Texas Instruments UCC3750N, UCC3750DWTR, UCC3750DW, UCC2750DWTR, UCC2750DW Datasheet

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Texas Instruments UCC3750N, UCC3750DWTR, UCC3750DW, UCC2750DWTR, UCC2750DW Datasheet

Source Ringer Controller

application

 

UCC2750

 

 

 

UCC3750

 

INFO

 

 

 

 

 

available

 

 

 

 

PRELIMINARY

 

 

 

FEATURES

Provides Control for Flyback Based Four Quadrant Amplifier Topology

Onboard Sine Wave Reference with Low THD

Selectable Ringing Frequency for Different Phone Systems (20Hz, 25Hz and 50Hz)

Programmable Output Amplitude and DC Offset

DC Current Limiting for Short Circuit Protection

Secondary Side Voltage Mode Control

Operates from a Single 5V Supply

TYPICAL APPLICATION

DESCRIPTION

The UCC3750 Source Ringer Controller provides a complete control and drive solution for a four quadrant flyback-based ring generator circuit. The IC controls a primary side switch, which is modulated when power transfer is taking place from input to output. It also controls two secondary switches which act as synchronous rectifier switches during positive power flow. These switches are pulse-width-modulated when the power is being delivered back to the source.

The UCC3750 has an onboard sine wave reference with programmable frequencies of 20Hz, 25Hz and 50Hz. The reference is derived from a high-frequency (32kHz) crystal connected externally. Two fre- quency-select pins control an internal divider to give a sinusoidal output at 20Hz, 25Hz or 50Hz. The ring generator can also be used at other frequencies by supplying externally generated sine-waves to the chip or by clocking the crystal input at a fixed multiple of the desired frequency.

Other features included in the UCC3750 are programmable DC current limit (with buffer amplifier), a charge-pump circuit for gate drive voltage, internal 3V and 7.5V references, a triangular clock oscillator and a buffer amplifier for adding programmable DC offset to the output voltage. The UCC3750 also provides an uncommitted amplifier (AMP) for other signal processing requirements.

 

0V

 

VOUT

–48V

 

VIN

V

OUT

48V

 

 

 

28

26

27

25

 

GD2

GD3 ENBL

REF

 

2

GD1

 

VCP

4

 

 

UCC3750

 

 

24

RT

 

VS2

6

23

CT

 

VS1

5

 

 

 

 

 

 

 

 

 

 

 

1

RGOOD

VDD

7

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

11 OUTDC

OUT2 15

12NEGDC

13AMPOUT

NEG2 18 14 AMPIN

 

 

XTAL1

OUT1

16

22

 

 

 

 

 

 

 

 

 

 

 

21 XTAL2 NEG1 17

20 FS0

SINFLT 10 19 FS1

SINREF SWRLY GND 9 8 3

C17

0.047 F

5V

UDG-99073

SLUS172A - DECEMBER 1999

ABSOLUTE MAXIMUM RATINGS

Input Supply Voltage

VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.5V Maximum Forced Voltage

VCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to 13.2V VS1, VS2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to 5V

OUT1, OUT2, AMPOUT, OUTDC

Maximum Forced Voltage . . . . . . . . . . . . . . . . –0.3V to 7.5V Maximum Forced Current . . . . . . . . . . . . . . Internally Limited

NEG1, NEG2, AMPIN, NEGDC

Maximum Forced Voltage . . . . . . . . . . . . . . . . –0.3V to 7.5V SINREF, SINFLT

Maximum Forced Voltage . . . . . . . . . . . . . . . . –0.3V to 7.5V Logic Inputs

Maximum Forced Voltage . . . . . . . . . . . . . . . . –0.3V to 7.5V Reference Output Current (REF) . . . . . . . . . . Internally Limited Output Current (GD1, GD2, GD3)

Pulsed. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5A Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C Junction Temperature. . . . . . . . . . . . . . . . . . . –55°C to +150°C Lead Temperature (Soldering, 10 Sec.). . . . . . . . . . . . . +300°C

Unless otherwise indicated, voltages are reference to ground and currents are positive into, negative out of the specified terminal. Pulsed is defined as a less than 10% duty cycle with a maximum duration of 500ns. Consult Packaging Section of Databook for thermal limitations and considerations of packages.

UCC2750

UCC3750

CONNECTION DIAGRAM

DIL-28, SOIC28 (Top

View)

RGOOD

1

28

GD2

GD1

2

27

ENBL

GND

3

26

GD3

VCP

4

25

REF

VS1

5

24

RT

VS2

6

23

CT

VDD

7

22

XTAL1

SWRLY

8

21

XTAL2

SINREF

9

20

FS0

SINFLT

10

19

FS1

OUTDC

11

18

NEG2

NEGDC

12

17

NEG1

AMPOUT

13

16

OUT1

AMPIN

14

15

OUT2

ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA = 0°C to 70°C for the UCC3750, –40°C to +85°C for the UCC2750, RT = 14k, CT = 470pF, C REF = 0.1 F, FS0 = 0, FS1 = 0, VDD = 5V. TA = TJ.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

VDD Supply

 

 

 

 

 

Supply Current - Active

With 12V Supplied to VCP and Charge Pump

 

0.5

1

mA

 

Disabled

 

 

 

 

Internal Reference w/External Bypass

 

 

 

 

 

Output Voltage (REF)

 

7.3

7.55

7.8

V

Load Regulation

IREF = 0mA – 2mA

 

30

60

mV

Line Regulation

VCP = 10V to 13V, IREF = 1mA

 

3

15

mV

Amplifier

 

 

 

 

 

Input Voltage

Error, DC Offset and Amp Amplifiers

2.9

3

3.1

V

 

DC Limit Amplifier

0.7125

0.75

0.7875

V

Input Bias Current

 

 

500

600

nA

AVOL

VOUT = 2V to 4V

 

70

 

dB

VOH

Source 100 A

5.35

6

7.0

V

VOL

Sink 100 A

 

0.2

0.65

V

Short Circuit Current

VIN = 0V and 5V with VOUT = 0V and 5V

0.5

2

3

mA

Sine Reference

 

 

 

 

 

Accuracy

TJ = 25°C, Program Frequency–Reference

–1

0

1

Hz

 

Frequency

 

 

 

 

Total Harmonic Distortion

(Note 1)

 

 

2

%

Amplitude

Peak

0.475

0.5

0.525

V

Offset

 

2.85

3.0

3.15

V

2

UCC2750

UCC3750

ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TA = 0°C to 70°C for the UCC3750, –40°C to +85°C for the UCC2750, RT = 14k, CT = 470pF, C REF = 0.1µ F, FS0 = 0, FS1 = 0, VDD = 5V. TA = TJ.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Oscillator

 

 

 

 

 

Accuracy

 

108

128

148

kHz

Peak Voltage

 

4.6

4.75

4.9

V

Valley Voltage

 

2.9

3.05

3.2

V

Charge Pump

 

 

 

 

 

Switch Pull Up Resistance (VS1, VS2)

 

 

10

30

Ω

Switch Pull Down Resistance (VS1, VS2)

 

 

10

30

Ω

Output Voltage (VCP)

VDD = 5V, IVCP = 10mA

11

12

14

V

Output Drivers

 

 

 

 

 

Pull Up Resistance

 

 

9

15

Ω

Pull Down Resistance

 

 

9

15

Ω

Rise Time

CL = 2.7nF

 

50

100

ns

Fall Time

CL = 2.7nF

 

50

100

ns

Current Limit

 

 

 

 

 

DC Limit Threshold Voltage Positive

R5/R6 = 3

0.4

0.5

0.6

V

DC Limit Threshold Voltage Negative

R5/R6 = 3

–0.6

–0.5

–0.4

V

Duty Cycle

 

 

 

 

 

Maximum PWM Duty Cycle

 

48

50

 

%

Rectifier Duty Cycle

 

 

50

 

%

Note 1: Guaranteed by measuring the steps of the PWL Sine Wave.

STATE

% VCC

VALUE FOR REF = 7.5

STATE

% VCC

VALUE FOR REF = 7.5

0

0.3333

2.5

5

0.4255

3.191

1

0.3384

2.538

6

0.4471

3.353

2

0.3528

2.646

7

0.4616

3.462

3

0.3745

2.808

8

0.4666

3.5

4

0.4

3

 

 

 

PIN DESCRIPTIONS

AMPIN: Inverting input of the uncommitted amplifier.

AMPOUT: Output of the uncommitted amplifier.

CT: This pin programs the internal PWM oscillator frequency. Capacitor from CT to GND sets the charge and discharge time of the oscillator.

ENBL: Logic input which enables the outputs and the charge pump when high. ENBL should be pulled low to turn the outputs off.

FS0, FS1: Frequency select pins for the internal sine-wave generator. Table 1 provides the SINREF frequencies as a function of FS0 and FS1 when a 32kHz crystal is used at the crystal inputs (XTAL1, XTAL2). Other proportional frequencies can be obtained with a different crystal. Inputs FS0 and FS1 are TTL compatible.

Table I. Frequency selection table

 

 

(for 32kHz crystal).

FS0

FS1

SINREF (Hz)

0

0

20

1

0

25

0

1

50

1

1

High Impedance

GD1: Output driver that controls the primary side switch in a flyback converter through a gate drive transformer. The output signal on this pin is PWM during positive power transfer modes and zero during negative power transfer modes.

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PIN DESCRIPTIONS (cont.)

GD2: Output driver that controls the p-channel secondary side switch in the flyback converter. The output signal on this pin is PWM during mode 4 (Fig. 2) when the reference signal is negative and power is being returned to the input. This pin functions as a synchronous rectifier output during mode 1 with positive reference signal and positive power transfer. This output is logically inverted to provide the correct polarity drive signal for a p-channel switch.

GD3: Output driver that controls the n-channel secondary side switch in the flyback converter. The output signal on this pin is PWM during mode 2 (Fig. 2) when the reference signal is positive and power is being returned to the input. This pin functions as a synchronous rectifier output during mode 3 with a negative reference signal and positive power transfer.

GND: Reference point for the internal reference and all thresholds. Also provides the signal return path for all other pins.

NEG1: Inverting input of the buffer amplifier that acts as a summing junction for the DC (battery) offset voltage and sinewave reference.

NEG2: Inverting input of the error amplifier where the ringer output voltage and the reference signal with the desired offset are applied with a weighted sum. Feedback compensation is connected between NEG2 and OUT2.

NEGDC: Inverting input of the amplifier used for DC current limiting.

OUT1: Output of the buffer amplifier that provides scaling and filtering for the reference signal before feeding it into the error amplifier. This output is also used internally to select the PWM mode for the flyback converter.

OUT2: Output of the error amplifier. Used to connect compensation components. This output’s absolute value determines the duty cycle of the PWM pulse. The polarity of this signal also determines the PWM mode.

OUTDC: Output of the DC current limit amplifier. The DC current limit is activated when this pin is above 4.5V or below 1.5V.

UCC2750

UCC3750

REF: Internal 7.5V reference. For best results, bypass to GND with a ceramic capacitor(>0.1µ F).

RGOOD: Logic output that indicates that the error amplifier output is within range (0< D< 0.5). This pin can source upto 0.5mA of current.

RT: Resistor from RT to GND helps set the oscillator frequency. RT programs the charge and discharge currents of CT.

SINFLT: This signal is the buffered version of SINREF. This signal is summed with the DC offset level with appropriate scaling.

SINREF: This pin is the output of the sine-wave reference generator. It has a high output impedance (≈ 25kΩ ). A 0.01µ F capacitor to GND is recommended to provide smoothing of the sinewave. When FS0 and FS1 are both set high, the sine reference generator is disabled allowing this pin to accept an external sinewave input.

SWRLY: Logic output that leads the battery offset crossings (by typically 5ms) to allow “zero voltage” relay switching. This pin can typically source 250µ A.

XTAL1: Crystal connection for external crystal. This pin can be also used to clock the internal sine wave generator when XTAL2 is connected to VDD/2.

XTAL2: Crystal connection for external crystal.

VCP: External connection for charge pump storage capacitor. A capacitance ≥ 2.2mF is recommended for low charge pump output ripple. The voltage at this pin is used by the output drivers for gate drive voltages. Alternatively, a regulated gate drive voltage (>10V) can be connected at this pin while leaving the charge pump circuit at nodes VS1, VS2 disconnected.

VDD: External supply input used to bias internal logic functions. Typically a regulated 5V supply is connected between this pin and GND. It also is the input voltage for the voltage tripler circuit to generate the gate drive voltage.

VS1, VS2: Voltage switches for the voltage tripler (charge pump circuit). They provide different voltage

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