Fairchild Semiconductor HUFA75617D3, HUFA75617D3S Datasheet

0 (0)

HUFA75617D3, HUFA75617D3S

 

Data Sheet

December 2001

 

 

 

 

 

 

16A, 100V, 0.090 Ohm, N-Channel,

UltraFET® Power MOSFETs

Packaging

JEDEC TO-251AA

JEDEC TO-252AA

SOURCE

 

 

 

 

 

DRAIN

 

DRAIN

GATE

 

(FLANGE)

 

 

 

GATE

 

 

 

 

 

 

 

 

 

 

 

 

DRAIN

SOURCE

 

 

 

(FLANGE)

 

 

 

 

 

HUFA75617D3

HUFA75617D3S

Symbol

D

G

S

Features

• Ultra Low On-Resistance

- rDS(ON) = 0.090Ω, VGS = 10V

Simulation Models

-Temperature Compensated PSPICE® and SABER™ Electrical Models

-Spice and SABER Thermal Impedance Models

-www.fairchildsemi.com

Peak Current vs Pulse Width Curve

UIS Rating Curve

Ordering Information

PART NUMBER

PACKAGE

BRAND

 

 

 

HUFA75617D3

TO-251AA

75617D

 

 

 

HUFA75617D3S

TO-252AA

75617D

 

 

 

NOTE: When ordering, use the entire part number. Add the suffix T to obtain the variant in tape and reel, e.g., HUFA75617D3ST.

Absolute Maximum Ratings T = 25oC, Unless Otherwise Specified

 

 

 

C

 

 

 

 

 

HUFA75617D3,

 

 

 

HUFA75617D3S

UNITS

Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . VDSS

100

V

Drain to Gate Voltage (RGS = 20kΩ ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . VDGR

100

V

Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . VGS

±20

V

Drain Current

 

 

 

Continuous (TC = 25oC, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . ID

16

A

Continuous (TC = 100oC, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . ID

11

A

Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . IDM

Figure 4

 

Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . UIS

Figures 6, 14, 15

 

Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . PD

64

W

Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . .

0.43

W/oC

Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TJ, TSTG

-55 to 175

oC

Maximum Temperature for Soldering

 

 

oC

Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . TL

300

Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . Tpkg

260

oC

NOTE: TJ = 25oC to 150oC.

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/

Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.

All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.

©2001 Fairchild Semiconductor Corporation

HUFA75617D3 Rev. B

HUFA75617D3

Electrical Specifications TC = 25oC, Unless Otherwise Specified

PARAMETER

SYMBOL

 

 

TEST CONDITIONS

MIN

TYP

MAX

UNITS

 

 

 

 

 

 

 

 

 

 

 

 

 

OFF STATE SPECIFICATIONS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Drain to Source Breakdown Voltage

BVDSS

ID = 250µA, VGS = 0V (Figure 11)

100

-

-

V

Zero Gate Voltage Drain Current

IDSS

VDS = 95V, VGS = 0V

 

 

-

-

1

µA

 

 

V

DS

= 90V, V

= 0V, T

C

= 150oC

-

-

250

µA

 

 

 

GS

 

 

 

 

 

 

 

Gate to Source Leakage Current

IGSS

VGS = ±20V

 

 

 

 

-

-

±100

nA

ON STATE SPECIFICATIONS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Gate to Source Threshold Voltage

VGS(TH)

VGS = VDS, ID = 250µA (Figure 10)

2

-

4

V

Drain to Source On Resistance

rDS(ON)

ID = 16A, VGS = 10V (Figure 9)

-

0.080

0.090

¾

THERMAL SPECIFICATIONS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Thermal Resistance Junction to Case

Rθ JC

TO-251, TO-252

 

 

 

 

-

-

2.34

oC/W

Thermal Resistance Junction to

Rθ JA

 

 

 

 

 

 

 

-

-

100

oC/W

Ambient

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SWITCHING SPECIFICATIONS (VGS = 10V)

 

 

 

 

 

 

 

 

 

 

 

Turn-On Time

tON

VDD = 50V, ID = 16A

 

 

-

-

60

ns

 

 

VGS = 10V,

 

 

 

 

 

 

 

 

Turn-On Delay Time

td(ON)

 

 

 

 

-

6

-

ns

RGS = 12Ω

 

 

 

 

Rise Time

tr

(Figures 18, 19)

 

 

 

 

-

35

-

ns

Turn-Off Delay Time

td(OFF)

 

 

 

 

 

 

 

-

44

-

ns

Fall Time

tf

 

 

 

 

 

 

 

-

28

-

ns

Turn-Off Time

tOFF

 

 

 

 

 

 

 

-

-

108

ns

GATE CHARGE SPECIFICATIONS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Total Gate Charge

Qg(TOT)

VGS = 0V to 20V

 

VDD = 50V,

-

31

39

nC

 

 

 

 

 

 

ID = 16A,

 

 

 

 

Gate Charge at 10V

Qg(10)

VGS = 0V to 10V

 

-

18

22

nC

 

Ig(REF) = 1.0mA

Threshold Gate Charge

Qg(TH)

VGS = 0V to 2V

 

(Figures 13, 16, 17)

-

1.3

1.6

nC

Gate to Source Gate Charge

Qgs

 

 

 

 

 

 

 

-

2.7

-

nC

Gate to Drain "Miller" Charge

Qgd

 

 

 

 

 

 

 

-

6.4

-

nC

CAPACITANCE SPECIFICATIONS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Capacitance

CISS

VDS = 25V, VGS = 0V,

 

 

-

570

-

pF

 

 

f = 1MHz

 

 

 

 

 

 

 

 

Output Capacitance

COSS

 

 

 

 

-

125

-

pF

(Figure 12)

 

 

 

 

Reverse Transfer Capacitance

CRSS

 

 

 

 

 

 

 

-

20

-

pF

Source to Drain Diode Specifications

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

TYP

MAX

UNITS

 

 

 

 

 

 

 

Source to Drain Diode Voltage

VSD

ISD = 16A

-

-

1.25

V

 

 

ISD = 7A

-

-

1.00

V

Reverse Recovery Time

trr

ISD = 16A, dISD/dt = 100A/µs

-

-

80

ns

Reverse Recovered Charge

QRR

ISD = 16A, dISD/dt = 100A/µs

-

-

170

nC

©2001 Fairchild Semiconductor Corporation

HUFA75617D3 Rev. B

Fairchild Semiconductor HUFA75617D3, HUFA75617D3S Datasheet

HUFA75617D3

Typical Performance Curves

 

1.2

 

 

 

 

 

 

 

MULTIPLIER

1.0

 

 

 

 

 

 

 

0.8

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DISSIPATION

0.6

 

 

 

 

 

 

 

0.4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

POWER

0.2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

150

 

 

0

25

50

75

100

125

175

 

 

 

TC , CASE TEMPERATURE (oC)

 

 

 

18

 

 

 

 

 

 

(A)

15

 

 

 

 

 

 

 

 

 

 

 

 

 

CURRENT

12

 

 

 

 

VGS = 10V

 

9

 

 

 

 

 

 

 

 

 

 

 

 

 

, DRAIN

6

 

 

 

 

 

 

 

 

 

 

 

 

 

D

 

 

 

 

 

 

 

I

 

 

 

 

 

 

 

 

3

 

 

 

 

 

 

 

0

50

75

100

125

150

175

 

25

 

 

 

TC, CASE TEMPERATURE (oC)

 

FIGURE 1.

NORMALIZED POWER DISSIPATION vs CASE

 

FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs

 

 

 

TEMPERATURE

 

 

CASE TEMPERATURE

 

 

 

2

DUTY CYCLE - DESCENDING ORDER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

0.5

 

 

 

 

 

 

 

 

0.2

 

 

 

 

 

 

 

IMPEDANCE

 

0.1

 

 

 

 

 

 

NORMALIZED

 

0.05

 

 

 

 

 

 

 

0.02

 

 

 

 

 

 

 

0.01

 

 

 

 

 

 

 

 

 

 

 

 

PDM

 

0.1

 

 

 

 

 

 

 

,

THERMAL

 

 

 

 

 

 

 

 

Zθ JC

 

 

 

 

 

 

t1

 

 

 

 

 

 

 

t2

 

 

 

 

 

 

 

 

 

NOTES:

 

 

 

 

 

 

 

 

 

DUTY FACTOR: D = t1/t2

 

 

 

 

 

SINGLE PULSE

 

 

 

PEAK TJ = PDM x Zθ JC x Rθ JC + TC

 

 

 

0.01

 

10-4

10-3

10-2

10-1

100

101

 

 

10-5

t, RECTANGULAR PULSE DURATION (s)

FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE

 

300

 

 

 

 

TC = 25oC

 

 

200

 

 

 

 

 

 

 

 

 

 

FOR TEMPERATURES

 

 

 

 

 

 

(A)

 

 

 

 

 

ABOVE 25oC DERATE PEAK

 

 

 

 

 

CURRENT AS FOLLOWS:

CURRENT

100

 

 

 

 

 

 

 

 

 

175 - TC

 

 

 

 

 

 

 

 

 

 

 

 

I = I25

PEAK,

 

 

 

 

 

 

150

 

VGS = 10V

 

 

 

 

 

 

 

 

 

 

 

 

DM

 

 

 

 

 

 

 

I

TRANSCONDUCTANCE

 

 

 

 

 

 

 

 

 

 

 

 

MAY LIMIT CURRENT

 

 

 

 

 

 

IN THIS REGION

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

10-5

10-4

10-3

10-2

10-1

100

101

 

 

 

 

t, PULSE WIDTH (s)

 

 

 

FIGURE 4. PEAK CURRENT CAPABILITY

©2001 Fairchild Semiconductor Corporation

HUFA75617D3 Rev. B

Loading...
+ 7 hidden pages