Microchip Technology Inc 93C46BXT-I-SN, 93C46BXT-E-SN, 93C46BT-ST, 93C46BT-SN, 93C46BT-SM Datasheet

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M 93C46B

1K 5.0V Microwire Serial EEPROM

FEATURES

Single supply 5.0V operation

Low power CMOS technology

-1 mA active current (typical)

-1 A standby current (maximum)

64 x 16 bit organization

Self-timed ERASE and WRITE cycles (including auto-erase)

Automatic ERAL before WRAL

Power on/off data protection circuitry

Industry standard 3-wire serial interface

Device status signal during ERASE/WRITE cycles

Sequential READ function

1,000,000 E/W cycles guaranteed

Data retention > 200 years

8-pin PDIP/SOIC and 8-pin TSSOP packages

Available for the following temperature ranges:

-

Commercial (C):

0°C

to

+70°C

-

Industrial (I):

-40°C to

+85°C

-

Automotive (E):

-40°C

to

+125°C

BLOCK DIAGRAM

 

MEMORY

ADDRESS

 

 

ARRAY

DECODER

 

 

 

ADDRESS

 

 

 

COUNTER

 

 

DATA

OUTPUT

DO

 

REGISTER

BUFFER

 

 

DI

 

 

 

 

MEMORY

 

 

 

DECODE

 

 

CS

LOGIC

 

 

CLK

CLOCK

VCC

 

VSS

 

GENERATOR

 

 

 

 

 

 

DESCRIPTION

 

 

The Microchip Technology Inc. 93C46B is a 1K-bit, low-voltage serial Electrically Erasable PROM. The device memory is configured as 64 x 16 bits. Advanced CMOS technology makes this device ideal for low-power, nonvolatile memory applications. The 93C46B is available in standard 8-pin DIP, surface mount SOIC, and TSSOP packages. The 93C46BX are only offered in a 150 mil SOIC package.

PACKAGE TYPE

 

 

DIP

 

 

 

 

 

 

 

 

CS

1

 

8

VCC

 

 

 

1

 

 

 

 

 

 

 

 

CLK

 

93C46B

 

CS

 

 

 

 

 

 

 

 

 

 

 

3

 

 

DI

2

 

7

NC

 

2

DI

3

 

6

CLK

 

 

 

 

 

 

 

NC

 

 

 

 

 

 

 

 

 

 

4

 

5

 

 

 

 

 

 

 

 

 

 

 

 

DO

 

VSS

 

4

 

 

 

 

 

 

DO

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SOIC

 

 

 

 

 

 

 

 

 

 

 

SOIC

 

 

 

 

 

 

 

 

8

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

93C46B

 

 

 

 

VCC

NU

 

 

 

 

1

 

93C46BX

 

8

 

 

 

NC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

7

 

 

 

NC

VCC

 

 

 

 

2

 

 

7

 

 

 

VSS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

6

 

 

 

 

 

 

 

3

 

 

 

6

 

 

 

 

 

 

 

 

 

NC

CS

 

 

 

 

 

 

 

 

 

 

DO

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5

 

 

 

VSS

CLK

 

 

 

 

4

 

 

 

5

 

 

 

DI

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TSSOP

CS

 

93C46B

1

DO

4

CLK

2

 

DI

3

 

 

 

 

8

VCC

7

NC

6

NC

5

VSS

 

 

 

Microwire is a registered trademark of National Semiconductor Incorporated.

1997 Microchip Technology Inc.

Preliminary

DS21172D-page 1

93C46B

1.0ELECTRICAL CHARACTERISTICS

1.1Maximum Ratings*

VCC...................................................................................

 

7.0V

All inputs and outputs w.r.t. VSS ...............

-0.6V to VCC +1.0V

Storage temperature .....................................

-65°C to +150°C

Ambient temp. with power applied.................

-65°C to +125°C

Soldering temperature of leads (10 seconds) .............

+300°C

ESD protection on all pins................................................

 

4 kV

*Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

TABLE 1-1

PIN FUNCTION TABLE

 

 

Name

Function

 

 

 

 

CS

Chip Select

CLK

Serial Data Clock

DI

Serial Data Input

DO

Serial Data Output

VSS

Ground

NC

No Connect

VCC

Power Supply

 

 

TABLE 1-2

DC AND AC ELECTRICAL CHARACTERISTICS

 

 

All parameters apply over the

Commercial (C)

VCC = +4.5V to +5.5V

Tamb = 0°C to +70°C

specified operating ranges

Industrial (I)

 

VCC = +4.5V to +5.5V

Tamb = -40°C to +85°C

unless otherwise noted

Automotive (E)

VCC = +4.5V to +5.5V Tamb = -40°C to +125°C

 

 

 

 

 

 

 

 

Parameter

Symbol

 

Min.

 

Max.

Units

 

Conditions

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

High level input voltage

VIH

 

2.0

 

VCC +1

V

 

(Note 2)

 

 

 

 

 

 

 

 

 

Low level input voltage

VIL

 

-0.3

 

0.8

V

 

 

 

 

 

 

 

 

 

 

 

Low level output voltage

VOL

 

 

0.4

V

 

IOL = 2.1 mA; VCC = 4.5V

 

 

 

 

 

 

 

 

 

High level output voltage

VOH

 

2.4

 

V

 

IOH = -400 A; VCC = 4.5V

 

 

 

 

 

 

 

 

 

Input leakage current

ILI

 

-10

 

10

A

 

VIN = VSS to VCC

 

 

 

 

 

 

 

 

 

Output leakage current

ILO

 

-10

 

10

A

 

VOUT = VSS to VCC

 

 

 

 

 

 

 

 

 

 

Pin capacitance

 

CIN, COUT

 

 

7

pF

 

VIN/VOUT = 0 V (Notes 1 & 2)

(all inputs/outputs)

 

 

 

Tamb = +25°C, FCLK = 1 MHz

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ICC read

 

 

1

mA

 

 

 

 

 

 

 

 

 

 

 

 

Operating current

 

ICC write

 

 

1.5

mA

 

 

 

 

 

 

 

 

 

 

 

 

Standby current

 

ICCS

 

 

1

A

 

CS = VSS

 

 

 

 

 

 

 

 

 

 

Clock frequency

 

FCLK

 

 

2

MHz

 

VCC = 4.5V

 

 

 

 

 

 

 

 

 

 

Clock high time

 

TCKH

 

250

 

ns

 

 

 

 

 

 

 

 

 

 

 

 

Clock low time

 

TCKL

 

250

 

ns

 

 

 

 

 

 

 

 

 

 

 

Chip select setup time

TCSS

 

50

 

ns

 

Relative to CLK

 

 

 

 

 

 

 

 

 

Chip select hold time

TCSH

 

0

 

ns

 

Relative to CLK

 

 

 

 

 

 

 

 

 

Chip select low time

TCSL

 

250

 

ns

 

 

 

 

 

 

 

 

 

 

 

Data input setup time

TDIS

 

100

 

ns

 

Relative to CLK

 

 

 

 

 

 

 

 

 

Data input hold time

TDIH

 

100

 

ns

 

Relative to CLK

 

 

 

 

 

 

 

 

 

Data output delay time

TPD

 

 

400

ns

 

CL = 100 pF

 

 

 

 

 

 

 

 

 

Data output disable time

TCZ

 

 

100

ns

 

CL = 100 pF (Note 2)

 

 

 

 

 

 

 

 

 

 

Status valid time

 

TSV

 

 

500

ns

 

CL = 100 pF

 

 

 

 

 

 

 

 

 

 

 

 

TWC

 

 

2

ms

 

ERASE/WRITE mode

Program cycle time

 

 

 

 

 

 

 

 

TEC

 

 

6

ms

 

ERAL mode

 

 

 

 

 

 

 

 

 

 

 

 

TWL

 

 

15

ms

 

WRAL mode

 

 

 

 

 

 

 

 

 

 

Endurance

 

 

1M

 

cycles

 

25°C, VCC = 5.0V, Block Mode (Note 3)

 

 

 

 

 

 

 

 

 

 

Note 1: This parameter is tested at Tamb = 25°C and FCLK = 1 MHz.

2:This parameter is periodically sampled and not 100% tested.

3:This application is not tested but guaranteed by characterization. For endurance estimates in a specifi application, please consult the Total Endurance Model which may be obtained on Microchip’s BBS or website.

DS21172D-page 2

Preliminary

1997 Microchip Technology Inc.

93C46B

2.0PIN DESCRIPTION

2.1Chip Select (CS)

A high level selects the device; a low level deselects the device and forces it into standby mode. However, a programming cycle which is already in progress will be completed, regardless of the Chip Select (CS) input signal. If CS is brought low during a program cycle, the device will go into standby mode as soon as the programming cycle is completed.

CS must be low for 250 ns minimum (TCSL) between consecutive instructions. If CS is low, the internal control logic is held in a RESET status.

2.2Serial Clock (CLK)

The Serial Clock (CLK) is used to synchronize the communication between a master device and the 93C46B. Opcodes, addresses, and data bits are clocked in on the positive edge of CLK. Data bits are also clocked out on the positive edge of CLK.

CLK can be stopped anywhere in the transmission sequence (at high or low level) and can be continued anytime with respect to clock high time (TCKH) and clock low time (TCKL). This gives the controlling master freedom in preparing the opcode, address, and data.

CLK is a “Don't Care”if CS is low (device deselected). If CS is high, but START condition has not been detected, any number of clock cycles can be received by the device, without changing its status (i.e., waiting for a START condition).

CLK cycles are not required during the self-timed WRITE (i.e., auto ERASE/WRITE) cycle.

After detecting a START condition, the specified number of clock cycles (respectively low to high transitions of CLK) must be provided. These clock cycles are required to clock in all required opcodes, addresses, and data bits before an instruction is executed (Table 2-1). CLK and DI then become don't care inputs waiting for a new START condition to be detected.

Note: CS must go low between consecutive instructions.

2.3Data In (DI)

Data In (DI) is used to clock in a START bit, opcode, address, and data synchronously with the CLK input.

2.4Data Out (DO)

Data Out (DO) is used in the READ mode to output data synchronously with the CLK input (TPD after the positive edge of CLK).

This pin also provides READY/BUSY status information during ERASE and WRITE cycles. READY/BUSY status information is available on the DO pin if CS is brought high after being low for minimum chip select low time (TCSL) and an ERASE or WRITE operation has been initiated.

The status signal is not available on DO, if CS is held low during the entire ERASE or WRITE cycle. In this case, DO is in the HIGH-Z mode. If status is checked after the ERASE/WRITE cycle, the data line will be high to indicate the device is ready.

TABLE 2-1

INSTRUCTION SET FOR 93C46B

 

 

 

 

 

 

 

 

Instruction

SB

Opcode

 

 

Address

 

 

Data In

Data Out

Req. CLK Cycles

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ERASE

1

11

A5

A4

A3

A2

A1

A0

 

 

 

 

9

(RDY/BSY)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ERAL

1

00

1

0

X

X

X

X

 

 

 

 

9

(RDY/BSY)

 

 

 

 

 

 

 

 

 

 

 

 

 

EWDS

1

00

0

0

X

X

X

X

HIGH-Z

9

 

 

 

 

 

 

 

 

 

 

 

 

EWEN

1

00

1

1

X

X

X

X

HIGH-Z

9

 

 

 

 

 

 

 

 

 

 

 

 

READ

1

10

A5

A4

A3

A2

A1

A0

D15 - D0

25

 

 

 

 

 

 

 

 

 

 

 

 

 

WRITE

1

01

A5

A4

A3

A2

A1

A0

D15 - D0

 

 

 

 

25

(RDY/BSY)

 

 

 

 

 

 

 

 

 

 

 

 

 

WRAL

1

00

0

1

X

X

X

X

D15 - D0

 

 

 

 

25

(RDY/BSY)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1997 Microchip Technology Inc.

Preliminary

DS21172D-page 3

Microchip Technology Inc 93C46BXT-I-SN, 93C46BXT-E-SN, 93C46BT-ST, 93C46BT-SN, 93C46BT-SM Datasheet

93C46B

3.0FUNCTIONAL DESCRIPTION

Instructions, addresses and write data are clocked into the DI pin on the rising edge of the clock (CLK). The DO pin is normally held in a HIGH-Z state except when reading data from the device, or when checking the READY/BUSY status during a programming operation. The READY/BUSY status can be verified during an ERASE/WRITE operation by polling the DO pin; DO low indicates that programming is still in progress, while DO high indicates the device is ready. The DO will enter the HIGH-Z state on the falling edge of the CS.

3.1START Condition

The START bit is detected by the device if CS and DI are both high with respect to the positive edge of CLK for the first time.

Before a START condition is detected, CS, CLK, and DI may change in any combination (except to that of a START condition), without resulting in any device operation (ERASE, ERAL, EWDS, EWEN, READ, WRITE, and WRAL). As soon as CS is high, the device is no longer in the standby mode.

An instruction following a START condition will only be executed if the required amount of opcodes, addresses, and data bits for any particular instruction is clocked in.

After execution of an instruction (i.e., clock in or out of the last required address or data bit) CLK and DI become don't care bits until a new START condition is detected.

3.2Data In (DI) and Data Out (DO)

It is possible to connect the Data In (DI)and Data Out (DO) pins together. However, with this configuration, if A0 is a logic-high level, it is possible for a “bus conflict” to occur during the “dummy zero” that precedes the READ operation. Under such a condition, the voltage level seen at DO is undefined and will depend upon the relative impedances of DO and the signal source driving A0. The higher the current sourcing capability of A0, the higher the voltage at the DO pin.

3.3Data Protection

During power-up, all programming modes of operation are inhibited until Vcc has reached a level greater than 3.8V. During power-down, the source data protection circuitry acts to inhibit all programming modes when Vcc has fallen below 3.8V at nominal conditions.

The ERASE/SRITE Disable (EWDS) and ERASE/ WRITE Enable (EWEN) commands give additional protection against accidental programming during normal operation.

After power-up, the device is automatically in the EWDS mode. Therefore, an EWEN instruction must be performed before any ERASE or WRITE instruction can be executed.

FIGURE 3-1: SYNCHRONOUS DATA TIMING

 

CS

VIH

 

 

 

 

 

 

 

 

 

 

VIL

TCSS

TCKH

TCKL

 

 

VIH

 

 

TCSH

 

 

 

 

 

 

CLK

 

 

 

 

 

 

VIL

 

 

 

 

 

 

TDIS

TDIH

 

 

 

VIH

 

 

 

 

DI

 

 

 

 

 

 

VIL

 

 

 

 

 

 

 

 

TCZ

 

 

 

 

TPD

TPD

 

 

 

 

 

 

DO VOH

 

 

 

(READ)

VOL

 

 

TCZ

 

 

TSV

 

 

 

 

 

 

 

 

DO VOH

 

 

STATUS VALID

(PROGRAM)

 

 

 

VOL

 

 

 

 

 

 

 

 

Note:

AC test conditions: VIL = 0.4V, VIH = 2.4V

 

DS21172D-page 4

Preliminary

1997 Microchip Technology Inc.

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