Texas Instruments TL062MJGB, TL064CPWR, TL064CPWLE, TL064CNSR, TL064CN Datasheet

TL061, TL061A, TL061B, TL061Y, TL062, TL062A TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS

SLOS078F ± NOVEMBER 1978 ± REVISED JANUARY 1999

DVery Low Power Consumption

DTypical Supply Current . . . 200 μA

(Per Amplifier)

DWide Common-Mode and Differential Voltage Ranges

DLow Input Bias and Offset Currents

DCommon-Mode Input Voltage Range Includes VCC+

DOutput Short-Circuit Protection

DHigh Input Impedance . . . JFET-Input Stage

DInternal Frequency Compensation

DLatch-Up-Free Operation

DHigh Slew Rate . . . 3.5 V/μs Typ

description

The JFET-input operational amplifiers of the TL06_ series are designed as low-power versions of the TL08_ series amplifiers. They feature high input impedance, wide bandwidth, high slew rate, and low input offset and input bias currents. The TL06_ series feature the same terminal assignments as the TL07_ and TL08_ series. Each of these JFET-input operational amplifiers incorporates well-matched, high-voltage JFET and bipolar transistors in a monolithic integrated circuit.

The C-suffix devices are characterized for operation from 0°C to 70°C. The I-suffix devices are characterized for operation from ±40°C to 85°C, and the M-suffix devices are characterized for operation over the full military temperature range of ±55°C to 125°C.

TL061, TL061A, TL061B D, JG, P, OR PW PACKAGE (TOP VIEW)

OFFSET N1	1		8	NC
IN±	2		7	VCC+
IN+	3		6	OUT
VCC±	4		5	OFFSET N2
TL061 . . . U PACKAGE
	(TOP VIEW)
NC		•1	10	NC
OFFSET N1		2	9	NC
IN±		3	8	VCC+
IN+		4	7	OUT
VCC±		5	6	OFFSET N2

TL062, TL062A, TL062B D, JG, P, OR PW PACKAGE (TOP VIEW)

1OUT		1	8		VCC+
1IN±		2	7		2OUT
1IN+		3	6		2IN±
VCC±		4	5		2IN+
TL062 . . . U PACKAGE
		(TOP VIEW)
NC		•1	10		NC
1OUT		2	9		VCC+
1IN±		3	8		2OUT
1IN+		4	7		2IN±
VCC±		5	6		2IN+

TL064 . . . D, J, N, PW, OR W PACKAGE TL064A, TL064B . . . D OR N PACKAGE (TOP VIEW)

1OUT		1	14		4OUT
1IN±		2	13		4IN±
1IN+		3	12		4IN+
VCC+		4	11		VCC±
2IN+		5	10		3IN+
2IN±		6	9		3IN±
2OUT		7	8		3OUT

NC ± No internal connection

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

Copyright 1999, Texas Instruments Incorporated

POST OFFICE BOX 655303 •DALLAS, TEXAS 75265

1

TL061, TL061A, TL061B, TL061Y, TL062, TL062A TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS

SLOS078F ± NOVEMBER 1978 ± REVISED JANUARY 1999

TL061 . . . FK PACKAGE

(TOP VIEW)

	NC	OFFSET N1	NC	NC	NC
NC	3	2	1	20 19		NC
	4				18
IN±	5				17	VCC+
NC	6				16	NC
IN+	7				15	OUT
NC	8				14	NC
	9	10 11 12 13

NC CC±	NC N2	NC
V	OFFSET

TL062 . . . FK PACKAGE	TL064 . . . FK PACKAGE
(TOP VIEW)	(TOP VIEW)

	NC	1OUT	NC	CC+	NC
				V
NC	3	2	1	20 19
	4				18
1IN±	5				17
NC	6				16
1IN+	7				15
NC	8				14
	9	10 11 12 13
	NC	CC±	NC	2IN+	NC
		V

		1IN±	1OUT	NC	4OUT	4IN±
NC	1IN+	3	2	1	20 19		4IN+
		4				18
2OUT	NC	5				17	NC
NC	VCC+	6				16	VCC±
2IN±	NC	7				15	NC
NC	2IN+	8				14	3IN+
		9	10 11 12 13
		2IN±	2OUT	NC	3OUT	3IN±

NC ± No internal connection

AVAILABLE OPTIONS

PACKAGED DEVICES

VIOMAX

CHIP FORM

TA

SMALL

SMALL

PLASTIC

PLASTIC

TSSOP

AT 25°C

OUTLINE

OUTLINE

DIP

DIP

(Y)

(PW)

(D008)²

(D014)²

(N)

(P)

15 mV

TL061CD

TL061CP

TL061CPW

TL061Y

6 mV

TL061ACD

TL061ACP

3 mV

TL061BCD

TL061BCP

0°C

15 mV

TL062CD

TL062CP

TL062CPW

TL062Y

to

6 mV

TL062ACD

TL062ACP

70°C

3 mV

TL062BCD

TL062BCP

15 mV

TL064CD

TL064CN

TL064CPW

TL064Y

6 mV

TL064ACD

TL064ACN

3 mV

TL064BCD

TL064BCN

PACKAGE

VIOMAX

TA

SMALL

SMALL

CHIP

CERAMIC

CERAMIC

PLASTIC

PLASTIC

FLAT

FLAT

AT 25°C

OUTLINE

OUTLINE

CARRIER

DIP

DIP

DIP

DIP

PACK

PACK

(D008)²

(D014)²

(FK)

(J)

(JG)

(N)

(P)

(U)

(W)

±40°C

TL061ID

TL061IP

to

6 mV

TL064ID

TL064IN

TL062ID

TL062IP

85°C

±55°C

6 mV

TL061MFK

TL061MJG

TL061MU

to

6 mV

TL062MFK

TL062MJG

TL062MU

125°C

9 mV

TL064MFK

TL064MJ

TL064MW

² The D package is available taped and reeled. Add the suffix R to the device type (e.g., TL061CDR).

2	POST OFFICE BOX 655303 •DALLAS, TEXAS 75265

TL061, TL061A, TL061B, TL061Y, TL062, TL062A

TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y

LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS

SLOS078F ± NOVEMBER 1978 ± REVISED JANUARY 1999

symbol (each amplifier)

IN+		+		OUT
IN±		±
	OFFSET N1 OFFSET N2
	Offset Null/Compensation
	TL061 Only
schematic (each amplifier)
			VCC+

IN+

50 Ω

IN±

100 Ω

C1

OFFSET N1

OFFSET N2

OUT

VCC±

TL061 Only

C1 = 10 pF on TL061, TL062, and TL064

Component values shown are nominal.

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3

TL061, TL061A, TL061B, TL061Y, TL062, TL062A

TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y

LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS

SLOS078F ± NOVEMBER 1978 ± REVISED JANUARY 1999

TL061Y chip information

This chip, when properly assembled, has characteristics similar to the TL061. Thermal compression or ultrasonic bonding can be used on the doped-aluminum bonding pads. The chips can be mounted with conductive epoxy or a gold-silicon preform.

Bonding-Pad Assignments

				(5)	(4)
				(6)			(3)
				(7)
41
				(8)	(1)		(2)
					53

OFFSET N1		(1)		VCC+
		(3)				(7)
IN+			+				(6)
IN±	(2)		±					OUT
						(4)
		(5)
OFFSET N2
				VCC±

Chip Thickness: 15 Mils Typical Bonding Pads: 4 × 4 Mils Minimum TJ(max) = 150°C

Tolerances Are ±10%.

All Dimensions Are in Mils. Pin (4) is Internally Connected to Backside of Chip.

4	POST OFFICE BOX 655303 •DALLAS, TEXAS 75265

TL061, TL061A, TL061B, TL061Y, TL062, TL062A

TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y

LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS

SLOS078F ± NOVEMBER 1978 ± REVISED JANUARY 1999

TL062Y chip information

This chip, when properly assembled, has characteristics similar to the TL062. Thermal compression or ultrasonic bonding can be used on the doped-aluminum bonding pads. The chips can be mounted with conductive epoxy or a gold-silicon preform.

Bonding-Pad Assignments

					(7)	(6)		(5)
					(8)
66								(4)
					(1)	(2)		(3)
						49

			VCC+
	(3)			(8)
1IN+		+
					(1)		1OUT
	(2)
1IN±		±
					(5)
		+					2IN+
2OUT	(7)
				±	(6)		2IN±
				(4)
			VCC±

Chip Thickness: 15 Mils Typical Bonding Pads: 4 × 4 Mils Minimum TJ(max) = 150°C

Tolerances Are ±10%.

All Dimensions Are in Mils.

Pin (4) is Internally Connected to Backside of Chip.

POST OFFICE BOX 655303 •DALLAS, TEXAS 75265

5

TL061, TL061A, TL061B, TL061Y, TL062, TL062A

TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y

LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS

SLOS078F ± NOVEMBER 1978 ± REVISED JANUARY 1999

TL064Y chip information

This chip, when properly assembled, has characteristics similar to the TL064. Thermal compression or ultrasonic bonding can be used on the doped-aluminum bonding pads. The chips can be mounted with conductive epoxy or a gold-silicon preform.

Bonding-Pad Assignments

				(13)	(12)	(11)	(10)	(9)
				(14)				(8)
60
				(1)				(7)
				(2)	(3)	(4)	(5)	(6)
						110

		VCC+
	(3)			(4)
1IN+		+
					(1)		1OUT
1IN±	(2)	±
					(5)
		+					2IN+
2OUT	(7)
		±			(6)		2IN±
4IN+	(10)
		+
					(8)		4OUT
4IN±	(9)	±
					(12)
		+					3IN+
3OUT	(14)
			±		(13)		3IN±
			(11)

VCC±

Chip Thickness: 15 Mils Typical Bonding Pads: 4 × 4 Mils Minimum TJ(max) = 150°C

Tolerances Are ±10%.

All Dimensions Are in Mils.

Pin (11) is Internally Connected to Backside of Chip.

6	POST OFFICE BOX 655303 •DALLAS, TEXAS 75265

TL061, TL061A, TL061B, TL061Y, TL062, TL062A

TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y

LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS

SLOS078F ± NOVEMBER 1978 ± REVISED JANUARY 1999

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)²

		TL06_C
		TL06_AC	TL06_I		TL06_M	UNIT
		TL06_BC
Supply voltage, VCC+ (see Note 1)		18	18		18	V
Supply voltage, VCC± (see Note 1)		±18	±18		±18	V
Differential input voltage, VID (see Note 2)		±30	±30		±30	V
Input voltage, VI (see Notes 1 and 3)		±15	±15		±15	V
Duration of output short circuit (see Note 4)		unlimited	unlimited		unlimited
Continuous total dissipation		See Dissipation Rating Table
Storage temperature range, Tstg		±65 to 150	±65 to 150		±65 to 150	°C
Case temperature for 60 seconds	FK package				260	°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds	J, JG, U, or				300	°C
	W package
Lead temperature 1,6 mm (1/6 inch) from case for 10 seconds	D, N, P, or	260	260			°C
	PW package

²Stresses beyond those listed under ªabsolute maximum ratingsº may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ªrecommended operating conditionsº is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. All voltage values except differential voltages are with respect to the midpoint between VCC+ and VCC±.

2.Differential voltages are at IN+ with respect to IN±.

3.The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.

4.The output may be shorted to ground or to either supply. Temperature and/or supply voltages must be limited to ensure that the dissipation rating is not exceeded.

DISSIPATION RATING TABLE

	PACKAGE	TA ≤ 25°C	DERATING	DERATE	TA = 70°C	TA = 85°C	TA = 125°C
		POWER RATING	FACTOR	ABOVE TA	POWER RATING	POWER RATING	POWER RATING
	D (8 pin)	680 mW	5.8 mW/°C	33°C	465 mW	378 mW	N/A
	D (14 pin)	680 mW	7.6 mW/°C	60°C	604 mW	490 mW	N/A
	FK	680 mW	11.0 mW/°C	88°C	680 mW	680 mW	273 mW
	J	680 mW	11.0 mW/°C	88°C	680 mW	680 mW	273 mW
	JG	680 mW	8.4 mW/°C	69°C	672 mW	546 mW	210 mW
	N	680 mW	9.2 mW/°C	76°C	680 mW	597 mW	N/A
	P	680 mW	8.0 mW/°C	65°C	640 mW	520 mW	N/A
	PW (8 pin)	525 mW	4.2 mW/°C	25°C	336 mW	N/A	N/A
	PW (14 pin)	700 mW	5.6 mW/°C	25°C	448 mW	N/A	N/A
	U	675 mW	5.4 mW/°C	25°C	432 mW	351 mW	135 mW
	W	680 mW	8.0 mW/°C	65°C	640 mW	520 mW	200 mW

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