White Electronic Designs WME128K8-300CCA, WME128K8-250DEQA, WME128K8-250DEQ, WME128K8-250DEMA, WME128K8-250DEM Datasheet

...
0 (0)

White Electronic Designs

WME128K8-XXX

128Kx8 CMOS MONOLITHIC EEPROM, SMD 5962-96796

FIG. 1

PIN CONFIGURATION

32 DIP

32 CSOJ

TOP VIEW

NC

 

 

1

32

 

 

VCC

 

 

 

 

A16

 

 

2

31

 

 

 

 

 

 

 

 

 

WE

A15

 

 

3

30

 

 

NC

 

 

 

 

A12

 

 

4

29

 

 

A14

 

 

 

 

A7

 

 

5

28

 

 

A13

 

 

 

 

A6

 

 

6

27

 

 

A8

 

 

 

 

A5

 

 

7

26

 

 

A9

 

 

 

 

A4

 

 

8

25

 

 

A11

 

 

 

 

A3

 

 

9

24

 

 

 

 

 

 

 

 

 

OE

A2

 

 

10

23

 

 

A10

 

 

 

 

A1

 

 

11

22

 

 

 

 

 

 

 

 

 

CS

 

 

 

 

A0

 

 

12

21

 

 

I/O7

 

 

 

 

I/O0

 

 

13

20

 

 

I/O6

 

 

 

 

I/O1

 

 

14

19

 

 

I/O5

 

 

 

 

I/O2

 

15

18

 

 

I/O4

 

 

 

VSS

 

16

17

 

 

I/O3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PIN DESCRIPTION

 

 

 

 

 

 

 

 

 

A0-16

 

Address Inputs

 

 

 

 

 

 

 

 

 

I/O0-7

 

Data Input/Output

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Chip Select

 

 

 

CS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Output Enable

 

 

OE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

WE

 

Write Enable

 

 

 

 

 

 

 

 

 

Vcc

 

+5.0V Power

 

 

 

 

 

 

 

 

 

VSS

 

Ground

 

 

 

 

 

 

 

 

 

FEATURES

Read Access Times of 120, 140, 150, 200, 250, 300ns

JEDEC Approved Packages

32 pin, Hermetic Ceramic, 0.600" DIP (Package 300)

32 lead, Hermetic Ceramic, 0.400" SOJ (Package

101)

Commercial, Industrial and Military Temperature Ranges

MIL-STD-883 Compliant Devices Available

Write Endurance 10,000 Cycles

Data Retention at 25°C, 10 Years

Low Power CMOS Operation

Automatic Page Write Operation

Internal Address and Data Latches for 128 Bytes

Internal Control Timer

Page Write Cycle Time 10ms Max.

Data Polling for End of Write Detection

Hardware and Software Data Protection

TTL Compatible Inputs and Outputs

1 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

February 2002 Rev. 3

White Electronic Designs

WME128K8-XXX

ABSOLUTE MAXIMUM RATINGS

Parameter

Symbol

 

Unit

Operating Temperature

TA

-55 to +125

°C

 

 

 

 

 

 

Storage Temperature

TSTG

-65 to +150

°C

 

 

 

 

 

 

Signal Voltage Any Pin

VG

-0.6 to + 6.25

V

 

 

 

 

Voltage on

OE

and A9

 

-0.6 to +13.5

V

 

 

 

 

 

 

NOTE:

Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

RECOMMENDED OPERATING CONDITIONS

Parameter

Symbol

Min

 

Max

Unit

 

SupplyVoltage

VCC

4.5

 

5.5

V

Input High Voltage

VIH

2.0

 

VCC +0.3

V

Input Low Voltage

VIL

-0.3

 

+0.8

V

OperatingTemp. (Mil.)

TA

-55

 

+125

°C

OperatingTemp. (Ind.)

TA

-40

 

+85

°C

TRUTH TABLE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CS

 

OE

 

 

WE

Mode

 

Data I/O

 

 

H

 

 

X

 

 

X

Standby

 

High Z

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

L

 

 

L

 

 

H

Read

 

Data Out

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

L

 

 

H

 

 

L

Write

 

Data In

 

 

X

 

 

H

 

 

X

Out Disable

High Z/Data Out

 

X

 

 

X

 

 

H

Write

 

 

 

 

 

X

 

 

L

 

 

X

Inhibit

 

 

 

 

 

 

 

 

 

 

 

 

 

CAPACITANCE

 

 

 

 

 

 

 

 

 

 

 

 

(TA = +25°C)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Parameter

 

 

 

 

 

Sym

Condition

 

 

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

Max

 

 

Input Capacitance

 

CIN

VIN = 0V, f = 1MHz

20

 

pF

Output Capacitance

 

COUT

VI/O = 0V, f = 1MHz

20

 

pF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

This parameter is guaranteed by design but not tested.

DC CHARACTERISTICS

(VCC = 5.0V, VSS = 0V, TA = -55°C TO +125°C)

Parameter

Symbol

 

 

 

 

 

 

 

 

 

 

 

Conditions

 

 

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Min

Max

 

Input Leakage Current

ILI

 

 

 

 

 

VCC = 5.5, VIN = GND to VCC

 

10

µA

Output Leakage Current

ILO

 

 

 

 

 

= VIH,

 

 

 

= VIH, VOUT = GND to VCC

 

10

µA

 

 

CS

OE

 

Dynamic Supply Current

ICC

 

 

 

 

= VIL,

 

= VIH, f = 5MHz, Vcc = 5.5

 

80

mA

 

 

CS

OE

 

Standby Current

ISB

 

 

= VIH,

 

 

 

= VIH, f = 5MHz, Vcc = 5.5

 

0.625

mA

 

CS

OE

 

Output Low Voltage

VOL

 

 

 

 

 

IOL = 2.1mA, Vcc = 4.5V

 

.45

V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Output High Voltage

VOH

 

 

 

 

 

IOH = -400µA, Vcc = 4.5V

2.4

 

V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V

FIG. 2

AC TEST CIRCUIT

IOL

Current Source

 

D.U.T.

Ceff = 50 pf

IOH

Current Source

VZ 1.5V

(Bipolar Supply)

AC TEST CONDITIONS

Parameter

Typ

Unit

Input Pulse Levels

VIL = 0, VIH = 3.0

V

 

 

 

Input Rise and Fall

5

ns

 

 

 

Input and Output Reference Level

1.5

V

 

 

 

Output Timing Reference Level

1.5

V

Notes:

VZ is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 W.

VZ is typically the midpoint of VOH and VOL.

IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance.

White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520

2

White Electronic Designs WME128K8-300CCA, WME128K8-250DEQA, WME128K8-250DEQ, WME128K8-250DEMA, WME128K8-250DEM Datasheet

White Electronic Designs

WME128K8-XXX

READ

Figure 3 shows Read cycle waveforms. A read cycle begins with selection address, chip select and output enable. Chip select is accomplished by placing the CS line low. Output enable is done by placing the OE line low. The memory places the selected data byte on I/O0 through I/O7 after the access time. The output of the memory is placed in a high impedance state shortly after either the OE line or CS line is returned to a high level.

FIG. 3 READ WAVEFORMS

 

t RC

 

ADDRESS

ADDRESS VALID

 

CS

 

 

 

tACS

 

OE

tOE

 

 

 

tDF

 

tACC

t OH

 

 

HIGH Z

OUTPUT

NOTE:

OE may be delayed up to tACS- tOE after the falling edge of CS without impact on tOE or by tACC- tOE after an address change without impact on tACC.

OUTPUT

VALID

AC READ CHARACTERISTICS (SEE FIGURE 3)

(VCC = 5.0V, VSS = 0V, TA = -55°C TO +125°C)

Parameter

Symbol

-120

-140

-150

-200

-250

-300

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Read Cycle Time

tRC

120

 

140

 

150

 

200

 

250

 

300

 

ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Address Access Time

tACC

 

120

 

140

 

150

 

200

 

250

 

300

ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Chip Select Access Time

tACS

 

120

 

140

 

150

 

200

 

250

 

300

ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Output Hold from Address Change,

OE

or

CS

 

tOH

0

 

0

 

0

 

0

 

0

 

0

 

ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Output Enable to Output Valid

tOE

 

50

 

55

 

55

 

55

 

85

 

85

ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Chip Select or Output Enable to High Z Output

tDF

 

70

 

70

 

70

 

70

 

70

 

70

ns

3White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

White Electronic Designs

WME128K8-XXX

WRITE

Write operations are initiated when both CS and WE are low and OE is high. The EEPROM devices support both a CS and WE controlled write cycle. The address is latched by the falling edge of either CS or WE, whichever occurs last.

The data is latched internally by the rising edge of either CS or WE, whichever occurs first. A byte write operation will automatically continue to completion.

WRITE CYCLE TIMING

Figures 4 and 5 show the write cycle timing relationships. A write cycle begins with address application, write enable and chip select. Chip select is accomplished by placing the CS line low. Write enable consists of setting the WE line low. The write cycle begins when the last of either CS or WE goes low.

The WE line transition from high to low also initiates an internal 150µsec delay timer to permit page mode operation. Each subsequent WE transition from high to low that occurs before the completion of the 150µsec time out will restart the timer from zero. The operation of the timer is the same as a retriggerable one-shot.

AC WRITE CHARACTERISTICS

(VCC = 5.0V, VSS = 0V, TA = -55°C TO +125°C)

Parameter

Symbol

128Kx8

 

Unit

 

 

 

 

 

 

Min

 

Max

 

Write Cycle Time, TYP = 6ms

tWC

 

 

10

ms

Address Set-up Time

tAS

10

 

 

ns

 

 

 

 

 

 

 

 

Write Pulse Width

(WE

or

CS)

 

tWP

150

 

 

ns

Chip Select Set-up Time

tCS

0

 

 

ns

 

 

 

 

 

 

 

 

 

 

Address Hold Time

tAH

100

 

 

ns

 

 

 

 

 

 

 

 

 

 

Data Hold Time

tDH

10

 

 

ns

 

 

 

 

 

 

 

 

 

 

Chip Select Hold Time

tCH

0

 

 

ns

Data Set-up Time

tDS

100

 

 

ns

Output Enable Set-up Time

tOES

10

 

 

ns

Output Enable Hold Time

tOEH

10

 

 

ns

Write Pulse Width High

tWPH

50

 

 

ns

White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520

4

Loading...
+ 7 hidden pages