Texas Instruments UCC3919PWTR, UCC3919PW, UCC3919N, UCC3919DTR, UCC3919D Datasheet

...
0 (0)
Texas Instruments UCC3919PWTR, UCC3919PW, UCC3919N, UCC3919DTR, UCC3919D Datasheet

application

INFO

available

UCC1919

UCC2919

UCC3919

3V to 8V Hot Swap Power Manager

FEATURES

Precision Fault Threshold

Charge Pump for Low RDSON High Side Drive

Differential Sense Inputs

Programmable Average Power Limiting

Programmable Linear Current Control

Programmable Fault Time

Fault Output Indicator

Manual and Automatic Reset Modes

Shutdown Control w/Programmable Softstart

Undervoltage Lockout

Electronic Circuit Breaker Function

DESCRIPTION

The UCC3919 family of Hot Swap Power Managers provide complete power management, hot swap, and fault handling capability. The UCC3919 features a duty ratio current limiting technique, which provides peak load capability while limiting the average power dissipation of the external pass transistor during fault conditions. The UCC3919 has two reset modes, selected with the TTL/CMOS compatible L/R pin. In one mode, when a fault occurs the IC repeatedly tries to reset itself at a user defined rate, with user defined maximum output current and pass transistor power dissipation. In the other mode the output latches off and stays off until either the L/R pin is reset or the shutdown pin is toggled. The on board charge pump circuit provides the necessary gate voltage for an external N-channel power FET.

BLOCK DIAGRAM

VDD

13

VDD

 

 

 

 

OVERLOAD

 

CHARGE

4

CAP

 

 

 

 

 

 

 

COMPARATOR

PUMP

 

 

 

 

 

 

 

 

 

CSP

14

 

 

 

 

LINEAR

 

 

 

 

 

 

 

 

+

 

 

 

 

 

 

 

 

 

 

CURRENT

 

 

 

 

 

 

 

OVERCURRENT

 

AMPLIFIER

 

 

 

 

 

 

 

 

 

+

 

 

DRIVER

10

GATE

 

 

 

COMPARATOR

 

 

 

CSN

12

 

 

 

 

 

VDD

 

 

 

 

 

 

 

 

 

 

 

 

 

 

50mV

 

 

 

 

 

UVLO

 

 

 

 

 

+

 

 

200mV

 

 

 

 

 

 

 

+

 

 

 

 

 

 

 

IMAX

1

 

 

 

 

+

 

 

UVLO

 

 

 

+

1.5v

VDD

 

 

 

 

 

 

 

 

 

2

1X

36 A

 

 

 

 

 

 

 

 

IBIAS

1X

 

 

 

 

 

 

 

 

 

UVBIAS

 

 

 

 

 

SET

 

 

 

 

 

 

 

 

 

 

 

DOMINANT

 

 

 

 

 

 

 

 

 

 

S

Q

 

 

 

 

FLT

 

 

 

 

 

 

 

 

 

 

 

SD

 

 

 

 

 

 

 

UVBIAS

 

 

PL

9

 

 

 

 

 

R

Q

FLT

 

 

 

 

 

 

 

 

 

 

 

 

+

S

Q

 

 

 

7

FLT

 

 

 

 

 

 

 

 

 

 

 

 

1.5V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CT

8

 

0.5V

 

 

 

S

Q

 

 

 

 

 

 

+

R

Q

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

11

 

 

 

 

 

R

Q

 

 

 

GND

 

1.2 A

 

 

 

RESET

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DOMINANT

 

 

 

 

 

 

 

SD

 

 

5

 

6

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LR

 

SD

 

 

Note: Pins shown for 14-pin package.

UDG-98123

07/99

ABSOLUTE MAXIMUM RATINGS

VDD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to 10V Pin Voltage

(All pins except CAP and GATE). . . . . . –0.3V to VDD + 0.3V Pin Voltage

(CAP and GATE) . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to 15V PL Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5mA to –10mA IBIAS Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0mA to 3mA Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C Junction Temperature. . . . . . . . . . . . . . . . . . . –55°C to +150°C Lead Temperature (Soldering, 10sec.) . . . . . . . . . . . . . +300°C

Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of package.

UCC1919

UCC2919

UCC3919

CONNECTION DIAGRAMS

DIL-14, (Top View)

N, J Packages

IMAX

 

 

 

CSP

1

 

14

IBIAS

 

 

 

VDD

 

 

 

2

 

13

N/C

 

 

 

CSN

 

 

 

3

 

12

CAP

 

 

 

GND

 

 

 

4

 

11

L/R

 

 

 

GATE

 

 

 

5

 

10

SD

 

 

 

PL

 

 

 

6

 

9

FLT

 

 

 

CT

 

 

 

7

 

8

 

 

 

 

 

 

 

 

 

 

SOIC-16, TSSOP-16 (Top View)

D or PW Package

 

 

 

 

 

 

 

 

 

 

IMAX

1

 

 

 

 

16

CSP

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IBIAS

2

 

 

 

 

15

VDD

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

N/C

3

 

 

 

 

14

CSN

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CAP

4

 

 

 

 

13

GND

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

L/R

5

 

 

 

 

12

GATE

 

SD

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

6

 

 

 

 

11

PL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

N/C

7

 

 

 

 

10

N/C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

FLT

8

 

 

 

 

9

CT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ELECTRICAL CHARACTERISTICS: Unless otherwise specified, VDD = 5V, TA = 0°C to 70°C for the UCC3919, –40°C to 85°C for the UCC2919 and –55°C to 125°C for the UCC1919. All voltages are with respect to GND. TA = TJ.

PARAMETER

 

 

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Input Supply

 

 

 

 

 

 

 

Supply Current

 

VDD = 3V

 

0.5

1

mA

 

 

VDD = 8V

 

1

1.5

mA

 

 

 

 

 

 

 

A

Shutdown Current

 

SD = 0.2V

 

1

7

Undervoltage Lockout

 

 

 

 

 

 

 

Minimum Voltage to Start

 

 

 

2.35

2.75

3

V

Minimum Voltage after Start

 

 

 

1.9

2.25

2.5

V

Hysteresis

 

 

 

0.25

0.5

0.75

V

IBIAS

 

 

 

 

 

 

 

Output Voltage, (0 A < IOUT < 15 A)

 

25°C, referred to CSP

1.47

1.5

1.53

V

 

 

Over Temperature Range, referred to CSP

1.44

1.5

1.56

V

Maximum Output Current

 

 

 

1

2

 

mA

2

UCC1919

UCC2919

UCC3919

ELECTRICAL CHARACTERISTICS: Unless otherwise specified, VDD = 5V, TA = 0°C to 70°C for the UCC3919, –40°C to 85°C for the UCC2919 and –55°C to 125°C for the UCC1919. All voltages are with respect to GND. TA = TJ.

 

 

 

 

 

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

 

Current Sense

 

 

 

 

 

 

 

Over Current Comparator Offset

Referred to CSP, 3V ≤ VDD ≤ 8V

–55

–50

–45

mV

 

 

Linear Current Amplifier Offset

VIMAX = 100mV, Referred to CSP,

–120

–100

–80

mV

 

 

 

 

 

 

3V ≤ VDD ≤ 8V

 

 

 

 

 

 

 

 

 

 

VIMAX = 400mV, Referred to CSP,

–440

–400

–360

mV

 

 

 

 

 

 

3V ≤ VDD ≤ 8V

 

 

 

 

 

 

Overload Comparator Offset

VIMAX = 100mV, Referred to CSP,

–360

–300

–240

mV

 

 

 

 

 

 

3V ≤ VDD ≤ 8V

 

 

 

 

 

 

CSN Input Common Mode Voltage Range

Referred to VDD, 3V ≤ VDD ≤ 8V, (Note 1)

–1.5

 

0.2

V

 

 

CSP Input Common Mode Voltage Range

Referred to VDD, 3V ≤ VDD ≤ 8V, (Note 1)

0

 

0.2

V

 

 

Input Bias Current CSN

 

 

1

5

µ A

 

 

Input Bias Current CSP

 

 

100

200

µ A

 

Current Fault Timer

 

 

 

 

 

 

 

CT Charge Current

VCT = 1V

–56

–35

–16

µ A

 

 

CT Discharge Current

VCT = 1V

0.5

1.2

1.9

µ A

 

 

On Time Duty Cycle in Fault

IPL = 0

1.5

3

6

%

 

 

CT Fault Threshold

 

1.0

1.5

1.7

V

 

 

CT Reset Threshold

 

0.25

0.5

0.75

V

 

IMAX

 

 

 

 

 

 

 

Input Bias Current

VIMAX = 100mV, Referred to CSP

–1

0

1

µ A

 

Power Limiting Section

 

 

 

 

 

 

 

Voltage on PL

IPL = –250µ A, Referred to VDD

–1.0

–1.4

–1.9

V

 

 

 

 

 

 

IPL = –1.5mA, Referred to VDD

–0.5

–1.8

–2.2

V

 

 

On Time Duty Cycle in Fault

IPL = –250µ A

0.25

0.5

1

%

 

 

 

 

 

 

IPL = –1.5mA

0.05

0.1

0.2

%

 

 

 

 

 

 

 

 

 

 

 

 

SD and L/R Inputs

 

 

 

 

 

 

 

Input Voltage Low

 

 

 

0.8

V

 

 

Input Voltage High

 

2

 

 

V

 

 

L/R Input Current

 

1

3

6

µ A

 

 

 

 

 

 

 

 

 

 

 

 

 

SD Internal Pulldown Impedance

 

100

270

500

k

 

 

 

 

 

 

 

 

 

 

 

 

FLT Output

 

 

 

 

 

 

 

Output Leakage Current

VDD = 5V

 

 

10

µ A

 

 

Output Low Voltage

IOUT = 10mA

 

 

1

V

 

FET GATE Driver and Charge Pump

 

 

 

 

 

 

 

Peak Output Current

VCAP = +15V, VGATE = 10V

–3

–1

–0.25

mA

 

 

Peak Sink Current

VGATE = 5V

 

20

 

mA

 

 

Fault Delay

 

 

100

300

nS

 

 

Maximum Output Voltage

VDD = 3V, Average IOUT = 1µ A

8

10

12

V

 

 

 

 

 

 

VDD = 8V, Average IOUT = 1µ A

12

14

16

V

 

 

Charge Pump UVLO Minimum Voltage to

VDD = 3V

6.5

7.5

 

V

 

 

Start

VDD = 8V

6.5

8

 

V

 

 

 

 

 

 

 

 

 

Charge Pump Source Impedance

VDD = 5V, Average IOUT = 1µ A

50

100

150

kΩ

Note 1: Guaranteed by design. Not 100% tested in production.

3

PIN DESCRIPTIONS

CAP: A capacitor is placed from this pin to ground to filter the output of the on board charge pump. A .01 F to 0.1 F capacitor is recommended .

CSN: The negative current sense input signal.

CSP: The positive current sense input signal.

CT: Input to the duty cycle timer. A capacitor is connected from this pin to ground, setting the off time and the maximum on time of the overcurrent protection circuits.

FLT: Fault indicator. This open drain output will pull low under any fault condition where the output driver is disabled. This output is disabled when the IC is in low current standby mode.

GATE: The output of the linear current amplifier. This pin drives the gate of an external N-channel MOSFET pass transistor. The linear current amplifier control loop is internally compensated, and guaranteed stable for output load (gate) capacitance between 100pF and .01 F. In applications where the GATE voltage (or charge pump voltage) exceeds the maximum Gate-to-Source voltage ratings (VGS) for the external N-channel MOSFET, a Zener clamp may be added to the gate of the MOSFET. No additional series resistance is required since the internal charge pump has a finite output impedance of 100ktypical.

GND: The ground reference for the device.

IBIAS: Output of the on board bias generator internally regulated to 1.5V below CSP. A resistor divider between this pin and CSP can be used to generate the IMAX voltage. The bias circuit is internally compensated, and requires no bypass capacitance. If an external bypass is required due to a noisy environment, the circuit will be

APPLICATION INFORMATION

The UCC3919 monitors the voltage drop across a high side sense resistor and compares it against three different voltage thresholds. These are discussed below. Figure 1 shows the UCC3919 waveforms under fault conditions.

Fault Threshold

The first threshold is fixed at 50mV. If the current is high enough such that the voltage on CSN is 50mV below CSP, the timing capacitor CT begins to charge at about 35 A if the PL pin is open. (Power limiting will be discussed later). If this threshold is exceeded long enough for CT to charge to 1.5V, a fault is declared and the exter-

UCC1919

UCC2919

UCC3919

stable with up to .001 F of capacitance. The bypass must be to CSP, since the bias voltage is generated with respect to CSP. Resistor R2 (Figure 4) should be greater than 50kto minimize the effect of the finite input impedance of the IBIAS pin on the IMAX threshold.

IMAX: Used to program the maximum allowable sourcing current. The voltage on this pin is with respect to CSP. If the voltage across the shunt resistor exceeds this voltage the linear current amplifier lowers the voltage at GATE to limit the output current to this level. If the voltage across the shunt resistor goes more than 200mV beyond this voltage, the gate drive pin GATE is immediately driven low and kept low for one full off time interval.

L/R: Latch/Reset. This pin sets the reset mode. If L/R is low and a fault occurs the device will begin duty ratio current limiting. If L/R is high and a fault occurs, GATE will go low and stay low until L/R is set low. This pin is internally pulled low by a 3 A nominal pulldown.

PL: Power Limit. This pin is used to control average power dissipation in the external MOSFET. If a resistor is connected from this pin to the source of the external MOSFET, the current in the resistor will be roughly proportional to the voltage across the FET. As the voltage across the FET increases, this current is added to the fault timer charge current, reducing the on time duty cycle from its nominal value of 3% and limiting the average power dissipation in the FET.

SD: Shutdown pin. If this pin is taken low, GATE will go low, and the IC will go into a low current standby mode and CT will be discharged. This TTL compatible input must be driven high to turn on.

VDD: The power connection for the device.

nal MOSFET will be turned off. It will either be latched off (until the power to the circuit is cycled, the L/R pin is taken low, or the SD pin is toggled), or will retry after a fixed off time (when CT has discharged to 0.5V), depending on whether the L/R pin is set high or low by the user. The equation for this current threshold is simply:

IFAULT

=

0 .05

(1)

RSENSE

 

 

 

 

The first time a fault occurs, CT is at ground, and must charge 1.5V. Therefore:

tFAULT

=

tON (sec)=

CT ( F) 1.5

(2)

35

 

 

 

 

 

4

Loading...
+ 7 hidden pages