Integrated Device Technology Inc IDT7006L15F, IDT7006L15G, IDT7006L20J, IDT7006L20JB, IDT7006L20PF Datasheet

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0 (0)
I/O
Control
Address
Decoder
MEMORY
ARRAY
ARBITRATION
INTERRUPT
LOGIC
Address
Decoder
I/O
Control
R/
W
L
CE
L
OE
L
BUSY
L
A
13L
A
0L
2739 drw 01
I/O
0L
- I/O
7L
CE
L
OE
L
R/
W
L
SEM
L
INT
L
M/
S
BUSY
R
I/O
0R
-I/O
7R
A
13R
A
0R
SEM
R
INT
R
CE
R
OE
R
(2)
(1,2)
(1,2)
(2)
R/
W
R
CE
R
OE
R
R/
W
R
14
14
Integrated Device Technology, Inc.
MILITARY AND COMMERCIAL TEMPERATURE RANGES OCTOBER 1996
©1996 Integrated Device Technology, Inc. DSC-2739/5
IDT7006S/L
HIGH-SPEED
16K x 8 DUAL-PORT
STATIC RAM
FEATURES:
True Dual-Ported memory cells which allow simulta-
neous access of the same memory location
High-speed access
Military: 20/25/35/55/70ns (max.)
Commercial: 15/17/20/25/35/55ns (max.)
Low-power operation
IDT7006S
Active: 750mW (typ.)
Standby: 5mW (typ.)
IDT7006L
Active: 750mW (typ.)
Standby: 1mW (typ.)
IDT7006 easily expands data bus width to 16 bits or
more using the Master/Slave select when cascading
more than one device
•M/
S
= H for
BUSY
output flag on Master,
M/
S
= L for
BUSY
input on Slave
Busy and Interrupt Flags
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
Devices are capable of withstanding greater than 2001V
electrostatic discharge
Battery backup operation—2V data retention
TTL-compatible, single 5V (±10%) power supply
Available in a 68-pin PGA, a 68-pin quad flatpack, a 68-
pin PLCC, and a 64-pin TQFP
Industrial temperature range (–40°C to +85°C) is avail-
able, tested to military electrical specifications
DESCRIPTION:
The IDT7006 is a high-speed 16K x 8 Dual-Port Static
RAM. The IDT7006 is designed to be used as a stand-alone
Dual-Port RAM or as a combination MASTER/SLAVE Dual-
Port RAM for 16-bit-or-more word systems. Using the IDT
MASTER/SLAVE Dual-Port RAM approach in 16-bit or wider
FUNCTIONAL BLOCK DIAGRAM
1
NOTES:
1. (MASTER):
BUSY
is
output;
(SLAVE):
BUSY
is input.
2.
BUSY
outputs
and
INT
outputs are
non-tri-stated
push-pull.
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
6.07
For latest information contact IDT’s web site at www.idt.com or fax-on-demand at 408-492-8391.
6.07 2
IDT7006S/L
HIGH-SPEED 16K x 8 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
memory system applications results in full-speed, error-free
operation without the need for additional discrete logic.
This device provides two independent ports with separate
control, address, and I/O pins that permit independent,
asynchronous access for reads or writes to any location in
memory. An automatic power down feature controlled by
CE
permits the on-chip circuitry of each port to enter a very low
standby power mode.
Fabricated using IDT’s CMOS high-performance technol-
ogy, these devices typically operate on only 750mW of power.
Low-power (L) versions offer battery backup data retention
capability with typical power consumption of 500µW from a 2V
battery.
The IDT7006 is packaged in a ceramic 68-pin PGA, a 68-
pin quad flatpack, a 68-pin PLCC, and a 64-pin TQFP (thin
plastic quad flatpack) . Military grade product is manufactured
in compliance with the latest revision of MIL-STD-883, Class
B, making it ideally suited to military temperature applications
demanding the highest level of performance and reliability.
PIN CONFIGURATIONS
(1,2)
INDEX
IDT7006
PN-64
TQFP
TOP VIEW
(3)
8
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
46
45
44
43
42
41
40
39
38
37
36
35
34
47
48
33
17
18
19
20
32
31
30
29
28
27
26
25
24
23
22
21
49
50
51
52
63
62
61
60
59
58
57
56
55
54
53
64
I/O
2L
V
CC
GND
GND
A
4R
BUSY
L
BUSY
R
INT
R
INT
L
GND
M/
S
OE
L
A
5L
I/O
1L
R/
W
L
CE
L
SEM
L
V
CC
OE
R
CE
R
R/
W
R
SEM
R
A
12R
GND
I/O
3L
I/O
4L
I/O
5L
I/O
6L
I/O
7L
I/O
0R
I/O
1R
I/O
2R
V
CC
I/O
3R
I/O
4R
I/O
5R
I/O
6R
I/O
7R
A
11R
A
10R
A
9R
A
8R
A
7R
A
6R
A
5R
A
3R
A
2R
A
1R
A
0R
A
0L
A
1L
A
2L
A
3L
A
4L
A
6L
A
7L
A
8L
A
9L
A
10L
A
11L
A
12L
I/O
0L
2739 drw 03
A
13R
A
13L
2739 drw 02
12
13
14
15
16
17
18
INDEX
19
20
21
22
98765432168676665
27 28 29 30 31 32 33 34 35 36 37 38 39
V
CC
V
CC
I/O
1R
I/O
2R
I/O
3R
I/O
4R
INT
L
GND
A
4L
A
3L
A
2L
A
1L
A
0L
A
3R
A
0R
A
1R
A
2R
I/O
2L
A
5L
R/
W
L
11
10
M/
S
23
24
25
26
40 41 42 43
58
57
56
55
54
53
52
51
50
49
48
59
60
47
46
45
44
64 63 62 61
I/O
3L
GND
I/O
0R
V
CC
A
4R
BUSY
L
GND
BUSY
R
INT
R
A
12R
I/O
7R
N/C
GND
OE
R
R/
W
R
SEM
R
CE
R
OE
L
SEM
L
CE
L
N/C
I/O
0L
I/O
1L
IDT7006
J68-1
F68-1
PLCC / FLATPACK
TOP VIEW
(3)
I/O
4L
I/O
5L
I/O
6L
I/O
7L
I/O
5R
I/O
6R
N/C
A
12L
N/C
A
11R
A
10R
A
9R
A
8R
A
7R
A
6R
A
5R
A
11L
A
10L
A
9L
A
8L
A
7L
A
6L
A
13R
A
13L
NOTES:
1. All Vcc pins must be connected to the power supply.
2. All GND pins must be connected to the ground supply.
3. This text does not indicate orientation of the the actual part-marking.
IDT7006S/L
HIGH-SPEED 16K x 8 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
6.07 3
Left Port Right Port Names
CE
L
CE
R Chip Enable
R/
W
L R/
W
R Read/Write Enable
OE
L
OE
R Output Enable
A
0L – A13L A0R – A13R Address
I/O
0L – I/O7L I/O0R – I/O7R Data Input/Output
SEM
L
SEM
R Semaphore Enable
INT
L
INT
R Interrupt Flag
BUSY
L
BUSY
R Busy Flag
M/
S
Master or Slave Select
V
CC Power
GND Ground
PIN NAMES
NOTES:
1. All V
CC pins must be connected to power supply.
2. All GND pins must be connected to ground supply.
3. This text does not indicate orientation of the actual part-marking.
2739 tbl 01
2739 drw 04
51 50 48 46 44 42 40 38 36
53
55
57
59
61
63
65
67
68
66
13579
11 13 15
20
22
24
26
28
30
32
35
IDT7006
G68-1
68-PIN PGA
TOP VIEW
(3)
ABCDEFGH JKL
47 45 43 41 34
21
23
25
27
29
31
33
246810121416
18 19
17
56
58
60
62
64
11
10
09
08
07
06
05
04
03
02
01
52
54
49 39 37
A
5L
INT
L
N/C
SEM
L
CE
L
V
CC
OE
L
R/
W
L
I/O
0L
N/C
GND GND
I/O
0R
V
CC
N/C
OE
R
R/
W
R
SEM
R
CE
R
GND
BUSY
R
BUSY
L
M/
S
INT
R
N/C
GND
A
1R
INDEX
A
4L
A
2L
A
0L
A
3R
A
2R
A
4R
A
5R
A
7R
A
6R
A
9R
A
8R
A
11R
A
10R
A
12R
A
0R
A
7L
A
6L
A
3L
A
1L
A
9L
A
8L
A
11L
A
10L
A
12L
V
CC
I/O
2R
I/O
3R
I/O
5R
I/O
6R
I/O
1R
I/O
4R
I/O
7R
I/O
1L
I/O
2L
I/O
4L
I/O
7L
I/O
3L
I/O
5L
I/O
6L
A
13R
A
13L
PIN CONFIGURATIONS (CONT'D)
(1,2)
6.07 4
IDT7006S/L
HIGH-SPEED 16K x 8 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
CAPACITANCE
(1)
(TA = +25°C, f = 1.0MHz)TQFP PACKAGE
Symbol Parameter Conditions
(2)
Max. Unit
C
IN Input Capacitance VIN = 3dV 9 pF
C
OUT Output VOUT = 3dV 10 pF
Capacitance
NOTES: 2739 tbl 07
1. This parameter is determined by device characterization, but is not
production tested.
2. 3dv references the interpolated capacitance when the input and output
signals switch from 0V to 3V or from 3V to 0V.
TRUTH TABLE I – NON-CONTENTION READ/WRITE CONTROL
Inputs
(1)
Outputs
CECE
CECE
CE
R/
WW
WW
W
OEOE
OEOE
OE
SEMSEM
SEMSEM
SEM
I/O
0-7 Mode
H X X H High-Z Deselected: Power-Down
L L X H DATA
IN Write to Memory
L H L H DATA
OUT Read Memory
X X H X High-Z Outputs Disabled
NOTE: 2739 tbl 02
1. A0L — A13L is not equal to A0R — A13R.
TRUTH TABLE II – SEMAPHORE READ/WRITE CONTROL
(1)
Inputs Outputs
CECE
CECE
CE
R/
WW
WW
W
OEOE
OEOE
OE
SEMSEM
SEMSEM
SEM
I/O
0-7 Mode
H H L L DATA
OUT Read Data in Semaphore Flag Data Out
H
u
X L DATA
IN Write I/O0 into Semaphore Flag
L X X L Not Allowed
2739 tbl 03
RECOMMENDED DC OPERATING
CONDITIONS
Symbol Parameter Min. Typ. Max. Unit
V
CC Supply Voltage 4.5 5.0 5.5 V
GND Supply Voltage 0 0 0 V
V
IH Input High Voltage 2.2 6.0
(2)
V
V
IL Input Low Voltage –0.5
(1)
0.8 V
NOTES: 2739 tbl 06
1. VIL -1.5V for pulse width less than 10ns.
2. V
TERM must not exceed Vcc + 0.5V.
RECOMMENDED OPERATING
TEMPERATURE AND SUPPLY VOLTAGE
Ambient
Grade Temperature GND V
CC
Military –55°C to +125°C 0V 5.0V ± 10%
Commercial 0°C to +70°C 0V 5.0V ± 10%
2739 tbl 05
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Rating Commercial Military Unit
V
TERM
(2)
Terminal Voltage –0.5 to +7.0 –0.5 to +7.0 V
with Respect
to GND
T
A Operating 0 to +70 –55 to +125 °C
Temperature
T
BIAS Temperature –55 to +125 –65 to +135 °C
Under Bias
T
STG Storage –55 to +125 –65 to +150 °C
Temperature
I
OUT DC Output 50 50 mA
Current
NOTES: 2739 tbl 04
1. Stresses greater than those listed under ABSOLUTE MAXIMUM
RATINGS may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect reliability.
2. V
TERM must not exceed Vcc + 0.5V for more than 25% of the cycle time
or 10ns maximum, and is limited to
< 20mA for the period of VTERM < Vcc
+ 0.5V.
NOTE:
1. There are eight semaphore flags written to via I/O
0 and read from I/O0 - I/O15. These eight semaphores are addressed by A0 - A2.
IDT7006S/L
HIGH-SPEED 16K x 8 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
6.07 5
DC ELECTRICAL CHARACTERISTICS OVER THE
OPERATING TEMPERATURE AND SUPPLY VOLTAGE RANGE
(VCC = 5.0V ± 10%)
IDT7006S IDT7006L
Symbol Parameter Test Conditions Min. Max. Min. Max. Unit
|I
LI| Input Leakage Current
(1)
VCC = 5.5V, VIN = 0V to VCC —105µA
|I
LO| Output Leakage Current
CE
= VIH, VOUT = 0V to VCC —105µA
V
OL Output Low Voltage IOL = 4mA 0.4 0.4 V
V
OH Output High Voltage IOH = -4mA 2.4 2.4 V
2739 tbl 08
DC ELECTRICAL CHARACTERISTICS OVER THE
OPERATING TEMPERATURE AND SUPPLY VOLTAGE RANGE
(1)
(VCC = 5.0V ± 10%)
7006X15 7006X17 7006X20 7006X25
Test
Com'l. Only Com'l. Only
Symbol Parameter Condition Version
Typ.
(2)
Max.
Typ.
(2)
Max. Typ.
(2)
Max. Typ.
(2)
Max.
Unit
I
CC Dynamic Operating
CE
= VIL, Outputs Open MIL. S 160 370 155 340 mA
Current
SEM
= V
IH L 150 320 145 280
(Both Ports Active) f = f
MAX
(3)
COM.
S 170 310 170 310 160 290 155 265
L 160 260 160 260 150 240 145 220
I
SB1 Standby Current
CE
L =
CE
R = VIH MIL. S 20 90 16 80 mA
(Both Ports — TTL
SEM
R =
SEM
L = VIH L 10 70 10 65
Level Inputs f = f
MAX
(3)
COM.
S 20 60 20 60 20 60 16 60
L 10 50 10 50 10 50 10 50
I
SB2 Standby Current
CE
"A"=VIL and
CE
"B"=VIH
(5)
MIL. S 95 240 90 215 mA
(One Port — TTL Active Port Outputs Open
L 85 210 80 180
Level Inputs) f = f
MAX
(3)
COM.
S 105 190 105 190 95 180 90 170
SEM
R =
SEM
L > VIH L 95 160 95 160 85 150 80 140
I
SB3 Full Standby Current Both Ports
CE
L and MIL. S 1.0 30 1.0 30 mA
(Both Ports — All
CE
R > VCC - 0.2V L 0.2 10 0.2 10
CMOS Level Inputs) V
IN > VCC - 0.2V or
COM.
S 1.0 15 1.0 15 1.0 15 1.0 15
V
IN < 0.2V, f = 0
(4)
L 0.2 5 0.2 5 0.2 5 0.2 5
SEM
R =
SEM
L > VCC-0.2V
I
SB4 Full Standby Current
CE
"A" < 0.2V and MIL. S 90 225 85 200 mA
(One Port — All
CE
"B" > VCC - 0.2V
(5)
CMOS Level Inputs)
SEM
R =
SEM
L > VCC-0.2V L 80 200 75 170
V
IN > VCC - 0.2V or
COM
.S100 170 100 170 90 155 85 145
V
IN < 0.2v
Active Port Outputs Open,
L 90 140 90 140 80 130 75 120
f = f
MAX
(3)
NOTE:
1. At Vcc
2.0V input leakages are undefined.
NOTES: 2739 tbl 09
1. "X" in part numbers indicates power rating (S or L).
2. V
CC = 5V, TA = +25°C, and are not production tested. ICC DC = 120mA (typ.).
3. At f = f
MAX, address and I/O'S are cycling at the maximum frequency read cycle of 1/tRC, and using “AC Test Conditions” of input levels of GND to 3V.
4. f = 0 means no address or control lines change.
5. Port "A"may be either left or right port. Port "B" is the port opposite port "A".
6.07 6
IDT7006S/L
HIGH-SPEED 16K x 8 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
DC ELECTRICAL CHARACTERISTICS OVER THE
OPERATING TEMPERATURE AND SUPPLY VOLTAGE RANGE
(1)
(Cont'd.) (VCC = 5.0V ± 10%)
7006X35 7006X55 7006X70
Test Mil Only
Symbol Parameter Condition Version Typ.
(2)
Max. Typ.
(2)
Max. Typ.
(2)
Max. Unit
I
CC Dynamic Operating
CE
= VIL, Outputs Open MIL. S 150 300 150 300 140 300 mA
Current
SEM
= V
IH L 140 250 140 250 130 250
(Both Ports Active) f = f
MAX
(3)
COM’L. S 150 250 150 250
L 140 210 140 210
I
SB1 Standby Current
CE
L =
CE
R = VIH MIL. S 13 80 13 80 10 80 mA
(Both Ports — TTL
SEM
R =
SEM
L = VIH L10 65 10 65 8 65
Level Inputs) f = f
MAX
(3)
COM’L. S 13 60 13 60
L10 50 10 50
I
SB2 Standby Current
CE
"A"=VIL and
CE
L"B"=VIH
(5)
MIL. S 85 190 85 190 80 190 mA
(One Port — TTL Active Port Outputs Open, L 75 160 75 160 70 160
Level Inputs) f = f
MAX
(3)
COM’L. S 85 155 85 155
SEM
R =
SEM
L = VIH L 75 130 75 130
I
SB3 Full Standby Current Both Ports
CE
L and MIL. S 1.0 30 1.0 30 1.0 30 mA
(Both Ports — All
CE
R > VCC - 0.2V L 0.2 10 0.2 10 0.2 10
CMOS Level Inputs) V
IN > VCC - 0.2V or COM’L. S 1.0 15 1.0 15
V
IN < 0.2V, f = 0
(4)
L 0.2 5 0.2 5
SEM
R =
SEM
L VCC-0.2V
I
SB4 Full Standby Current
CE
"A" < 0.2V and MIL. S 80 175 80 175 75 175 mA
(One Port — All
CE
"B" > VCC - 0.2V
(5)
CMOS Level Inputs)
SEM
R =
SEM
L VCC - 0.2V L 70 150 70 150 65 150
V
IN > VCC - 0.2V or COM’L. S 80 135 80 135
V
IN < 0.2V
Active Port Outputs Open, L 70 110 70 110
f = f
MAX
(3)
DATA RETENTION CHARACTERISTICS OVER ALL TEMPERATURE RANGES (L Version Only)
(VLC = 0.2V, VHC = VCC - 0.2V)
(4)
Symbol Parameter Test Condition Min. Typ.
(1)
Max. Unit
V
DR VCC for Data Retention VCC = 2V 2.0 V
I
CCDR Data Retention Current
CE
VHC MIL. 100 4000 µA
V
IN VHC or VLC COM’L. 100 1500
t
CDR
(3)
Chip Deselect to Data Retention Time
SEM
VHC 0—ns
t
R
(3)
Operation Recovery Time tRC
(2)
——ns
NOTES: 2739 tbl 11
1. TA = +25°C, VCC = 2V, and are not production tested.
2. t
RC = Read Cycle Time
3. This parameter is guaranteed by characterization, but are not production tested.
4. At Vcc = 2V input leakages are undefined
DATA RETENTION MODE
V
CC
CE
2739 drw 05
4.5V
t
CDR
t
R
V
IH
V
DR
V
IH
4.5V
V
DR
2V
DATA RETENTION WAVEFORM
NOTES: 2739 tbl 10
1. "X" in part numbers indicates power rating (S or L).
2. V
CC = 5V, TA = +25°C, and are not production tested. ICC DC =120mA (typ).
3. At f = fMAX, address and I/O'S are cycling at the maximum frequency read cycle of 1/tRC, and using “AC Test Conditions” of input levels of GND to 3V.
4. f = 0 means no address or control lines change.
5. Port "A" may be either left or right port. Port "B"is the opposite from port "A".
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