a
8-Bit Dual Nonvolatile Memory
Digital Potentiometer
FEATURES
Nonvolatile Memory Preset Maintains Wiper Settings Dual Channel, 256-Position Resolution
Full Monotonic Operation DNL < 1 LSB
10 k , 50 k , 100 k Terminal Resistance
Linear or Log Taper Settings
Push-Button Increment/Decrement Compatible SPI-Compatible Serial Data Input with Readback
Function
3 V to 5 V Single Supply or 2.5 V Dual Supply
Operation
14 Bytes of User EEMEM Nonvolatile Memory for Constant Storage
Permanent Memory Write Protection 100-Year Typical Data Retention TA = 55 C
APPLICATIONS
Mechanical Potentiometer Replacement
Instrumentation: Gain, Offset Adjustment
Programmable Voltage-to-Current Conversion
Programmable Filters, Delays, Time Constants
Line Impedance Matching
Power Supply Adjustment
DIP Switch Setting
GENERAL DESCRIPTION
The AD5232 device provides a nonvolatile, dual-channel, digitally controlled variable resistor (VR) with 256-position resolution. These devices perform the same electronic adjustment function as a potentiometer or variable resistor. The AD5232’s versatile programming via a microcontroller allows multiple modes of operation and adjustment.
In the direct program mode a predetermined setting of the RDAC register can be loaded directly from the microcontroller. Another key mode of operation allows the RDAC register to be refreshed with the setting previously stored in the EEMEM register. When changes are made to the RDAC register to establish a new wiper position, the value of the setting can be saved into the EEMEM by executing an EEMEM save operation. Once the settings are saved in the EEMEM register these values will be automatically transferred to the RDAC register to set the wiper position at system power ON. Such operation is enabled by the internal preset strobe and the preset can also be accessed externally.
All internal register contents can be read out of the serial data output (SDO). This includes the RDAC1 and RDAC2 registers, the corresponding nonvolatile EEMEM1 and EEMEM2 registers, and the 14 spare USER EEMEM registers available for constant storage.
*Patent pending.
REV. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
AD5232*
FUNCTIONAL BLOCK DIAGRAM
CS |
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AD5232 |
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RDAC1 |
VDD |
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CLK |
ADDR |
RDAC1 |
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DECODE |
REGISTER |
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A1 |
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SDI |
SDI |
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W1 |
GND |
SERIAL |
EEMEM1 |
B1 |
INTERFACE |
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SDO |
SDO |
RDAC2 |
RDAC2 |
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REGISTER |
A2 |
WP |
EEMEM |
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W2 |
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RDY |
CONTROL |
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B2 |
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EEMEM2 |
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PR |
14 BYTES |
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VSS |
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USER EEMEM |
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The basic mode of adjustment is the increment and decrement command controlling the present setting of the Wiper position setting (RDAC) register. An internal scratch pad RDAC register can be moved UP or DOWN one step of the nominal terminal resistance between terminals A and B. This linearly changes the wiper to B terminal resistance (RWB) by one position segment of the devices’ end-to-end resistance (RAB). For exponential/logarithmic changes in wiper setting, a left/right shift command adjusts levels in ± 6 dB steps, which can be useful for audio and light alarm applications.
The AD5232 is available in a thin TSSOP-16 package. All parts are guaranteed to operate over the extended industrial temperature range of –40° C to +85° C. An evaluation board is available, Part Number: AD5232EVAL.
AB |
100 |
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R |
75 |
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OFPERCENTNOMINAL RESISTANCEEND-TO-END – % |
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50 |
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25 |
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RWB |
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RWA |
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0 |
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64 |
128 |
192 |
256 |
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CODE – Decimal
Figure 1. Symmetrical RDAC Operation
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700 |
www.analog.com |
Fax: 781/326-8703 |
© Analog Devices, Inc., 2001 |
AD5232–SPECIFICATIONS
ELECTRICAL CHARACTERISTICS, 10 k , 50 k , 100 k VERSIONS
( VDD = 3 V 10% or 5 V 10% and VSS = 0 V, VA = +VDD, VB = 0 V, –40 C < TA < +85 C unless otherwise noted.)
Parameter |
Symbol |
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Conditions |
Min |
Typ1 |
Max |
Unit |
DC CHARACTERISTICS |
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RHEOSTAT MODE – Specifications Apply to All VRs |
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± 1/2 |
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Resistor Differential Nonlinearity2 |
R-DNL |
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RWB, VA = NC |
–1 |
+1 |
LSB |
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Resistor Nonlinearity2 |
R-INL |
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RWB, VA = NC |
–0.4 |
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+0.4 |
% FS |
Nominal Resistor Tolerance |
RAB |
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–40 |
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+20 |
% |
Resistance Temperature Coefficient |
RAB/ T |
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600 |
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ppm/° C |
Wiper Resistance |
RW |
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IW = 100 µ A, VDD = 5.5 V, Code = 1EH |
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5 |
100 |
Ω |
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RW |
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IW = 100 µ A, VDD = 3 V, Code = 1EH |
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200 |
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Ω |
POTENTIOMETER DIVIDER MODE — Specifications Apply to All VRs |
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Resolution |
N |
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8 |
± 1/2 |
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Bits |
Differential Nonlinearity3 |
DNL |
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–1 |
+1 |
LSB |
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Integral Nonlinearity3 |
INL |
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–0.4 |
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+0.4 |
% FS |
Voltage Divider Temperature Coefficient |
VW/ T |
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Code = Half-Scale |
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15 |
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ppm/° C |
Full-Scale Error |
VWFSE |
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Code = Full-Scale |
–3 |
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0 |
% FS |
Zero-Scale Error |
VWZSE |
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Code = Zero-Scale |
0 |
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+3 |
% FS |
RESISTOR TERMINALS |
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Terminal Voltage Range4 |
VA,B,W |
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VSS |
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VDD |
V |
Capacitance5 Ax, Bx |
CA,B |
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f = 1 MHz, Measured to GND, |
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Capacitance5 Wx |
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Code = Half-Scale |
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45 |
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pF |
CW |
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f = 1 MHz, Measured to GND, |
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Code = Half-Scale |
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60 |
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pF |
Common-Mode Leakage Current5, 6 |
ICM |
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VW = VDD/2 |
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0.01 |
1 |
µ A |
DIGITAL INPUTS AND OUTPUTS |
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Input Logic High |
VIH |
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With Respect to GND, VDD = 5 V |
2.4 |
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V |
Input Logic Low |
VIL |
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With Respect to GND, VDD = 5 V |
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0.8 |
V |
Input Logic High |
VIH |
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With Respect to GND, VDD= 3 V |
2.1 |
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V |
Input Logic Low |
VIL |
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With Respect to GND, VDD = 3 V |
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0.6 |
V |
Input Logic High |
VIH |
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With Respect to GND, VDD = +2.5 V, |
2.0 |
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V |
Input Logic Low |
VIL |
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VSS = –2.5 V |
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With Respect to GND, VDD = +2.5 V, |
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0.5 |
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V |
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VSS = –2.5 V |
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Output Logic High (SDO and RDY) |
VOH |
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RPULL-UP = 2.2 kΩ to 5 V |
4.9 |
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V |
Output Logic Low |
VOL |
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IOL = 1.6 mA, VLOGIC = 5 V |
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0.4 |
V |
Input Current |
IIL |
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VIN = 0 V or VDD |
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± 2.5 |
µ A |
Input Capacitance5 |
CIL |
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4 |
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pF |
POWER SUPPLIES |
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Single-Supply Power Range |
VDD |
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VSS = 0 V |
2.7 |
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5.5 |
V |
Dual-Supply Power Range |
VDD/VSS |
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± 2.25 |
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± 2.75 |
V |
Positive Supply Current |
IDD |
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VIH = VDD or VIL = GND |
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3.5 |
10 |
µ A |
Programming Mode Current |
IDD(PG) |
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VIH = VDD or VIL = GND |
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35 |
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mA |
Read Mode Current7 |
IDD(XFR) |
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VIH = VDD or VIL = GND |
0.9 |
3 |
9 |
mA |
Negative Supply Current |
ISS |
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VIH = VDD or VIL = GND, |
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µ A |
Power Dissipation8 |
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VDD = +2.5 V, VSS = –2.5 V |
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3.5 |
10 |
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PDISS |
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VIH = VDD or VIL = GND |
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0.018 |
0.05 |
mW |
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Power Supply Sensitivity5 |
PSS |
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VDD = 5 V ± 10% |
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0.002 |
0.01 |
%/% |
–2– |
REV. 0 |
AD5232
Parameter |
Symbol |
Conditions |
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Min Typ1 |
Max |
Unit |
DYNAMIC CHARACTERISTICS5, 9 |
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–3 dB, BW_10 kΩ , R = 10 kΩ |
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Bandwidth |
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500 |
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kHz |
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Total Harmonic Distortion |
THDW |
VA = 1 V rms, VB = 0 V, f = 1 kHz, |
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THDW |
RAB = 10 kΩ |
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0.022 |
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% |
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VA =1 V rms, VB = 0 V, f = 1 kHz, |
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RAB = 50 kΩ , 100 kΩ |
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0.045 |
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% |
VW Settling Time |
tS |
VDD = 5 V, VSS = 0 V, VA = VDD, VB = 0 V, |
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VW = 0.50% Error Band, Code 00H to 80H |
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For RAB = 10 kΩ /50 kΩ |
/100 kΩ |
0.65/3/6 |
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µ s |
Resistor Noise Voltage |
eN_WB |
RWB = 5 kΩ , f = 1 kHz |
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9 |
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nV/√ Hz |
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Crosstalk (CW1/CW2) |
CT |
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VA = VDD, VB = 0 V, Measure VW with |
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Adjacent VR Making Full-Scale Code Change |
–5 |
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nV-s |
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Analog Crosstalk (CW1/CW2) |
CTA |
VA1 = VDD, VB1 = 0 V, Measure VW1 |
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with VW2 = 5 V p-p @ f = 10 kHz, |
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Code1 = 80H; Code2 = FFH |
–70 |
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dB |
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INTERFACE TIMING CHARACTERISTICS – Applies to All Parts5, 10 |
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Clock Cycle Time (tCYC) |
t1 |
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20 |
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ns |
CS Setup Time |
t2 |
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10 |
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ns |
CLK Shutdown Time to CS Rise |
t3 |
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1 |
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tCYC |
Input Clock Pulsewidth |
t 4 , t 5 |
Clock Level High or Low |
10 |
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ns |
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Data Setup Time |
t6 |
From Positive CLK Transition |
5 |
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ns |
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Data Hold Time |
t7 |
From Positive CLK Transition |
5 |
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ns |
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CS to SDO-SPI Line Acquire |
t8 |
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40 |
ns |
CS to SDO-SPI Line Release |
t 9 |
RP = 2.2 kΩ , CL < 20 pF |
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50 |
ns |
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CLK to SDO Propagation Delay11 |
t10 |
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50 |
ns |
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CLK to SDO Data Hold Time |
t11 |
RP = 2.2 kΩ , CL < 20 pF |
0 |
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ns |
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CS High Pulsewidth12 |
t12 |
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10 |
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ns |
CS High to CS High12 |
t 13 |
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4 |
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tCYC |
RDY Rise to CS Fall |
t 14 |
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0 |
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ns |
CS Rise to RDY Fall Time |
t 15 |
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0.1 |
0.15 |
ms |
Read/Store to Nonvolatile EEMEM13 |
t 16 |
Applies to Command 2H, 3H, 9H |
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25 |
ms |
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CS Rise to Clock Rise/Fall Setup |
t17 |
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10 |
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ns |
Preset Pulsewidth (Asynchronous) |
tPRW |
Not Shown in Timing Diagram |
50 |
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ns |
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Preset Response Time to RDY High |
tPRESP |
PR Pulsed Low to Refreshed |
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µ s |
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Wiper Positions |
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70 |
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FLASH/EE MEMORY RELIABILITY CHARACTERISTICS |
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Endurance14 |
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100 |
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K Cycles |
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Data Retention15 |
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100 |
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Years |
NOTES
1Typical parameters represent average readings at 25° C and VDD = 5 V.
2Resistor position nonlinearity error R-INL is the deviation from an ideal value measured between the maximum resistance and the minimum resistance wiper postions. R-DNL measures the relative step change from ideal between successive tap positions. Parts are guaranteed monotonic. I W ~ 50 µ A @ VDD = 2.7 V and
IW ~ 400 µ A @ VDD = 5 V for the RAB = 10 kΩ version, IW ~ 50 µ A for the RAB = 50 kΩ and IW ~ 25 µ A for the RAB = 100 kΩ version. See Figure 13.
3INL and DNL are measured at VW with the RDAC configured as a potentiometer divider similar to a voltage output D/A converter. V A = VDD and VB = VSS. DNL specification limits of ± 1 LSB maximum are Guaranteed Monotonic operating conditions. See Figure 14.
4Resistor terminals A, B, W have no limitations on polarity with respect to each other. Dual Supply Operation enables ground-referenced bipolar signal adjustment. 5Guaranteed by design and not subject to production test.
6Common-mode leakage current is a measure of the dc leakage from any terminal A, B, W to a common-mode bias level of VDD/2.
7Transfer (XFR) Mode current is not continuous. Current consumed while EEMEM locations are read and transferred to the RDAC register. See TPC 9.
8PDISS is calculated from (IDD VDD) + (ISS VSS).
9All dynamic characteristics use VDD = +2.5 V and VSS = –2.5 V unless otherwise noted.
10See timing diagram for location of measured values. All input control voltages are specified with t R = tF = 2.5 ns (10% to 90% of 3 V) and timed from a voltage level of 1.5 V. Switching characteristics are measured using both VDD = 3 V or 5 V.
11Propagation delay depends on value of VDD, RPULL_UP, and CL. See applications text. 12Valid for commands that do not activate the RDY pin.
13RDY pin low only for instruction commands 8, 9, 10, 2, 3, and the PR hardware pulse: CMD_8 ~ 1 ms; CMD_9,10 ~ 0.12 ms; CMD_2,3 ~ 20 ms. Device operation at TA = –40° C and VDD < 3 V extends the save time to 35 ms.
14Endurance is qualified to 100,000 cycles as per JEDEC Std. 22 method A117 and measured at V DD = 2.7 V, TA = –40° C to +85° C, typical endurance at 25° C is 700,000 cycles.
15Retention lifetime equivalent at junction temperature (TJ) = 55° C as per JEDEC Std. 22, Method A117. Retention lifetime based on an activation energy of 0.6eV will derate with junction temperature as shown in Figure 23 in the Flash/EE Memory description section of this data sheet. The AD5232 contains 9,646 transistors. Die size: 69 mil 115 mil, 7,993 sq. mil.
Specifications subject to change without notice
REV. 0 |
–3– |
AD5232
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CPHA = 1 |
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CS |
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t12 |
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t1 |
t3 |
t13 |
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t2 |
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CLK |
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t5 |
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CPOL = 1 |
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t17 |
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t4 |
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t8 |
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t10 |
t9 |
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t11 |
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SDO |
* |
MSB |
LSB OUT |
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t7 |
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t6 |
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SDI |
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MSB |
LSB |
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t14 |
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t15 |
RDY |
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t16 |
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*NOT DEFINED, BUT NORMALLY LSB OF CHARACTER PREVIOUSLY TRANSMITTED.
THE CPOL = 1 MICROCONTROLLER COMMAND ALIGNS THE INCOMING DATA TO THE POSITIVE EDGE OF THE CLOCK.
Figure 2a. CPHA = 1 Timing Diagram
CS |
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CPHA = 0 |
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t12 |
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t1 |
t3 |
t13 |
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t2 |
t5 |
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t17 |
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CLK |
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t4 |
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CPOL = 0 |
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t8 |
t10 |
t11 |
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t9 |
SDO |
MSB OUT |
LSB |
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* |
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t7 |
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t6 |
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SDI |
MSB IN |
LSB |
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t14 |
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t15 |
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t16 |
RDY |
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*NOT DEFINED, BUT NORMALLY MSB OF CHARACTER JUST RECEIVED.
THE CPOL = 0 MICROCONTROLLER COMMAND ALIGNS THE INCOMING DATA TO THE POSITIVE EDGE OF THE CLOCK.
Figure 2b. CPHA = 0 Timing Diagram
–4– |
REV. 0 |
AD5232
ABSOLUTE MAXIMUM RATINGS1
(TA = 25° C, unless otherwise noted) |
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VDD to GND . . . . . . . . . . . . . . . . . . |
. . . . . |
. . . . . –0.3 V, +7 V |
VSS to GND . . . . . . . . . . . . . . . . . . . . |
. . . . |
. . . . +0.3 V, –7 V |
VDD to VSS . . . . . . . . . . . . . . . . . . . . . |
. . . . |
. . . . . . . . . . . . 7 V |
VA, VB, VW to GND . . . . . . . . . . . . . |
VSS – 0.3 V, VDD + 0.3 V |
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AX – BX, AX – WX, BX – WX |
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± 20 mA |
Intermittent2 . . . . . . . . . . . . . . . . . |
. . . . |
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Continuous . . . . . . . . . . . . . . . . . . |
. . . . |
. . . . . . . . . ± 2 mA |
Digital Inputs and Output Voltage to |
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–0.3 V, VDD +0.3 V |
GND . . . . . . . . . . . . . . . . . . . . . . . |
. . . |
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Operating Temperature Range3 . . . . . |
. . . . |
. . –40° C to +85° C |
Maximum Junction Temperature (TJ |
Max) |
. . . . . . . . 150° C |
Storage Temperature . . . . . . . . . . . . . |
. . . . |
. –65° C to +150° C |
Lead Temperature, Soldering |
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215° C |
Vapor Phase (60 sec) . . . . . . . . . . . |
. . . . |
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Infrared (15 sec) . . . . . . . . . . . . . . |
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. . . . . . . . . 220° C |
Package Power Dissipation . . . . . . . . . . . . . |
(TJ Max – TA)/ JA |
Thermal Resistance Junction-to-Ambient JA, |
150° C/W |
TSSOP-16 . . . . . . . . . . . . . . . . . . . . . . . . |
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Thermal Resistance Junction-to-Case JC, |
28° C/W |
TSSOP-16 . . . . . . . . . . . . . . . . . . . . . . . . . |
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2Maximum terminal current is bounded by the maximum current handling of the switches, maximum power dissipation of the package, and maximum applied voltage across any two of the A, B, and W terminals at a given resistance.
3Includes programming of nonvolatile memory.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD5232 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
ORDERING GUIDE
WARNING!
ESD SENSITIVE DEVICE
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Number of |
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Number of |
End-to-End |
Temperature |
Package |
Package |
Devices per |
Branding* |
Model |
Channels |
R AB (k ) |
Range (° C) |
Description |
Option |
Container |
Information |
AD5232BRU10 |
2 |
10 |
–40 to +85 |
TSSOP-16 |
RU-16 |
96 |
5232B10 |
AD5232BRU10-REEL7 |
2 |
10 |
–40 to +85 |
TSSOP-16 |
RU-16 |
1,000 |
5232B10 |
AD5232BRU50 |
2 |
50 |
–40 to +85 |
TSSOP-16 |
RU-16 |
96 |
5232B50 |
AD5232BRU50-REEL7 |
2 |
50 |
–40 to +85 |
TSSOP-16 |
RU-16 |
1,000 |
5232B50 |
AD5232BRU100 |
2 |
100 |
–40 to +85 |
TSSOP-16 |
RU-16 |
96 |
5232BC |
AD5232BRU100-REEL7 |
2 |
100 |
–40 to +85 |
TSSOP-16 |
RU-16 |
1,000 |
5232BC |
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*Line 1 contains ADI logo symbol and the data code YYWW, line 2 contains detail model number listed in this column.
REV. 0 |
–5– |
AD5232
PIN CONFIGURATION
CLK |
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RDY |
1 |
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16 |
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SDI |
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CS |
2 |
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15 |
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SDO |
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PR |
3 |
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14 |
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GND |
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AD5232 |
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4 |
13 |
WP |
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VSS |
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TOP VIEW |
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VDD |
5 |
(Not to Scale) |
12 |
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A1 |
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A2 |
6 |
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11 |
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W1 |
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W2 |
7 |
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10 |
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B1 |
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B2 |
8 |
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9 |
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PIN FUNCTION DESCRIPTIONS |
Pin |
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|
Number |
Mnemonic |
Description |
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|
1 |
CLK |
Serial Input Register Clock Pin. Shifts in one bit at a time on positive clock edges. |
2 |
SDI |
Serial Data Input Pin. MSB Loaded First. |
3 |
SDO |
Serial Data Output Pin. Open Drain Output requires external pull-up resistor. Commands 9 and 10 |
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activate the SDO output. See Table II. Other commands shift out the previously loaded SDI bit |
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pattern delayed by 16 clock pulses. This allows daisy-chain operation of multiple packages. |
4 |
GND |
Ground Pin, Logic Ground Reference. |
5 |
VSS |
Negative Supply. Connect to zero volts for single supply applications. |
6 |
A1 |
A Terminal of RDAC1 |
7 |
W1 |
Wiper Terminal of RDAC1, ADDR(RDAC1) = 0H |
8 |
B1 |
B Terminal of RDAC1 |
9 |
B2 |
B Terminal of RDAC2 |
10 |
W2 |
Wiper Terminal of RDAC2, ADDR(RDAC2) = 1H |
11 |
A2 |
A Terminal of RDAC2 |
12 |
VDD |
Positive Power Supply Pin |
13 |
WP |
Write Protect Pin. When active low, WP prevents any changes to the present register contents, except |
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PR and CMD 1 and 8 will refresh RDAC register from EEMEM. Execute a NOP instruction before |
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returning WP to logic high. |
14 |
PR |
Hardware Override Preset Pin. Refreshes the scratch pad register with current contents of the EEMEM |
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register. Factory default loads midscale 80H until EEMEM is loaded with a new value by the user |
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(PR is activated at the logic high transition). |
15 |
CS |
Serial Register Chip Select Active Low. Serial register operation takes place when CS returns to logic high. |
16 |
RDY |
Ready. Active-high open drain output, requires pull-up resistor. Identifies completion of commands |
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2, 3, 8, 9, 10, and PR. |
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–6– |
REV. 0 |