Texas Instruments CD74ACT541SM, CD74ACT541M96, CD74ACT541M, CD74ACT541E, CD74ACT540M96 Datasheet

The CD54/74AC540, -541, and CD54/74ACT540, -541 octal buffer/line drivers use the RCA ADVANCED CMOS technology. The CD54/74AC/ACT540 are inverting 3-state buffers having two active-LOW output enables. The CD54/74AC/ACT541 are non-inverting 3-state buffers having two active-LOW output enables.

The CD74AC540, -541, and CD74ACT540, -541 are supplied in 20-lead dual-in-line plastic packages (E suffix) and in 20-lead dual-in-line small-outline plastic packages (M suffix). Both package types are operable over the following temperature ranges: Industrial (±40 to +85°C) and Extended Industrial/Military (±55 to +125°C).

The CD54AC540, -541, and CD54ACT540, -541, available in chip form (H suffix), are operable over the ±55 to +125°C temperature range.

Data sheet acquired from Harris Semiconductor SCHS285A ± Revised November 1999

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H

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PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 1999, Texas Instruments Incorporated

POST OFFICE BOX 655303 •DALLAS, TEXAS 75265

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MAXIMUM RATINGS, Absolute-Maximum Values:

DC SUPPLY-VOLTAGE (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±0.5 to 6 V DC INPUT DIODE CURRENT, IIK (for VI < ±0.5 or VI > VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA

DC OUTPUT DIODE CURRENT, IOK (for VO < ±0.5 or VO > VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA DC OUTPUT SOURCE OR SINK CURRENT per Output Pin, IO (for VO > ±0.5 or VO < VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . ±50 mA DC VCC OR GROUND CURRENT (ICC or IGND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA* PACKAGE THERMAL IMPEDANCE, θJA (see Note 1): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W

STORAGE TEMPERATURE (Tstg) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±65 to +150°C

LEAD TEMPERATURE (DURING SOLDERING):

At distance 1/16 ± 1/32 in. (1.59 ± 0.79 mm) from case for 10 s maximum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +265°C Unit inserted into PC board min. thickness 1/16 in. (1.59 mm) with solder contacting lead tips only . . . . . . . . . . . . . . . . . . . . . . . . +300°C

* For up to 4 outputs per device: add ±25 mA for each additional output.

NOTE 1: The package thermal impedance is calculated in accordance with JESD 51.

2	POST OFFICE BOX 655303 •DALLAS, TEXAS 75265

POST OFFICE BOX 655303 •DALLAS, TEXAS 75265

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