NSC 5962-9321701QSA, 5962-9321701Q2A, 5962-9321701QRA Datasheet

0 (0)

July 1998

54ABT273

Octal D-Type Flip-Flop

General Description

The 'ABT273 has eight edge-triggered D-type flip-flops with individual D inputs and Q outputs. The common buffered Clock (CP) and Master Reset (MR) inputs load and reset (clear) all flip-flops simultaneously.

The register is fully edge-triggered. The state of each D input, one setup time before the LOW-to-HIGH clock transition, is transferred to the corresponding flip-flop's Q output.

All outputs will be forced LOW independently of Clock or Data inputs by a LOW voltage level on the MR input. The device is useful for applications where the true output only is required and the Clock and Master Reset are common to all storage elements.

nBuffered common clock

nBuffered, asynchronous Master Reset

nSee 'ABT377 for clock enable version

nSee 'ABT373 for transparent latch version

nSee 'ABT374 for TRI-STATE® version

nOutput sink capability of 48 mA, source capability of 24 mA

nGuaranteed latchup protection

nHigh impedance glitch free bus loading during entire power up and power down cycle

nNon-destructive hot insertion capability

nDisable time less than enable time to avoid bus contention

nStandard Microcircuit Drawing (SMD) 5962-9321701

Features

n Eight edge-triggered D flip-flops

Ordering Code

Military

Package

Package Description

 

Number

 

 

 

 

54ABT273J-QML

J20A

20-Lead Ceramic Dual-In-Line

 

 

 

54ABT273W-QML

W20A

20-Lead Cerpack

 

 

 

54ABT273E-QML

E20A

20-Lead Ceramic Leadless Chip Carrier, Type C

 

 

 

TRI-STATE® is a registered trademark of National Semiconductor Corporation.

Flop-Flip Type-D Octal 54ABT273

© 1998 National Semiconductor Corporation

DS100205

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NSC 5962-9321701QSA, 5962-9321701Q2A, 5962-9321701QRA Datasheet

Connection Diagrams

Pin Assignment for DIP

Pin Assignment

and Flatpack

for LCC

DS100205-2

DS100205-1

 

Pin

Description

 

Names

 

 

 

 

 

 

D0±D7

Data Inputs

 

Master Reset

 

MR

 

 

 

 

(Active LOW)

CP

Clock Pulse Input

 

 

 

(Active Rising Edge)

Q0±Q7

Data Outputs

Truth Table

Mode Select-Function Table

Operating Mode

 

 

 

Inputs

 

Output

 

 

 

 

 

 

 

 

 

MR

 

CP

Dn

Qn

Reset (Clear)

 

L

X

X

L

 

 

 

 

 

 

 

Load ª1º

 

H

N

h

H

 

 

 

 

 

 

 

Load ª0º

 

H

N

l

L

 

 

 

 

 

 

 

H = HIGH Voltage Level steady state

h = HIGH Voltage Level one setup time prior to the LOW-to-HIGH clock transition

L = LOW Voltage Level steady state

I = LOW Voltage Level one setup time prior to the LOW-to-HIGH clock transition

X = Immaterial

N = LOW-to-HIGH clock transition

Logic Diagram

DS100205-3

Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.

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Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.

Storage Temperature

−65ÊC to +150ÊC

Ambient Temperature under Bias

−55ÊC to +125ÊC

Junction Temperature under Bias

 

Ceramic

−55ÊC to +175ÊC

VCC Pin Potential to

 

Ground Pin

−0.5V to +7.0V

Input Voltage (Note 2)

−0.5V to +7.0V

Input Current (Note 2)

−30 mA to +5.0 mA

Voltage Applied to Any Output

 

in the Disabled or

 

Power-Off State

−0.5V to +4.75V

in the HIGH State

−0.5V to V CC

Current Applied to Output

 

in LOW State (Max)

twice the rated IOL (mA)

DC Latchup Source Current

−500 mA

(Across Comm Operating Range)

 

Over Voltage Latchup

VCC + 4.5V

Recommended Operating

Conditions

Free Air Ambient Temperature

 

Military

−55ÊC to +125ÊC

Supply Voltage

 

Military

+4.5V to +5.5V

Minimum Input Edge Rate

( V/ t)

Data Input

50 mV/ns

Enable Input

20 mV/ns

Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.

Note 2: Either voltage limit or current limit is sufficient to protect inputs.

DC Electrical Characteristics

 

 

 

 

 

 

 

 

 

Symbol

Parameter

 

ABT273

Units

VCC

Conditions

 

 

 

 

Min

Typ Max

 

 

 

 

 

 

 

 

 

 

 

 

 

VIH

Input HIGH Voltage

 

2.0

 

V

 

Recognized HIGH Signal

 

VIL

Input LOW Voltage

 

 

0.8

V

 

Recognized LOW Signal

 

VCD

Input Clamp Diode Voltage

 

−1.2

V

Min

I IN = −18 mA

 

VOH

Output HIGH Voltage

54ABT

2.5

 

 

 

IOH = −3 mA

 

 

 

54ABT

2.0

 

V

Min

IOH = −24 mA

 

VOL

Output LOW Voltage

54ABT

 

0.55

V

Min

IOL = 48 mA

 

IIH

Input HIGH Current

 

 

5

µA

Max

VIN = 2.7V (Note 4)

 

 

 

 

 

5

 

 

VIN = VCC

 

IBVI

Input HIGH Current

 

 

7

µA

Max

VIN = 7.0V

 

 

Breakdown Test

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IIL

Input LOW Current

 

 

−5

µA

Max

V IN = 0.5V (Note 4)

 

 

 

 

 

−5

 

 

V IN = 0.0V

 

VID

Input Leakage Test

 

4.75

 

V

0.0

IID = 1.9 µA

 

 

 

 

 

 

 

 

All Other Pins Grounded

 

 

 

 

 

 

 

 

 

IOS

Output Short-Circuit Current

−100

−275

mA

Max

V OUT = 0.0V

 

ICEX

Output High Leakage Current

 

50

µA

Max

VOUT = VCC

 

ICCH

Power Supply Current

 

 

50

µA

Max

All Outputs HIGH

 

ICCL

Power Supply Current

 

 

30

mA

Max

All Outputs LOW

 

ICCT

Maximum ICC/Input

Outputs Enabled

 

 

 

 

VI = VCC − 2.1V

 

 

 

 

 

1.5

mA

Max

Data Input VI = VCC − 2.1V

 

 

 

 

 

 

 

 

All Others at VCC or GND

 

ICCD

Dynamic ICC

No Load

 

0.3

mA/

Max

Outputs Open (Note 3)

 

 

 

 

 

 

MHz

 

One Bit Toggling, 50% Duty Cycle

 

 

 

 

 

 

 

 

 

Note 3: For 8 bits toggling, ICCD < 0.5 mA/MHz.

Note 4: Guaranteed but not tested.

3

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