WMF512K8-XXX5
HI-RELIABILITY PRODUCT
512Kx8 MONOLITHIC FLASH, SMD 5962-96692
FEATURES
■Access Times of 70, 90, 120, 150ns
■Packaging
•32 pin, Hermetic Ceramic, 0.600" DIP (Package 300)
•32 lead, Hermetic Ceramic, 0.400" SOJ (Package 101)
•32 pin, Rectangular Ceramic Leadless Chip Carrier (Package 601)
•32 lead Flatpack (Package 220)
■1,000,000 Erase/Program Cycles Minimum
■Sector Erase Architecture
•8 equal size sectors of 64K bytes each
•Any combination of sectors can be concurrently erased. Also supports full chip erase
■Organized as 512Kx8
■Commercial, Industrial and Military Temperature Ranges
■5 Volt Programming. 5V ± 10% Supply.
■Low Power CMOS
■Embedded Erase and Program Algorithms
■TTL Compatible Inputs and CMOS Outputs
■Page Program Operation and Internal Program Control Time.
Note: For programming information refer to Flash Programming 4M5 Application Note.
PIN CONFIGURATION FOR WMF512K8-XXX5
32 |
DIP |
32 CSOJ |
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32 |
Flatpack |
TOP VIEW |
A18 |
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1 |
32 |
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VCC |
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A16 |
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2 |
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31 |
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WE |
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A15 |
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3 |
30 |
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A17 |
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A12 |
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4 |
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A14 |
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A7 |
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5 |
28 |
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A13 |
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A6 |
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6 |
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A8 |
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A5 |
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7 |
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A9 |
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A4 |
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8 |
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A11 |
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A3 |
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9 |
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OE |
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A2 |
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10 |
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A10 |
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A1 |
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11 |
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CS |
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A0 |
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12 |
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I/O7 |
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I/O0 |
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13 |
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I/O6 |
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I/O1 |
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14 |
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I/O5 |
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I/O2 |
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15 |
18 |
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I/O4 |
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VSS |
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16 |
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I/O3 |
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PIN CONFIGURATION FOR WMF512K8-XCLX5
32 CLCC
TOP VIEW
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A12 |
A15 |
A16 |
A18 |
VCC |
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WE |
A17 |
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1 |
32 31 30 |
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A7 |
5 |
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29 |
A14 |
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A6 |
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28 |
A13 |
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A5 |
7 |
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27 |
A8 |
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A4 |
8 |
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26 |
A9 |
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A3 |
9 |
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25 |
A11 |
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A2 |
10 |
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24 |
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OE |
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A1 |
11 |
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23 |
A10 |
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A0 |
12 |
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22 |
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CS |
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I/O0 |
13 |
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21 |
I/O7 |
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14 15 16 17 18 19 20 |
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I/O1 |
I/O2 |
VSS |
I/O3 |
I/O4 |
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I/O5 |
I/O6 |
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PIN DESCRIPTION |
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A0-18 |
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Address Inputs |
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I/O0-7 |
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Data Input/Output |
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Chip Select |
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CS |
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Output Enable |
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OE |
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Write Enable |
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WE |
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VCC |
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+5.0V Power |
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VSS |
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Ground |
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May 1999 Rev. 3 |
1 |
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520 |
WMF512K8-XXX5
ABSOLUTE MAXIMUM RATINGS (1)
Parameter |
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Unit |
Operating Temperature |
-55 to +125 |
°C |
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Supply Voltage (VCC) (1) |
-2.0 to +7.0 |
V |
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Signal Voltage Range(any pin except A9) (2) |
-2.0 to +7.0 |
V |
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Storage Temperature Range |
-65 to +150 |
°C |
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Lead Temperature (soldering, 10 seconds) |
+300 |
°C |
Data Retention Mil Temp |
20 |
years |
Endurance - erase/program cycles (Mil Temp) |
100,000 min |
cycles |
A9 Voltage for sector protect (VID) (3) |
-2.0 to +14.0 |
V |
NOTES:
1.Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability.
2.Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs may overshoot VSS to -2.0 V for periods of up to 20ns. Maximum DC voltage on output and I/O pins is VCC + 0.5V. During voltage transitions, outputs may overshoot to Vcc + 2.0 V for periods of up to 20ns.
3.Minimum DC input voltage on A9 pin is -0.5V. During voltage transitions, A9 may overshoot Vss to -2V for periods of up to 20ns. Maximum DC input voltage on A9 is +13.5V which may overshoot to 14.0 V for periods up to 20ns.
RECOMMENDED OPERATING CONDITIONS
Parameter |
Symbol |
Min |
Max |
Unit |
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Supply Voltage |
VCC |
4.5 |
5.5 |
V |
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Input High Voltage |
VIH |
2.0 |
Vcc + 0.5 |
V |
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Input Low Voltage |
VIL |
-0.5 |
+0.8 |
V |
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Operating Temp. (Mil.) |
TA |
-55 |
+125 |
°C |
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Operating Temp. (Ind.) |
TA |
-40 |
+85 |
°C |
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A9 Voltage for Sector Protect |
VID |
11.5 |
12.5 |
V |
CAPACITANCE
(TA = +25°C)
Parameter |
Symbol |
Conditions |
Max |
Unit |
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Address Input capacitance |
CAD |
VI/O = 0 V, f = 1.0 MHz |
15 |
pF |
Output Enable capacitance |
COE |
VIN = 0 V, f = 1.0 MHz |
15 |
pF |
Write Enable capacitance |
CWE |
VIN = 0 V, f = 1.0 MHz |
15 |
pF |
Chip Select capacitance |
CCS |
VIN = 0 V, f = 1.0 MHz |
15 |
pF |
Data I/O capacitance |
CI/O |
VI/O = 0 V, f = 1.0 MHz |
15 |
pF |
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This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS - CMOS COMPATIBLE
(VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C)
Parameter |
Symbol |
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Conditions |
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Unit |
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Min |
Max |
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Input Leakage Current |
ILI |
VCC = 5.5, VIN = GND to VCC |
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10 |
A |
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Output Leakage Current |
ILOx32 |
VCC = 5.5, VIN = GND to VCC |
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10 |
A |
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VCC Active Current for Read (1) |
ICC1 |
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= VIL, |
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= VIH, f = 5MHz |
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50 |
mA |
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CS |
OE |
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VCC Active Current for Program |
ICC2 |
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= VIL, |
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= VIH |
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CS |
OE |
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or Erase (2) |
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60 |
mA |
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VCC Standby Current |
ICC4 |
VCC = 5.5, |
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= VIH, f = 5MHz |
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1.6 |
mA |
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CS |
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Output Low Voltage |
VOL |
IOL = 8.0 mA, VCC = 4.5 |
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0.45 |
V |
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Output High Voltage |
VOH1 |
IOH = -2.5 mA, VCC = 4.5 |
0.85 x VCC |
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V |
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Low VCC Lock-Out Voltage |
VLKO |
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3.2 |
4.2 |
V |
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NOTES:
1.The ICC current listed includes both the DC operating current and the frequency dependent component (at 5 MHz). The frequency component typically is less than 2 mA/MHz, with OE at VIH.
2.ICC active while Embedded Algorithm (program or erase) is in progress.
3.DC test conditions: VIL = 0.3V, VIH = VCC - 0.3V
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520 |
2 |
WMF512K8-XXX5
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS,CS CONTROLLED
(VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C)
Parameter |
Symbol |
-70 |
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-90 |
-120 |
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-150 |
Unit |
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Min |
Max |
Min |
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Max |
Min |
Max |
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Write Cycle Time |
tAVAV |
tWC |
70 |
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90 |
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120 |
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150 |
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ns |
Write Enable Setup Time |
tWLEL |
tWS |
0 |
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0 |
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0 |
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0 |
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ns |
Chip Select Pulse Width |
tELEH |
tCP |
45 |
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45 |
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50 |
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50 |
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ns |
Address Setup Time |
tAVEL |
tAS |
0 |
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0 |
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0 |
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0 |
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ns |
Data Setup Time |
tDVEH |
tDS |
45 |
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45 |
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50 |
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50 |
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ns |
Data Hold Time |
tEHDX |
tDH |
0 |
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0 |
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0 |
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0 |
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ns |
Address Hold Time |
tELAX |
tAH |
45 |
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45 |
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50 |
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50 |
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ns |
Chip Select Pulse Width High |
tEHEL |
tCPH |
20 |
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20 |
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20 |
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20 |
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ns |
Duration of Byte Programming Operation (1) |
tWHWH1 |
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300 |
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300 |
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300 |
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300 |
µs |
Sector Erase Time (2) |
tWHWH2 |
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15 |
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15 |
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15 |
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15 |
sec |
Read Recovery Time |
tGHEL |
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0 |
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0 |
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0 |
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0 |
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ns |
Chip Programming Time |
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11 |
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11 |
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11 |
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11 |
sec |
Chip Erase Time (3) |
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64 |
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64 |
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64 |
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64 |
sec |
NOTES:
1.Typical value for tWHWH1 is 7µs.
2.Typical value for tWHWH2 is 1sec.
3.Typical value for Chip Erase time is 8sec.
AC TEST CIRCUIT |
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AC TEST CONDITIONS |
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I OL |
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Parameter |
Typ |
Unit |
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Current Source |
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Input Pulse Levels |
VIL = 0, VIH = 3.0 |
V |
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Input Rise and Fall |
5 |
ns |
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Input and Output Reference Level |
1.5 |
V |
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D.U.T. |
VZ ≈1.5V |
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Output Timing Reference Level |
1.5 |
V |
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Ceff = 50 pf |
(Bipolar Supply) |
NOTES: |
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VZ is programmable from -2V to +7V. |
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IOL & IOH programmable from 0 to 16mA. |
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Tester Impedance Z0 = 75 Ω. |
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IOH |
VZ is typically the midpoint of VOH and VOL. |
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Current Source |
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IOL & IOH are adjusted to simulate a typical resistive load circuit. |
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ATE tester includes jig capacitance. |
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3 |
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White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520 |
WMF512K8-XXX5
AC CHARACTERISTICS – WRITE/ERASE/PROGRAM OPERATIONS, WE CONTROLLED
(VCC = 5.0V, TA = -55°C to +125°C)
Parameter |
Symbol |
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-70 |
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-90 |
-120 |
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-150 |
Unit |
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Min |
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Max |
Min |
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Max |
Min |
Max |
Min |
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Max |
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Write Cycle Time |
tAVAV |
tWC |
70 |
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90 |
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120 |
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150 |
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ns |
Chip Select Setup Time |
tELWL |
tCS |
0 |
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0 |
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0 |
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0 |
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ns |
Write Enable Pulse Width |
tWLWH |
tWP |
45 |
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45 |
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50 |
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50 |
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ns |
Address Setup Time |
tAVWH |
tAS |
0 |
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0 |
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0 |
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0 |
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ns |
Data Setup Time |
tDVWH |
tDS |
45 |
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45 |
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50 |
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50 |
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ns |
Data Hold Time |
tWHDX |
tDH |
0 |
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0 |
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0 |
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0 |
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ns |
Address Hold Time |
tWHAX |
tAH |
45 |
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45 |
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50 |
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50 |
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ns |
Write Enable Pulse Width High |
tWHWL |
tWPH |
20 |
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20 |
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20 |
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20 |
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ns |
Duration of Byte Programming Operation (1) |
tWHWH1 |
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300 |
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300 |
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300 |
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300 |
s |
Sector Erase Time (2) |
tWHWH2 |
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15 |
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15 |
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15 |
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15 |
sec |
Read Recovery Time before Write |
tGHWL |
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0 |
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0 |
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0 |
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0 |
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ms |
VCC Set-up Time |
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tvcs |
50 |
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50 |
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50 |
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50 |
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s |
Chip Programming Time |
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11 |
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11 |
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11 |
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11 |
sec |
Output Enable Setup Time |
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tOES |
0 |
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0 |
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0 |
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0 |
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ns |
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Output Enable Hold Time (4) |
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tOEH |
10 |
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10 |
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10 |
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10 |
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ns |
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Chip Erase Time (3) |
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64 |
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64 |
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64 |
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64 |
sec |
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NOTES:
1.Typical value for tWHWH1 is 7 s.
2.Typical value for tWHWH2 is 1sec.
3.Typical value for Chip Erase time is 8sec.
4.For Toggle and Data Polling.
AC CHARACTERISTICS – READ ONLY OPERATIONS
(VCC = 5.0V, TA = -55°C to +125°C)
Parameter |
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Symbol |
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-70 |
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-90 |
-120 |
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-150 |
Unit |
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Min |
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Max |
Min |
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Max |
Min |
Max |
Min |
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Max |
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Read Cycle Time |
tAVAV |
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tRC |
70 |
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90 |
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120 |
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150 |
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ns |
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Address Access Time |
tAVQV |
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tACC |
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70 |
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90 |
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120 |
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150 |
ns |
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Chip Select Access Time |
tELQV |
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tCE |
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70 |
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90 |
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120 |
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150 |
ns |
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Output Enable to Output Valid |
tGLQV |
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tOE |
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35 |
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35 |
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50 |
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55 |
ns |
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Chip Select to Output High Z (1) |
tEHQZ |
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tDF |
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20 |
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20 |
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30 |
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35 |
ns |
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Output Enable High to Output High Z (1) |
tGHQZ |
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tDF |
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20 |
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20 |
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30 |
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35 |
ns |
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Output Hold from Address, |
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or |
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Change, |
tAXQX |
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tOH |
0 |
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0 |
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0 |
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0 |
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ns |
CS |
OE |
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whichever is First |
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NOTES: |
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1. Guaranteed by design, but not tested |
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White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520 |
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