HUFA75617D3, HUFA75617D3S
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Data Sheet |
December 2001 |
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16A, 100V, 0.090 Ohm, N-Channel,
UltraFET® Power MOSFETs
Packaging
JEDEC TO-251AA |
JEDEC TO-252AA |
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SOURCE |
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DRAIN |
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DRAIN |
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GATE |
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(FLANGE) |
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GATE |
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DRAIN |
SOURCE |
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(FLANGE) |
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HUFA75617D3 |
HUFA75617D3S |
Symbol
D
G
S
Features
• Ultra Low On-Resistance
- rDS(ON) = 0.090Ω, VGS = 10V
•Simulation Models
-Temperature Compensated PSPICE® and SABER™ Electrical Models
-Spice and SABER Thermal Impedance Models
-www.fairchildsemi.com
•Peak Current vs Pulse Width Curve
•UIS Rating Curve
Ordering Information
PART NUMBER |
PACKAGE |
BRAND |
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HUFA75617D3 |
TO-251AA |
75617D |
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HUFA75617D3S |
TO-252AA |
75617D |
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NOTE: When ordering, use the entire part number. Add the suffix T to obtain the variant in tape and reel, e.g., HUFA75617D3ST.
Absolute Maximum Ratings T = 25oC, Unless Otherwise Specified |
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C |
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HUFA75617D3, |
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HUFA75617D3S |
UNITS |
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . VDSS |
100 |
V |
Drain to Gate Voltage (RGS = 20kΩ ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . VDGR |
100 |
V |
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . VGS |
±20 |
V |
Drain Current |
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Continuous (TC = 25oC, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . . . ID |
16 |
A |
Continuous (TC = 100oC, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . . . ID |
11 |
A |
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . . IDM |
Figure 4 |
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Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . . UIS |
Figures 6, 14, 15 |
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Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . . PD |
64 |
W |
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
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0.43 |
W/oC |
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
TJ, TSTG |
-55 to 175 |
oC |
Maximum Temperature for Soldering |
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oC |
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . . . TL |
300 |
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Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. . . Tpkg |
260 |
oC |
NOTE: TJ = 25oC to 150oC.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
©2001 Fairchild Semiconductor Corporation |
HUFA75617D3 Rev. B |
HUFA75617D3
Electrical Specifications TC = 25oC, Unless Otherwise Specified
PARAMETER |
SYMBOL |
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TEST CONDITIONS |
MIN |
TYP |
MAX |
UNITS |
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OFF STATE SPECIFICATIONS |
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Drain to Source Breakdown Voltage |
BVDSS |
ID = 250µA, VGS = 0V (Figure 11) |
100 |
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V |
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Zero Gate Voltage Drain Current |
IDSS |
VDS = 95V, VGS = 0V |
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1 |
µA |
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V |
DS |
= 90V, V |
= 0V, T |
C |
= 150oC |
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250 |
µA |
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GS |
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Gate to Source Leakage Current |
IGSS |
VGS = ±20V |
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- |
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±100 |
nA |
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ON STATE SPECIFICATIONS |
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Gate to Source Threshold Voltage |
VGS(TH) |
VGS = VDS, ID = 250µA (Figure 10) |
2 |
- |
4 |
V |
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Drain to Source On Resistance |
rDS(ON) |
ID = 16A, VGS = 10V (Figure 9) |
- |
0.080 |
0.090 |
¾ |
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THERMAL SPECIFICATIONS |
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Thermal Resistance Junction to Case |
Rθ JC |
TO-251, TO-252 |
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2.34 |
oC/W |
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Thermal Resistance Junction to |
Rθ JA |
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- |
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100 |
oC/W |
Ambient |
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SWITCHING SPECIFICATIONS (VGS = 10V) |
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Turn-On Time |
tON |
VDD = 50V, ID = 16A |
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60 |
ns |
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VGS = 10V, |
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Turn-On Delay Time |
td(ON) |
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6 |
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RGS = 12Ω |
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Rise Time |
tr |
(Figures 18, 19) |
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35 |
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Turn-Off Delay Time |
td(OFF) |
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- |
44 |
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Fall Time |
tf |
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28 |
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Turn-Off Time |
tOFF |
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- |
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108 |
ns |
GATE CHARGE SPECIFICATIONS |
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Total Gate Charge |
Qg(TOT) |
VGS = 0V to 20V |
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VDD = 50V, |
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31 |
39 |
nC |
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ID = 16A, |
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Gate Charge at 10V |
Qg(10) |
VGS = 0V to 10V |
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18 |
22 |
nC |
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Ig(REF) = 1.0mA |
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Threshold Gate Charge |
Qg(TH) |
VGS = 0V to 2V |
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(Figures 13, 16, 17) |
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1.3 |
1.6 |
nC |
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Gate to Source Gate Charge |
Qgs |
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2.7 |
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nC |
Gate to Drain "Miller" Charge |
Qgd |
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- |
6.4 |
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nC |
CAPACITANCE SPECIFICATIONS |
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Input Capacitance |
CISS |
VDS = 25V, VGS = 0V, |
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570 |
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pF |
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f = 1MHz |
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Output Capacitance |
COSS |
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125 |
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pF |
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(Figure 12) |
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Reverse Transfer Capacitance |
CRSS |
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20 |
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pF |
Source to Drain Diode Specifications
PARAMETER |
SYMBOL |
TEST CONDITIONS |
MIN |
TYP |
MAX |
UNITS |
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Source to Drain Diode Voltage |
VSD |
ISD = 16A |
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1.25 |
V |
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ISD = 7A |
- |
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1.00 |
V |
Reverse Recovery Time |
trr |
ISD = 16A, dISD/dt = 100A/µs |
- |
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80 |
ns |
Reverse Recovered Charge |
QRR |
ISD = 16A, dISD/dt = 100A/µs |
- |
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170 |
nC |
©2001 Fairchild Semiconductor Corporation |
HUFA75617D3 Rev. B |
HUFA75617D3
Typical Performance Curves
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1.2 |
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MULTIPLIER |
1.0 |
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0.8 |
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DISSIPATION |
0.6 |
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0.4 |
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POWER |
0.2 |
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0 |
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150 |
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0 |
25 |
50 |
75 |
100 |
125 |
175 |
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TC , CASE TEMPERATURE (oC) |
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18 |
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(A) |
15 |
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CURRENT |
12 |
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VGS = 10V |
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9 |
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, DRAIN |
6 |
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D |
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I |
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3 |
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0 |
50 |
75 |
100 |
125 |
150 |
175 |
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25 |
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TC, CASE TEMPERATURE (oC) |
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FIGURE 1. |
NORMALIZED POWER DISSIPATION vs CASE |
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FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs |
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TEMPERATURE |
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CASE TEMPERATURE |
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2 |
DUTY CYCLE - DESCENDING ORDER |
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1 |
0.5 |
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0.2 |
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IMPEDANCE |
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0.1 |
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NORMALIZED |
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0.05 |
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0.02 |
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0.01 |
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PDM |
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0.1 |
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, |
THERMAL |
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Zθ JC |
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t1 |
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t2 |
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NOTES: |
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DUTY FACTOR: D = t1/t2 |
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SINGLE PULSE |
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PEAK TJ = PDM x Zθ JC x Rθ JC + TC |
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0.01 |
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10-4 |
10-3 |
10-2 |
10-1 |
100 |
101 |
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10-5 |
t, RECTANGULAR PULSE DURATION (s)
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
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300 |
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TC = 25oC |
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200 |
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FOR TEMPERATURES |
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(A) |
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ABOVE 25oC DERATE PEAK |
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CURRENT AS FOLLOWS: |
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CURRENT |
100 |
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175 - TC |
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I = I25 |
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PEAK, |
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150 |
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VGS = 10V |
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DM |
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I |
TRANSCONDUCTANCE |
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MAY LIMIT CURRENT |
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IN THIS REGION |
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10 |
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10-5 |
10-4 |
10-3 |
10-2 |
10-1 |
100 |
101 |
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t, PULSE WIDTH (s) |
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FIGURE 4. PEAK CURRENT CAPABILITY
©2001 Fairchild Semiconductor Corporation |
HUFA75617D3 Rev. B |