

|Iout| v 20

μA

3.0

0.5

0.5

0.5

 

 

 

 

 

4.5

0.8

0.8

0.8

 

 

 

 

 

6.0

1.1

1.1

1.1

 

 

 

 

 

 

 

 

 

 

VOH

Minimum High±Level Output

Vin = GND

 

2.0

1.8

1.8

1.8

V

 

Voltage

|Iout| v 20 μA

4.5

4.0

4.0

4.0

 

 

 

 

 

6.0

5.5

5.5

5.5

 

 

 

 

 

 

 

 

 

 

 

 

Vin = GND

|Iout| v 2.4 mA

3.0

2.36

2.26

2.20

 

 

 

 

|Iout| v 4.0 mA

4.5

3.86

3.76

3.70

 

 

 

 

|Iout| v 5.2 mA

6.0

5.36

5.26

5.20

 

VOL

Maximum Low±Level Output

Vin = VCC

μA

2.0

0.2

0.2

0.2

V

 

Voltage

|Iout| v 20

4.5

0.5

0.5

0.5

 

 

 

 

 

6.0

0.5

0.5

0.5

 

 

 

 

 

 

 

 

 

 

 

 

Vin = VCC

|Iout| v 2.4 mA

3.0

0.32

0.32

0.32

 

 

 

 

|Iout| v 4.0 mA

4.5

0.32

0.37

0.40

 

 

 

 

|Iout| v 5.2 mA

6.0

0.32

0.37

0.40

 

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MC74HCU04A

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

 

 

 

 

Guaranteed Limit

 

 

 

 

 

 

 

 

 

 

 

 

VCC

± 55 to

 

 

 

Symbol

Parameter

Test Conditions

V

25_C

v 85_C

v 125_C

Unit

 

 

 

 

 

 

 

 

Iin

Maximum Input Leakage

Vin = VCC or GND

6.0

± 0.1

± 1.0

± 1.0

μA

 

Current

 

 

 

 

 

 

 

 

 

 

 

 

 

μA

ICC

Maximum Quiescent Supply

Vin = VCC or GND

6.0

1

10

40

 

Current (per Package)

Iout = 0 μA

 

 

 

 

 

NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D). *For VCC = 2.0 V, Vout = 0.2 V or VCC ± 0.2 V.

AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)

 

 

 

Guaranteed Limit

 

 

 

 

 

 

 

 

 

 

VCC

± 55 to

 

 

 

Symbol

Parameter

V

25_C

v 85_C

v 125_C

Unit

 

 

 

 

 

 

 

tPLH,

Maximum Propagation Delay, Input A to Output Y

2.0

70

90

105

ns

tPHL

(Figures 1 and 2)

3.0

40

45

50

 

 

 

4.5

14

18

21

 

 

 

6.0

12

15

18

 

 

 

 

 

 

 

 

tTLH,

Maximum Output Transition Time, Any Output

2.0

75

95

110

ns

tTHL

(Figures 1 and 2)

3.0

27

32

36

 

 

 

4.5

15

19

22

 

 

 

6.0

13

16

19

 

 

 

 

 

 

 

 

Cin

Maximum Input Capacitance

Ð

10

10

10

pF

NOTES:

1. For propagation delays with loads other than 50 pF, see Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D). 2. Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).

 

 

Typical @ 25°C, VCC = 5.0 V

 

CPD

Power Dissipation Capacitance (Per Inverter)*

15

pF

* Used to determine the no±load dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the ON Semiconductor High±Speed CMOS Data Book (DL129/D).

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