28LV64A
64K (8K x 8) Low Voltage CMOS EEPROM
•2.7V to 3.6V Supply
•Read Access Time—300 ns
•CMOS Technology for Low Power Dissipation
-8 mA Active
-50 A CMOS Standby Current
•Byte Write Time—3 ms
•Data Retention >200 years
•High Endurance - Minimum 100,000 Erase/Write Cycles
•Automatic Write Operation
-Internal Control Timer
-Auto-Clear Before Write Operation
-On-Chip Address and Data Latches
•Data Polling
•Ready/Busy
•Chip Clear Operation
•Enhanced Data Protection
-VCC Detector
-Pulse Filter
-Write Inhibit
•Electronic Signature for Device Identification
•Organized 8Kx8 JEDEC Standard Pinout
-28-pin Dual-In-Line Package
-32-pin Chip Carrier (Leadless or Plastic)
-28-pin Thin Small Outline Package (TSOP) 8x20mm
-28-pin Very Small Outline Package (VSOP) 8x13.4mm
•Available for Extended Temperature Ranges:
-Commercial: 0˚C to +70˚C
-Industrial: -40˚C to +85˚C
RDY/BSY |
• 1 |
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28 |
Vcc |
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3 A12 |
RDY/BSY2 |
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32 Vcc |
31 WE |
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A12 |
2 |
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27 |
WE |
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4 A7 |
1 NU |
30 NC |
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A7 |
3 |
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26 |
NC |
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A6 |
4 |
DIP/SOIC |
25 |
A8 |
A6 |
5 |
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29 |
A8 |
A5 |
5 |
24 |
A9 |
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A5 |
6 |
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PLCC/LCC |
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28 |
A9 |
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A4 |
6 |
23 |
A11 |
A4 |
7 |
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27 |
A11 |
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A3 |
7 |
22 |
OE |
A3 8 |
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26 |
NC |
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A2 |
8 |
21 |
A10 |
A2 |
9 |
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25 |
OE |
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A1 |
9 |
20 |
CE |
A1 |
10 |
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24 |
A10 |
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A0 |
11 |
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23 |
CE |
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A0 |
10 |
19 |
I/O7 |
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NC 12 |
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22 |
I/O7 |
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I/O0 |
11 |
18 |
I/O6 |
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I/O0 |
13 |
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21 |
I/O6 |
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I/O1 |
12 |
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17 |
I/O5 |
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14 |
15 |
16 |
17 |
18 |
19 |
20 |
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I/O2 |
13 |
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16 |
I/O4 |
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I/O1 |
I/O2 |
Vss |
NU |
I/O3 |
I/O4 |
I/O5 |
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VSS |
14 |
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15 |
I/O3 |
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• Pin 1 indicator on PLCC on top of package |
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OE |
1 |
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28 |
A10 |
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A11 |
2 |
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27 |
CE |
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A9 |
3 |
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26 |
I/07 |
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A8 |
4 |
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25 |
I/06 |
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NC |
5 |
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TSOP |
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24 |
I/05 |
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WE |
6 |
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23 |
I/04 |
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Vcc |
7 |
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22 |
I/03 |
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RDY/BSY |
8 |
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21 |
Vss |
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A12 |
9 |
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20 |
I/02 |
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A7 |
10 |
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19 |
I/01 |
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A6 |
11 |
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18 |
I/00 |
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A5 |
12 |
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17 |
A0 |
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A4 |
13 |
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16 |
A1 |
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A3 |
14 |
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15 |
A2 |
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OE |
22 |
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21 |
A10 |
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A11 |
23 |
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20 |
CE |
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A9 |
24 |
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19 |
I/O7 |
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A8 |
25 |
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18 |
I/O6 |
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NC |
26 |
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VSOP |
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17 |
I/O5 |
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WE |
27 |
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16 |
I/O4 |
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VCC |
28 |
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15 |
I/O3 |
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RDY/BSY |
1 |
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14 |
VSS |
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A12 |
2 |
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13 |
I/O2 |
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A7 |
3 |
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12 |
I/O1 |
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A6 |
4 |
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11 |
I/O0 |
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A5 |
5 |
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10 |
A0 |
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A4 |
6 |
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9 |
A1 |
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A3 |
7 |
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8 |
A2 |
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DESCRIPTION |
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BLOCK DIAGRAM |
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I/O0...................I/O7 |
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The Microchip Technology Inc. 28LV64A is a CMOS 64K non-vol- |
VSS |
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atile electrically Erasable PROM organized as 8K words by 8 bits. |
Data Protection |
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VCC |
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The 28LV64A is accessed like a static RAM for the read or write |
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Circuitry |
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Chip Enable/ |
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cycles without the need of external components. During a “byte |
CE |
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write”, the address and data are latched internally, freeing the |
OE |
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Output Enable |
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Control Logic |
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microprocessor address and data bus for other operations. Fol- |
WE |
Auto Erase/Write |
Data |
Input/Output |
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lowing the initiation of write cycle, the device will go to a busy state |
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Timing |
Poll |
Buffers |
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Rdy/ |
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and automatically clear and write the latched data using an inter- |
Program Voltage |
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Busy |
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nal control timer. To determine when the write cycle is complete, |
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Generation |
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the user has a choice of monitoring the Ready/Busy output or |
A0 |
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Y |
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using Data polling. The Ready/Busy pin is an open drain output, |
I |
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Y Gating |
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I |
L |
Decoder |
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which allows easy configuration in ‘wired-or’ systems. |
Alterna- |
I |
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a |
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t |
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tively, Data polling allows the user to read the location last written |
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c |
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I |
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to when the write operation is complete. CMOS design and pro- |
h |
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I |
X |
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64K bit |
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e |
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I |
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cessing enables this part to be used in systems where reduced |
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Decoder |
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Cell Matrix |
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power consumption and reliability are required. A complete family |
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of packages is offered to provide the utmost flexibility in applica- |
A12 |
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tions. |
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1996 Microchip Technology Inc. |
Preliminary |
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DS21113B-page 1 |
28LV64A
MAXIMUM RATINGS*
VCC and input voltages w.r.t. VSS ...... |
-0.6V to + 6.25V |
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Voltage on |
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w.r.t. VSS |
-0.6V to +13.5V |
OE |
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Voltage on A9 w.r.t. VSS....................... |
-0.6V to +13.5V |
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Output Voltage w.r.t. VSS ............... |
-0.6V to VCC+0.6V |
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Storage temperature .......................... |
-65˚C to +150˚C |
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Ambient temp. with power applied ..... |
-55°C to +125°C |
*Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
TABLE 1-1: PIN FUCTION TABLE
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Name |
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Function |
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A0 - A12 |
Address Inputs |
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Chip Enable |
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CE |
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Output Enable |
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OE |
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Write Enable |
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WE |
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I/O0 - I/O7 |
Data Inputs/Outputs |
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RDY/Busy |
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Ready/Busy |
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VCC |
+ Power Supply |
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VSS |
Ground |
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NC |
No Connect; No Internal Connection |
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NU |
Not Used; No External Connection is |
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Allowed |
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TABLE 1-2: |
READ/WRITE OPERATION DC CHARACTERISTICS |
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VCC = 2.7 to 3.6V |
0°C to 70°C |
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Commercial (C): Tamb = |
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Industrial |
(I): Tamb = |
-40°C to 85°C |
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Parameter |
Status |
Symbol |
Min |
Max |
Units |
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Conditions |
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Input Voltages |
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Logic “1” |
VIH |
2.0 |
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V |
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Logic “2” |
VIL |
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0.6 |
V |
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Input Leakage |
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— |
I LI |
— |
5 |
A |
VIN = 0V to VCC+1 |
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Input Capacitance |
— |
C IN |
— |
6 |
pF |
Vin = 0V; Tamb = 25 °C; |
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f = 1 MHz (Note 1) |
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Output Voltages |
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Logic “1” |
VOH |
2.0 |
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V |
IOH = -100 A |
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Logic “0” |
VOL |
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0.3 |
V |
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IOL = 1.0 mA |
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I0L = 2.0 mA for RDY/Busy |
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Output Leakage |
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— |
I LO |
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5 |
A |
VOUT = 0V to VCC+0.1V |
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Output Capacitance |
— |
C OUT |
— |
12 |
pF |
V OUT = 0V; Tamb = 25°C; |
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f = 1 MHz (Note 1) |
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Power Supply Current, Activity |
TTL input |
ICC |
— |
8 |
mA |
f = 5 MHz (Note 2) |
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IO = OmA |
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VCC = 3.3 |
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= VIL |
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CE |
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Power Supply Current, Standby |
TTL input |
ICC(S)TTL |
— |
2 |
mA |
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= VIH (0°C to 70°C°) |
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CE |
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TTL input |
ICC(S)TTL |
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3 |
mA |
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= VIH (-40°C to 85°C°) |
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CE |
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CMOS input |
ICC(S)CMOS |
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100 |
A |
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= VCC -3.0 to VCC+1 |
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CE |
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Note 1: Not 100% tested. |
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2: AC power supply current above 5 MHz: 2 mA/Mhz. |
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DS21113B-page 2 |
Preliminary |
1996 Microchip Technology Inc. |
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28LV64A |
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TABLE 1-3: READ OPERATION AC CHARACTERISTICS |
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AC Testing Waveform: |
VIH = 2.0V; |
VIL = 0.6V; VOH = VOL = VCC/2 |
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Output Load: |
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1 TTL Load + 100 pF |
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Input Rise and Fall Times: |
20 ns |
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Ambient Temperature: |
Commercial (C): Tamb = 0°C to +70°C |
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Industrial |
(I) : Tamb = -40°C to +85°C |
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Parameter |
Sym |
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28LV64-30 |
Units |
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Conditions |
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Min |
Max |
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Address to Output Delay |
tACC |
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— |
300 |
ns |
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= |
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= VIL |
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OE |
CE |
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to Output Delay |
tCE |
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— |
300 |
ns |
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= VIL |
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CE |
OE |
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to Output Delay |
tOE |
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— |
150 |
ns |
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= VIL |
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OE |
CE |
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or |
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High to Output Float |
tOFF |
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0 |
60 |
ns |
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(Note 1) |
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CE |
OE |
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Output Hold from Address, |
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tOH |
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0 |
— |
ns |
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(Note 1) |
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CE |
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OE, |
whichever occurs first. |
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Endurance |
— |
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10M |
— |
cycles |
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25 °C, Vcc = 5.0V, |
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Block Mode (Note 2) |
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Note 1: Not 100% tested.
2:This parameter is not tested but guaranteed by characterization. For endurance estimates in a specific application, please consult the Total Endurance Model which can be obtained on our BBS or website.
FIGURE 1-1: READ WAVEFORMS
Address |
VIH |
Address Valid |
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VIL |
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VIH |
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CE |
VIL |
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tCE(2) |
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VIH |
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OE |
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tOFF(1,3) |
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VIL |
tOE(2) |
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tOH |
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VOH |
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High Z |
Data |
High Z |
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VOL |
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Valid Output |
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tACC |
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WE |
VIH |
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VIL |
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Notes: (1) tOFF is specified for OE or CE, whichever occurs first
(2)OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE
(3)This parameter is sampled and is not 100% tested
1996 Microchip Technology Inc. |
Preliminary |
DS21113B-page 3 |