Philips BCX53-16, BCX53-10, BCX53, BCX52-10, BCX51-16 Datasheet

DISCRETE SEMICONDUCTORS

DATA SHEET

book, halfpage

M3D109

BCX51; BCX52; BCX53

PNP medium power transistors

Product specification			1999 Apr 19
Supersedes data of 1997 Jul 04

Philips Semiconductors	Product specification
PNP medium power transistors	BCX51; BCX52; BCX53

FEATURES

∙High current (max. 1 A)

∙Low voltage (max. 80 V).

APPLICATIONS

∙Medium power general purposes

∙Driver stages of audio amplifiers.

DESCRIPTION

PNP medium power transistor in a SOT89 plastic package. NPN complements: BCX54, BCX55 and BCX56.

MARKING

TYPE	MARKING	TYPE	MARKING
NUMBER	CODE	NUMBER	CODE
BCX51	AA	BCX52-16	AM
BCX51-10	AC	BCX53	AH
BCX51-16	AD	BCX53-10	AK
BCX52	AE	BCX53-16	AL
BCX52-10	AG

PINNING

PIN	DESCRIPTION
1	emitter
2	collector
3	base

handbook, halfpage

2

3

1

			1			2		3
Bottom view									MAM297

Fig.1 Simplified outline (SOT89) and symbol.

1999 Apr 19

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Philips Semiconductors					Product specification
PNP medium power transistors			BCX51; BCX52; BCX53
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL	PARAMETER	CONDITIONS		MIN.	MAX.	UNIT
VCBO	collector-base voltage	open emitter
	BCX51			−	−45	V
	BCX52			−	−60	V
	BCX53			−	−100	V
VCEO	collector-emitter voltage	open base
	BCX51			−	−45	V
	BCX52			−	−60	V
	BCX53			−	−80	V
VEBO	emitter-base voltage	open collector		−	−5	V
IC	collector current (DC)			−	−1	A
ICM	peak collector current			−	−1.5	A
IBM	peak base current			−	−200	mA
Ptot	total power dissipation	Tamb ≤ 25 °C; note 1		−	1.3	W
Tstg	storage temperature			−65	+150	°C
Tj	junction temperature			−	150	°C
Tamb	operating ambient temperature			−65	+150	°C

Note

1.Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm2.

For other mounting conditions, see “Thermal considerations for SOT89 in the General Part of associated Handbook”.

THERMAL CHARACTERISTICS

SYMBOL	PARAMETER	CONDITIONS	VALUE	UNIT
Rth j-a	thermal resistance from junction to ambient	note 1	94	K/W
Rth j-s	thermal resistance from junction to soldering point	note 1	14	K/W

Note

1.Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm2.

For other mounting conditions, see “Thermal considerations for SOT89 in the General Part of associated Handbook”.

1999 Apr 19

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