Microchip Technology Inc 28LV64A-T-20-P, 28LV64A-T-20-L, 28LV64A-FT-30I-VS, 28LV64A-FT-30I-TS, 28LV64A-FT-30I-SO Datasheet

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Microchip Technology Inc 28LV64A-T-20-P, 28LV64A-T-20-L, 28LV64A-FT-30I-VS, 28LV64A-FT-30I-TS, 28LV64A-FT-30I-SO Datasheet

28LV64A

64K (8K x 8) Low Voltage CMOS EEPROM

FEATURES

2.7V to 3.6V Supply

Read Access Time—300 ns

CMOS Technology for Low Power Dissipation

-8 mA Active

-50 A CMOS Standby Current

Byte Write Time—3 ms

Data Retention >200 years

High Endurance - Minimum 100,000 Erase/Write Cycles

Automatic Write Operation

-Internal Control Timer

-Auto-Clear Before Write Operation

-On-Chip Address and Data Latches

Data Polling

Ready/Busy

Chip Clear Operation

Enhanced Data Protection

-VCC Detector

-Pulse Filter

-Write Inhibit

Electronic Signature for Device Identification

Organized 8Kx8 JEDEC Standard Pinout

-28-pin Dual-In-Line Package

-32-pin Chip Carrier (Leadless or Plastic)

-28-pin Thin Small Outline Package (TSOP) 8x20mm

-28-pin Very Small Outline Package (VSOP) 8x13.4mm

Available for Extended Temperature Ranges:

-Commercial: 0˚C to +70˚C

-Industrial: -40˚C to +85˚C

PACKAGE TYPES

RDY/BSY

• 1

 

28

Vcc

 

 

3 A12

RDY/BSY2

 

32 Vcc

31 WE

 

 

A12

2

 

27

WE

 

4 A7

1 NU

30 NC

 

A7

3

 

26

NC

 

 

A6

4

DIP/SOIC

25

A8

A6

5

 

 

 

 

 

29

A8

A5

5

24

A9

 

 

 

 

 

A5

6

 

 

PLCC/LCC

 

 

28

A9

A4

6

23

A11

A4

7

 

 

 

 

27

A11

A3

7

22

OE

A3 8

 

 

 

 

26

NC

A2

8

21

A10

A2

9

 

 

 

 

25

OE

A1

9

20

CE

A1

10

 

 

 

 

24

A10

A0

11

 

 

 

 

23

CE

A0

10

19

I/O7

 

 

 

 

NC 12

 

 

 

 

22

I/O7

I/O0

11

18

I/O6

 

 

 

 

I/O0

13

 

 

 

 

21

I/O6

 

 

 

 

 

 

I/O1

12

 

17

I/O5

 

14

15

16

17

18

19

20

 

I/O2

13

 

16

I/O4

 

 

 

 

I/O1

I/O2

Vss

NU

I/O3

I/O4

I/O5

 

VSS

14

 

15

I/O3

 

 

 

• Pin 1 indicator on PLCC on top of package

 

OE

1

 

 

 

 

 

 

 

 

 

28

A10

 

A11

2

 

 

 

 

 

 

 

 

 

27

CE

 

A9

3

 

 

 

 

 

 

 

 

 

26

I/07

 

A8

4

 

 

 

 

 

 

 

 

 

25

I/06

 

NC

5

 

 

 

TSOP

 

 

 

 

 

24

I/05

 

WE

6

 

 

 

 

 

 

 

 

23

I/04

 

Vcc

7

 

 

 

 

 

 

 

 

22

I/03

 

RDY/BSY

8

 

 

 

 

 

 

 

 

21

Vss

 

 

 

 

 

 

 

 

 

 

 

A12

9

 

 

 

 

 

 

 

 

 

20

I/02

 

A7

10

 

 

 

 

 

 

 

 

 

19

I/01

 

A6

11

 

 

 

 

 

 

 

 

 

18

I/00

 

A5

12

 

 

 

 

 

 

 

 

 

17

A0

 

A4

13

 

 

 

 

 

 

 

 

 

16

A1

 

A3

14

 

 

 

 

 

 

 

 

 

15

A2

 

OE

22

 

 

 

 

 

 

 

 

21

A10

 

A11

23

 

 

 

 

 

 

 

 

20

CE

 

A9

24

 

 

 

 

 

 

 

 

19

I/O7

 

A8

25

 

 

 

 

 

 

 

 

18

I/O6

 

NC

26

 

 

 

VSOP

 

 

 

 

17

I/O5

 

WE

27

 

 

 

 

 

 

 

16

I/O4

 

VCC

28

 

 

 

 

 

 

 

15

I/O3

 

RDY/BSY

1

 

 

 

 

 

 

 

14

VSS

 

A12

2

 

 

 

 

 

 

 

13

I/O2

 

A7

3

 

 

 

 

 

 

 

 

12

I/O1

 

A6

4

 

 

 

 

 

 

 

 

11

I/O0

 

A5

5

 

 

 

 

 

 

 

 

10

A0

 

A4

6

 

 

 

 

 

 

 

 

 

9

A1

 

A3

7

 

 

 

 

 

 

 

 

 

8

A2

 

DESCRIPTION

 

BLOCK DIAGRAM

 

 

 

 

 

 

 

I/O0...................I/O7

 

 

 

 

 

 

The Microchip Technology Inc. 28LV64A is a CMOS 64K non-vol-

VSS

 

 

 

 

atile electrically Erasable PROM organized as 8K words by 8 bits.

Data Protection

 

 

VCC

 

 

The 28LV64A is accessed like a static RAM for the read or write

 

Circuitry

 

 

 

 

Chip Enable/

 

 

cycles without the need of external components. During a “byte

CE

 

 

 

write”, the address and data are latched internally, freeing the

OE

 

Output Enable

 

 

 

Control Logic

 

 

microprocessor address and data bus for other operations. Fol-

WE

Auto Erase/Write

Data

Input/Output

lowing the initiation of write cycle, the device will go to a busy state

 

 

Timing

Poll

Buffers

Rdy/

 

 

and automatically clear and write the latched data using an inter-

Program Voltage

 

 

Busy

 

 

nal control timer. To determine when the write cycle is complete,

 

 

Generation

 

 

 

 

 

 

 

the user has a choice of monitoring the Ready/Busy output or

A0

 

Y

 

 

using Data polling. The Ready/Busy pin is an open drain output,

I

 

 

Y Gating

I

L

Decoder

 

 

which allows easy configuration in ‘wired-or’ systems.

Alterna-

I

 

 

 

I

a

 

 

 

 

 

t

 

 

 

tively, Data polling allows the user to read the location last written

I

 

 

 

c

 

 

 

I

 

 

 

to when the write operation is complete. CMOS design and pro-

h

 

 

 

I

X

 

64K bit

e

 

I

 

cessing enables this part to be used in systems where reduced

s

Decoder

 

Cell Matrix

I

 

power consumption and reliability are required. A complete family

I

 

 

 

 

I

 

 

 

 

of packages is offered to provide the utmost flexibility in applica-

A12

 

 

 

 

tions.

 

 

 

 

 

 

1996 Microchip Technology Inc.

Preliminary

 

 

 

DS21113B-page 1

28LV64A

1.0ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS*

VCC and input voltages w.r.t. VSS ......

-0.6V to + 6.25V

Voltage on

 

w.r.t. VSS

-0.6V to +13.5V

OE

Voltage on A9 w.r.t. VSS.......................

-0.6V to +13.5V

Output Voltage w.r.t. VSS ...............

-0.6V to VCC+0.6V

Storage temperature ..........................

-65˚C to +150˚C

Ambient temp. with power applied .....

-55°C to +125°C

*Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

TABLE 1-1: PIN FUCTION TABLE

 

Name

 

 

Function

 

 

 

 

 

 

 

A0 - A12

Address Inputs

 

 

 

 

 

 

 

Chip Enable

 

CE

 

 

 

 

 

 

Output Enable

 

OE

 

 

 

 

 

Write Enable

 

WE

 

I/O0 - I/O7

Data Inputs/Outputs

 

 

 

 

 

 

 

 

RDY/Busy

 

Ready/Busy

 

VCC

+ Power Supply

 

VSS

Ground

 

NC

No Connect; No Internal Connection

 

NU

Not Used; No External Connection is

 

 

 

 

 

 

 

Allowed

 

 

 

 

 

 

 

 

 

 

TABLE 1-2:

READ/WRITE OPERATION DC CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCC = 2.7 to 3.6V

0°C to 70°C

 

 

 

 

 

 

 

 

Commercial (C): Tamb =

 

 

 

 

 

 

 

 

Industrial

(I): Tamb =

-40°C to 85°C

 

 

 

 

 

 

Parameter

Status

Symbol

Min

Max

Units

 

 

Conditions

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Voltages

 

Logic “1”

VIH

2.0

 

V

 

 

 

 

 

 

 

Logic “2”

VIL

 

0.6

V

 

 

 

 

 

Input Leakage

 

I LI

5

A

VIN = 0V to VCC+1

Input Capacitance

C IN

6

pF

Vin = 0V; Tamb = 25 °C;

 

 

 

 

 

 

 

f = 1 MHz (Note 1)

Output Voltages

 

Logic “1”

VOH

2.0

 

V

IOH = -100 A

 

 

Logic “0”

VOL

 

0.3

V

 

IOL = 1.0 mA

 

 

 

 

 

 

 

 

 

 

I0L = 2.0 mA for RDY/Busy

 

Output Leakage

 

I LO

5

A

VOUT = 0V to VCC+0.1V

Output Capacitance

C OUT

12

pF

V OUT = 0V; Tamb = 25°C;

 

 

 

 

 

 

 

f = 1 MHz (Note 1)

Power Supply Current, Activity

TTL input

ICC

8

mA

f = 5 MHz (Note 2)

 

 

 

 

 

 

 

 

IO = OmA

 

 

 

 

 

 

 

 

VCC = 3.3

 

 

 

 

 

 

 

 

 

= VIL

 

 

 

 

 

 

 

 

CE

Power Supply Current, Standby

TTL input

ICC(S)TTL

2

mA

 

 

= VIH (0°C to 70°C°)

 

CE

 

 

TTL input

ICC(S)TTL

 

3

mA

 

 

= VIH (-40°C to 85°C°)

 

 

 

 

CE

 

 

CMOS input

ICC(S)CMOS

 

100

A

 

 

= VCC -3.0 to VCC+1

 

 

 

 

CE

Note 1: Not 100% tested.

 

 

 

 

 

 

 

 

 

 

2: AC power supply current above 5 MHz: 2 mA/Mhz.

 

 

 

 

 

 

 

 

DS21113B-page 2

Preliminary

1996 Microchip Technology Inc.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

28LV64A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TABLE 1-3: READ OPERATION AC CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AC Testing Waveform:

VIH = 2.0V;

VIL = 0.6V; VOH = VOL = VCC/2

 

 

 

 

 

 

 

 

 

Output Load:

 

1 TTL Load + 100 pF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Rise and Fall Times:

20 ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ambient Temperature:

Commercial (C): Tamb = 0°C to +70°C

 

 

 

 

 

 

 

 

 

 

 

 

Industrial

(I) : Tamb = -40°C to +85°C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Parameter

Sym

 

28LV64-30

Units

 

 

 

 

Conditions

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Min

Max

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Address to Output Delay

tACC

 

300

ns

 

 

 

 

=

 

= VIL

OE

CE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

to Output Delay

tCE

 

300

ns

 

 

 

 

= VIL

 

CE

OE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

to Output Delay

tOE

 

150

ns

 

 

 

= VIL

 

OE

CE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

or

 

High to Output Float

tOFF

 

0

60

ns

 

(Note 1)

 

CE

OE

 

 

 

 

 

 

 

 

 

 

 

 

Output Hold from Address,

 

or

tOH

 

0

ns

 

(Note 1)

 

CE

 

 

OE,

whichever occurs first.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Endurance

 

10M

cycles

 

25 °C, Vcc = 5.0V,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Block Mode (Note 2)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Note 1: Not 100% tested.

2:This parameter is not tested but guaranteed by characterization. For endurance estimates in a specific application, please consult the Total Endurance Model which can be obtained on our BBS or website.

FIGURE 1-1: READ WAVEFORMS

Address

VIH

Address Valid

 

 

 

 

VIL

 

 

 

VIH

 

 

CE

VIL

 

 

 

tCE(2)

 

 

 

 

 

VIH

 

 

OE

 

 

tOFF(1,3)

 

VIL

tOE(2)

 

 

tOH

 

 

 

 

VOH

 

High Z

Data

High Z

 

VOL

 

Valid Output

 

 

 

 

 

tACC

 

WE

VIH

 

 

VIL

 

 

 

 

 

Notes: (1) tOFF is specified for OE or CE, whichever occurs first

(2)OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE

(3)This parameter is sampled and is not 100% tested

1996 Microchip Technology Inc.

Preliminary

DS21113B-page 3

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