Analog Devices AD6645ASQ-80, AD6645-PCB Datasheet

0 (0)
Analog Devices AD6645ASQ-80, AD6645-PCB Datasheet

a

14A/D-Bit,Converter80 MSPS

 

AD6645

 

 

FEATURES

80 MSPS Guaranteed Sample Rate SNR = 75 dB, fIN 15 MHz @ 80 MSPS SNR = 72 dB, fIN 200 MHz @ 80 MSPS

SFDR = 89 dBc, fIN 70 MHz @ 80 MSPS 100 dB Multitone SFDR

IF Sampling to 200 MHz Sampling Jitter 0.1 ps 1.5 W Power Dissipation

Differential Analog Inputs Pin-Compatible to AD6644

Two’s Complement Digital Output Format 3.3 V CMOS-Compatible

DataReady for Output Latching

APPLICATIONS

Multichannel, Multimode Receivers

Base Station Infrastructure

AMPS, IS-136, CDMA, GSM, WCDMA

Single Channel Digital Receivers

Antenna Array Processing

Communications Instrumentation

Radar, Infrared Imaging

Instrumentation

PRODUCT DESCRIPTION

The AD6645 is a high-speed, high-performance, monolithic 14-bit analog-to-digital converter. All necessary functions, including track-and-hold (T/H) and reference, are included on the chip to provide a complete conversion solution. The AD6645 provides CMOS-compatible digital outputs. It is the fourth

generation in a wideband ADC family, preceded by the AD9042 (12-bit, 41 MSPS), the AD6640 (12-bit, 65 MSPS, IF sampling), and the AD6644 (14-bit, 40 MSPS/65 MSPS).

Designed for multichannel, multimode receivers, the AD6645 is part of Analog Device’s SoftCell™ transceiver chipset. The AD6645 maintains 100 dB multitone, spurious-free dynamic range (SFDR) through the second Nyquist band. This breakthrough performance eases the burden placed on multimode digital receivers (software radios) that are typically limited by the ADC. Noise performance is exceptional; typical signal-to- noise ratio is 74.5 dB through the first Nyquist band.

The AD6645 is built on Analog Devices’ high-speed complementary bipolar process (XFCB) and uses an innovative, multipass circuit architecture. Units are available in a thermally enhanced 52lead PowerQuad 4® (LQFP_ED) specified from –40C to +85C.

PRODUCT HIGHLIGHTS

1.IF Sampling

The AD6645 maintains outstanding ac performance up to input frequencies of 200 MHz. Suitable for multicarrier 3G wideband cellular IF sampling receivers.

2.Pin Compatibility

The ADC has the same footprint and pin layout as the AD6644, 14-Bit 40 MSPS/65 MSPS ADC.

3.SFDR Performance and Oversampling

Multitone SFDR performance of –100 dBc can reduce the requirements of high-end RF components and allows the use of receive signal processors such as the AD6620 or AD6624/ AD6624A.

 

 

 

 

 

FUNCTIONAL BLOCK DIAGRAM

 

 

 

 

 

 

 

 

AVCC

DVCC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AD6645

 

 

 

 

 

 

 

 

 

AIN

A1

TH1

TH2

 

 

 

A2

TH3

 

 

TH4

 

 

 

TH5

 

ADC3

 

AIN

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VREF

2.4V

 

ADC1

 

DAC1

 

 

 

 

ADC2

DAC2

 

 

 

 

6

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5

 

 

 

 

 

 

 

5

 

 

 

 

 

 

ENCODE

INTERNAL

 

 

 

 

 

DIGITAL ERROR CORRECTION LOGIC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ENCODE

TIMING

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

GND

DMID

OVR

DRY

D13

D12

D11

D10

D9

D8

D7

D6

D5

D4

D3

D2

D1

D0

 

 

 

 

 

MSB

 

 

 

 

 

 

 

 

 

 

 

 

LSB

SoftCell is a trademark of Analog Devices, Inc.

PowerQuad 4 is a registered trademark of Amkor Technology, Inc.

REV. 0

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Tel: 781/329-4700

www.analog.com

Fax: 781/326-8703

© Analog Devices, Inc., 2002

AD6645–SPECIFICATIONS

DC SPECIFICATIONS (AVCC = 5 V, DVCC = 3.3 V; TMIN = –40 C, TMAX = +85 C, unless otherwise noted.)

 

 

 

 

AD6645ASQ-80

 

 

Parameter

Temp

Test Level

Min

Typ

Max

Unit

 

 

 

 

 

 

 

RESOLUTION

 

 

 

14

 

Bits

 

 

 

 

 

 

 

ACCURACY

 

 

 

 

 

 

No Missing Codes

Full

II

 

Guaranteed

 

 

Offset Error

Full

II

–10

+1.2

+10

mV

Gain Error

Full

II

–10

0

+10

% FS

Differential Nonlinearity (DNL)

Full

II

–1.0

± 0.25

+1.5

LSB

Integral Nonlinearity (INL)

Full

V

 

± 0.5

 

LSB

 

 

 

 

 

 

 

TEMPERATURE DRIFT

 

 

 

 

 

ppm/C

Offset Error

Full

V

 

1.5

 

Gain Error

Full

V

 

48

 

ppm/C

POWER SUPPLY REJECTION (PSRR)

25C

V

 

± 1.0

 

mV/V

 

 

 

 

 

 

 

REFERENCE OUT (VREF)1

Full

V

 

2.4

 

V

ANALOG INPUTS (AIN, AIN)

 

 

 

 

 

 

Differential Input Voltage Range

Full

V

 

2.2

 

V p-p

Differential Input Resistance

Full

V

 

1

 

kW

Differential Input Capacitance

25C

V

 

1.5

 

pF

POWER SUPPLY

 

 

 

 

 

 

Supply Voltages

 

 

 

 

 

 

AVCC

Full

II

4.75

5.0

5.25

V

DVCC

Full

II

3.0

3.3

3.6

V

Supply Current

 

 

 

 

 

 

I AVCC (AVCC = 5.0 V)

Full

II

 

275

320

mA

I DVCC (DVCC = 3.3 V)

Full

II

 

32

45

mA

Rise Time2

 

 

 

 

 

 

AVCC

Full

IV

 

 

TBD

ms

POWER CONSUMPTION

Full

II

 

1.5

1.75

W

 

 

 

 

 

 

 

NOTES

1VREF is provided for setting the common-mode offset of a differential amplifier such as the AD8138 when a dc-coupled analog input is required. VREF should be buffered if used to drive additional circuit functions.

2Specified for dc supplies with linear rise-time characteristics. The use of dc supplies with linear rise-times of <45 ms is highly recommended.

Specifications subject to change without notice

DIGITAL SPECIFICATIONS (AVCC = 5 V, DVCC = 3.3 V; TMIN = –40 C, TMAX = +85 C, unless otherwise noted.)

 

 

 

 

AD6645ASQ-80

 

 

Parameter (Conditions)

Temp

Test Level

Min

Typ

Max

Unit

 

 

 

 

 

 

 

ENCODE INPUTS (ENC, ENC)

 

 

 

 

 

 

Differential Input Voltage1

Full

IV

0.4

 

 

V p-p

Differential Input Resistance

25C

V

 

10

 

kW

Differential Input Capacitance

25C

V

 

2.5

 

pF

LOGIC OUTPUTS (D13–D0, DRY, OVR2)

 

 

 

 

 

 

Logic Compatibility

 

 

 

CMOS

 

 

Logic “1” Voltage (DVCC = 3.3 V)3

Full

II

2.85

DVCC – 0.2

 

V

Logic “0” Voltage (DVCC = 3.3 V)3

Full

II

 

0.2

0.5

V

Output Coding

 

 

 

Two’s Complement

 

DMID

Full

V

 

DVCC/2

 

V

NOTES

1All ac specifications tested by driving ENCODE and ENCODE differentially.

2The functionality of the Over-Range bit is specified for a temperature range of 25C to 85C only.

3Digital output logic levels: DVCC = 3.3 V, CLOAD = 10 pF. Capacitive loads >10 pF will degrade performance.

Specifications subject to change without notice.

–2–

REV. 0

 

 

 

 

 

 

 

 

AD6645

 

1

(AVCC = 5 V, DVCC = 3.3 V; ENCODE and ENCODE = 80 MSPS; TMIN = –40 C, TMAX = +85 C, unless

AC SPECIFICATIONS

otherwise noted.)

 

 

 

 

 

 

 

 

 

 

 

 

AD6645ASQ-80

 

 

 

Parameter (Conditions)

 

Temp

Test Level

Min

Typ

Max

Unit

 

 

 

 

 

 

 

 

 

 

SNR

 

 

25C

 

 

 

 

 

 

Analog Input

15.5 MHz

V

 

75.0

 

dB

@ –1 dBFS

30.5 MHz

25C

II

72.5

74.5

 

dB

 

70.0 MHz

25C

II

72.0

73.5

 

dB

 

150.0 MHz

25C

V

 

73.0

 

dB

 

200.0 MHz

25C

V

 

72.0

 

dB

SINAD

 

 

25C

 

 

 

 

 

 

Analog Input

15.5 MHz

V

 

75.0

 

dB

@ –1 dBFS

30.5 MHz

25C

II

72.5

74.5

 

dB

 

70.0 MHz

25C

V

 

73.0

 

dB

 

150.0 MHz

25C

V

 

68.5

 

dB

 

200.0 MHz

25C

V

 

62.5

 

dB

WORST HARMONIC (2nd or 3rd)

25C

 

 

 

 

 

 

Analog Input

15.5 MHz

V

 

93.0

 

dBc

@ –1 dBFS

30.5 MHz

25C

II

85.0

93.0

 

dBc

 

70.0 MHz

25C

V

 

89.0

 

dBc

 

150.0 MHz

25C

V

 

70.0

 

dBc

 

200.0 MHz

25C

V

 

63.5

 

dBc

WORST HARMONIC (4th or HIGHER)

25C

 

 

 

 

 

 

Analog Input

15.5 MHz

V

 

96.0

 

dBc

@ –1 dBFS

30.5 MHz

25C

II

85.0

95.0

 

dBc

 

70.0 MHz

25C

V

 

90.0

 

dBc

 

150.0 MHz

25C

V

 

90.0

 

dBc

 

200.0 MHz

25C

V

 

88.0

 

dBc

 

TWO TONE SFDR @ 30.5 MHz2, 3

25C

V

 

100

 

dBFS

 

55.0 MHz2, 4

25C

V

 

100

 

dBFS

TWO TONE IMD REJECTION3, 4

25C

 

 

 

 

 

 

F1, F2 @ –7 dBFS

 

 

V

 

90

 

dBc

 

 

 

 

 

 

 

 

ANALOG INPUT BANDWIDTH

25C

V

 

270

 

MHz

 

 

 

 

 

 

 

 

 

 

NOTES

1All ac specifications tested by driving ENCODE and ENCODE differentially. 2Analog input signal power swept from –10 dBFS to –100 dBFS.

3F1 = 30.5 MHz, F2 = 31.5 MHz.

4F1 = 55.25 MHz, F2 = 56.25 MHz.

Specifications subject to change without notice.

 

 

 

 

 

 

 

 

SWITCHING SPECIFICATIONS

(AVCC = 5 V, DVCC = 3.3 V; ENCODE and ENCODE = 80 MSPS; TMIN = –40 C, TMAX = +85 C, unless

otherwise noted.)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AD6645ASQ-80

 

 

 

Parameter (Conditions)

 

Temp

Test Level

Min

Typ

Max

Unit

 

 

 

 

 

 

 

 

 

Maximum Conversion Rate

 

Full

II

80

 

 

MSPS

Minimum Conversion Rate

 

Full

IV

 

 

30

MSPS

ENCODE Pulsewidth High (tENCH)*

 

Full

IV

5.625

 

 

ns

ENCODE Pulsewidth Low (tENCL)*

 

Full

IV

5.625

 

 

ns

 

*Several timing parameters are a function of tENCL and tENCH.

Specifications subject to change without notice.

REV. 0

–3–

AD6645

SWITCHING SPECIFICATIONS (continued)

(AVCC = 5 V, DVCC = 3.3 V; ENCODE and ENCODE = 80 MSPS; TMIN = –40 C, TMAX = +85 C, CLOAD = 10 pF, unless otherwise noted.)

 

 

 

 

 

AD6645ASQ-80

 

 

Parameter (Conditions)

Name

Temp

Test Level

Min

Typ

Max

Unit

 

 

 

 

 

 

 

 

ENCODE Input Parameters1

 

 

 

 

 

 

 

Encode Period1 @ 80 MSPS

tENC

Full

V

 

12.5

 

ns

Encode Pulsewidth High2 @ 80 MSPS

tENCH

Full

V

 

6.25

 

ns

Encode Pulsewidth Low @ 80 MSPS

tENCL

Full

V

 

6.25

 

ns

ENCODE/DataReady

 

 

 

 

 

 

 

Encode Rising to DataReady Falling

tDR

Full

V

1.0

2.0

3.1

ns

Encode Rising to DataReady Rising

tE_DR

Full

V

 

tENCH + tDR

 

ns

@ 80 MSPS (50% Duty Cycle)

 

Full

V

7.3

8.3

9.4

ns

 

 

 

 

 

 

 

 

ENCODE/DATA (D13:0), OVR

 

 

 

 

 

 

 

ENC to DATA Falling Low

tE_FL

Full

V

2.4

4.7

7.0

ns

ENC to DATA Rising Low

tE_RL

Full

V

1.4

3.0

4.7

ns

ENCODE to DATA Delay (Hold Time)3

tH_E

Full

V

1.4

3.0

4.7

ns

ENCODE to DATA Delay (Setup Time)4

tS_E

Full

V

 

tENC – tE_FL

 

ns

Encode = 80 MSPS (50% Duty Cycle)

 

Full

V

5.3

7.6

10.0

ns

 

 

 

 

 

 

 

 

DataReady (DRY5)/DATA, OVR

 

 

 

 

 

 

 

DataReady to DATA Delay (Hold Time)2

tH_DR

Full

V

 

Note 6

 

ns

Encode = 80 MSPS (50% Duty Cycle)

 

 

 

6.6

7.2

7.9

 

DataReady to DATA Delay (Setup Time)2

tS_DR

Full

V

 

Note 6

 

ns

Encode = 80 MSPS (50% Duty Cycle)

 

 

 

2.1

3.6

5.1

 

 

 

 

 

 

 

 

 

APERTURE DELAY

tA

25C

V

 

–500

 

ps

APERTURE UNCERTAINTY (Jitter)

tJ

25C

V

 

0.1

 

ps rms

NOTES

1Several timing parameters are a function of tENC and tENCH.

2To compensate for a change in duty cycle for tH_DR and tS_DR use the following equation:

NewtH_DR = (tH_DR – % Change(tENCH))

NewtS_DR = (tS_DR – % Change(tENCH))

3ENCODE TO DATA Delay (Hold Time) is the absolute minimum propagation delay through the Analog-to-Digital Converter, t E_RL = tH_E.

4ENCODE TO DATA Delay (Setup Time) is calculated relative to 80 MSPS (50% duty cycle). To calculate t S_E for a given encode, use the following equation: NewtS_E = tENC(NEW) tENC + tS_E (i.e., for 40 MSPS: NewtS_E(TYP) = 25 • 10–9 – 15.38 • 10–9 + 9.8 • 10–9 = 19.4 • 10 –9).

5DRY is an inverted and delayed version of the encode clock. Any change in the duty cycle of the clock will correspondingly change the duty cycle of DRY. 6DataReady to DATA Delay (tH_DR and tS_DR) is calculated relative to 80 MSPS (50% duty cycle) and is dependent on tENC and duty cycle. To calculate tH_DR and tS_DR for a given encode, use the following equations:

NewtH_DR = tENC(NEW)/2 – tENCH + tH_DR (i.e., for 40 MSPS: NewtH_DR(TYP) = 12.5 • 10–9 – 6.25 • 10–9 + 7.2 • 10–9 = 13.45 • 10–9 NewtS_DR = tENC(NEW)/2 – tENCH + tS_DR (i.e., for 40 MSPS: NewtS_DR(TYP) = 12.5 • 10–9 – 6.25 • 10–9 + 3.6 • 10–9 = 9.85 • 10–9

Specifications subject to change without notice.

tA

 

 

 

 

N+3

 

 

N

 

 

 

 

AIN

 

 

 

 

 

 

 

N+1

 

 

 

 

 

 

N+2

 

 

 

 

tENCH

tENCL

 

N+4

 

 

tENC

 

 

 

ENC, ENC

N

N+1

N+2

N+3

N+4

tE_RL

 

tE_FL

tE_DR

tS_E

tH_E

D[13:0], OVR

 

Nñ3

Nñ2

Nñ1

N

tH_DR

tS_DR

DRY

tDR

Figure 1. Timing Diagram

–4–

REV. 0

AD6645

ABSOLUTE MAXIMUM RATINGS*

Parameter

Min

Max

Unit

 

 

 

 

ELECTRICAL

 

 

 

AVCC Voltage

0

7

V

DVCC Voltage

0

7

V

Analog Input Voltage

0

AVCC

V

Analog Input Current

 

25

mA

Digital Input Voltage

0

AVCC

V

Digital Output Current

 

4

mA

 

 

 

 

ENVIRONMENTAL

 

 

C

Operating Temperature Range (Ambient)

–40

+85

Maximum Junction Temperature

 

150

C

Lead Temperature (Soldering, 10 sec)

 

300

C

Storage Temperature Range (Ambient)

–65

+150

C

*Absolute maximum ratings are limiting values to be applied individually and beyond which the serviceability of the circuit may be impaired. Functional operability is not necessarily implied. Exposure to absolute maximum rating conditions for an extended period of time may affect device reliability.

THERMAL CHARACTERISTICS

EXPLANATION OF TEST LEVELS

52-Lead PowerQuad 4 . .

. .

. . .

. . . . . . . . . . . . . . . LQFP_ED

Test Level

 

 

JA = 23C/W . . . . . . .

. . .

. .

. . . Soldered Slug, No Airflow

I.

100% production tested.

 

 

JA = 17C/W . . . . . . . .

 

Soldered Slug, 200 LFPM Airflow

II.

100% production tested at 25C and guaranteed by design

JA = 30C/W . . . . . . . .

. .

. .

. Unsoldered Slug, No Airflow

 

and characterization at temperature extremes.

JA = 24C/W . . . . . .

Unsoldered Slug, 200 LFPM Airflow

III. Sample tested only.

 

 

JC = 2C/W . . . . . . . . .

. .

. .

Bottom of Package (Heatslug)

IV. Parameter is guaranteed by design and characterization

Typical Four-Layer JEDEC Board Horizontal Orientation

 

testing.

 

 

V.

Parameter is a typical value only.

 

 

 

 

 

 

 

 

 

 

ORDERING GUIDE

 

 

 

 

 

 

 

 

 

 

 

 

Model

 

 

Temperature Range

 

Package Description

Package Option

 

 

 

 

 

 

 

 

AD6645ASQ-80

–40C to +85C (Ambient)

 

52-Lead PowerQuad 4 (LQFP_ED)

SQ-52

 

AD6645/PCB

 

25C

 

Evaluation Board

 

 

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD6645 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

REV. 0

–5–

AD6645

PIN CONFIGURATION

 

 

 

DRY

D13(MSB)

D12

 

D11

D10

D9

D8

D7

D6

DV

GND

D5

D4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CC

 

 

 

 

 

 

 

52

51

50

 

49

48

47

46

45

44

43

42

41

40

 

 

 

DVCC

1

PIN 1

 

 

 

 

 

 

 

 

 

 

39

D3

 

 

GND

2

IDENTIFIER

 

 

 

 

 

 

 

 

38

D2

 

 

VREF

3

 

 

 

 

 

 

 

 

 

 

 

 

37

D1

 

 

GND

4

 

 

 

 

 

 

 

 

 

 

 

 

36

D0 (LSB)

 

 

ENC

5

 

 

 

 

 

 

 

 

 

 

 

 

35

DMID

 

 

ENC 6

 

 

 

 

 

AD6645

 

 

 

 

34

GND

 

 

GND

7

 

 

 

 

 

TOP VIEW

 

 

 

 

33

DVCC

 

 

AVCC

8

 

 

 

 

(Not to Scale)

 

 

 

32

OVR

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AVCC

9

 

 

 

 

 

 

 

 

 

 

 

 

31

DNC

 

 

GND 10

 

 

 

 

 

 

 

 

 

 

 

 

30

AVCC

 

 

AIN 11

 

 

 

 

 

 

 

 

 

 

 

 

29

GND

 

 

AIN 12

 

 

 

 

 

 

 

 

 

 

 

 

28

AVCC

 

 

GND 13

 

 

 

 

 

 

 

 

 

 

 

 

27

GND

 

 

 

14

15

16

 

17

18

19

20

21

22

23

24

25

26

 

 

 

 

AV

GND

AV

 

GND

AV

GND

C1

GND

AV

GND

C2

GND

AV

 

 

 

 

CC

 

CC

 

CC

 

 

 

CC

 

 

 

CC

 

 

 

 

 

 

 

DNC = DO NOT CONNECT

 

 

 

 

 

 

PIN FUNCTION DESCRIPTIONS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin No.

Mnemonic

Function

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1, 33, 43

DVCC

3.3 V Power Supply (Digital) Output Stage Only

2, 4, 7, 10, 13,

GND

Ground

 

 

 

 

 

 

 

 

 

 

 

 

 

 

15, 17, 19, 21,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

23, 25, 27, 29,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

34, 42

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3

VREF

2.4 V Reference. Bypass to ground with a 0.1 mF microwave chip capacitor.

5

ENC

Encode Input. Conversion initiated on rising edge.

6

ENC

Complement of ENC, Differential Input

 

8, 9, 14, 16, 18,

AVCC

5 V Analog Power Supply

 

 

 

 

 

 

 

22, 26, 28, 30

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

11

AIN

Analog Input

 

 

 

 

 

 

 

 

 

 

 

 

 

12

AIN

Complement of AIN, Differential Analog Input

20

C1

Internal Voltage Reference. Bypass to ground with a 0.1 mF chip capacitor.

24

C2

Internal Voltage Reference. Bypass to ground with a 0.1 mF chip capacitor.

31

DNC

Do not connect this pin.

 

 

 

 

 

 

 

 

32

OVR*

Over-Range Bit. A logic-level high indicates analog input exceeds ±FS.

35

DMID

Output Data Voltage Midpoint. Approximately equal to (DVCC)/2.

36

D0 (LSB)

Digital Output Bit (Least Significant Bit); Two’s Complement

37–41, 44–50

D1–D5, D6–D12

Digital Output Bits in Two’s Complement

 

51

D13 (MSB)

Digital Output Bit (Most Significant Bit); Two’s Complement

52

DRY

DataReady Output

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

*The functionality of the Over-Range bit is specified for a temperature range of 25C to 85C only.

–6–

REV. 0

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