Texas Instruments CD4093BPWR, CD4093BM96, CD4093BM, CD4093BF3A, CD4093BF Datasheet

The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package (F suffix), 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line plastic small-outline package (M), and in chip form (H suffix). Add the suffix 96 to the M package for tape and reel.

PACKAGE THERMAL IMPEDANCE, θJA (See Note 1):

E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W

M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W

NOTE 1: Package thermal impedance is calculated in accordance with JESD 51.

VDD

VDD

VP

VOH

VN

VOLVSS

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 1999, Texas Instruments Incorporated

POST OFFICE BOX 655303 •DALLAS, TEXAS 75265

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