Microchip Technology Inc 28C64AT-25-SO, 28C64AT-25-L, 28C64AT-20I-SO, 28C64AT-20I-L, 28C64AT-20-SO Datasheet

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Microchip Technology Inc 28C64AT-25-SO, 28C64AT-25-L, 28C64AT-20I-SO, 28C64AT-20I-L, 28C64AT-20-SO Datasheet

28C64A

64K (8K x 8) CMOS EEPROM

FEATURES

 

 

PACKAGE TYPES

 

 

 

RDY/BSY

 

 

 

 

 

• CMOS Technology for Low Power Dissipation

 

A12

2

 

27

WE

 

A7

A12

NU

Vcc

WE

NC

 

• Fast Read Access Time—150 ns

 

 

RDY/BSY

• 1

 

28

Vcc

 

 

 

 

 

 

 

 

 

 

-

30 mA Active

 

 

A7

3

 

26

NC

 

4

3

2

1

32

31

30

 

 

 

 

A6

4

 

25

A8

 

 

 

 

 

 

 

 

 

 

-

100 A Standby

 

 

 

A6

5

 

 

 

 

 

29

A8

 

 

 

A5

5

DIP/SOIC

24

A9

 

 

 

 

 

 

 

 

A5 6

 

 

PLCC

 

28

A9

Fast Byte Write Time—200 s or 1 ms

 

A4

6

23

A11

A4

7

 

 

 

27

A11

 

 

 

 

 

 

 

 

A3

7

 

22

OE

A3 8

 

 

 

 

 

26

NC

Data Retention >200 years

 

 

 

 

 

 

 

 

 

 

A2

8

 

21

A10

A2 9

 

 

 

 

 

25

OE

High Endurance - Minimum 100,000 Erase/Write

 

A1

9

 

20

CE

A1

10

 

 

 

 

 

24

A10

 

 

A0 11

 

 

 

 

 

23

CE

 

Cycles

 

 

A0

10

 

19

I/O7

 

 

 

 

 

 

 

 

 

NC 12

 

 

 

 

 

22

I/O7

 

 

 

I/O0

11

 

18

I/O6

 

 

 

 

 

Automatic Write Operation

 

 

 

I/O0

13

 

 

 

 

 

21

I/O6

 

 

I/O1

12

 

17

I/O5

 

14

15

16

17

18

19

20

 

 

-

Internal Control Timer

 

 

I/O2

13

 

16

I/O4

 

 

 

 

 

 

 

I/O1

I/O2

Vss

NU

I/O3

I/O4

I/O5

 

 

- Auto-Clear Before Write Operation

 

VSS

14

 

15

I/O3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

- On-Chip Address and Data Latches

 

 

• Pin 1 indicator on PLCC on top of package

 

Data Polling

 

 

OE

1

 

 

 

 

 

 

 

 

 

 

28

A10

Ready/Busy

 

 

A11

2

 

 

 

 

 

 

 

 

 

 

27

CE

 

 

A9

3

 

 

 

 

 

 

 

 

 

 

26

I/07

Chip Clear Operation

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A8

4

 

 

 

 

 

 

 

 

 

 

25

I/06

Enhanced Data Protection

 

 

NC

5

 

 

 

 

 

 

 

 

 

 

24

I/05

 

 

WE

6

 

 

 

TSOP

 

 

 

 

 

 

23

I/04

 

-

VCC Detector

 

 

Vcc

7

 

 

 

 

 

 

 

 

 

22

I/03

 

 

 

 

 

 

 

 

 

 

 

 

 

 

-

Pulse Filter

 

 

RDY/BSY

8

 

 

 

 

 

 

 

 

 

 

21

Vss

 

-

Write Inhibit

 

 

A12

9

 

 

 

 

 

 

 

 

 

 

20

I/02

 

 

 

A7

10

 

 

 

 

 

 

 

 

 

 

19

I/01

• Electronic Signature for Device Identification

 

 

 

 

 

 

 

 

 

 

 

 

A6

11

 

 

 

 

 

 

 

 

 

 

18

I/00

5-Volt-Only Operation

 

 

A5

12

 

 

 

 

 

 

 

 

 

 

17

A0

 

 

A4

13

 

 

 

 

 

 

 

 

 

 

16

A1

• Organized 8Kx8 JEDEC Standard Pinout

 

A3

14

 

 

 

 

 

 

 

 

 

 

15

A2

 

- 28-pin Dual-In-Line Package

 

 

OE

22

 

 

 

 

 

 

 

 

 

 

21

A10

 

-

32-pin PLCC Package

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A11

23

 

 

 

 

 

 

 

 

 

 

20

CE

 

- 28-pin Thin Small Outline Package (TSOP)

 

A9

24

 

 

 

 

 

 

 

 

 

 

19

I/O7

 

 

A8

25

 

 

 

 

 

 

 

 

 

 

18

I/O6

 

 

8x20mm

 

 

NC

26

 

 

 

VSOP

 

 

 

 

 

 

17

I/O5

 

 

 

 

WE

27

 

 

 

 

 

 

 

 

 

16

I/O4

 

-

28-pin Very Small Outline Package (VSOP)

 

 

 

 

 

 

 

 

 

 

 

 

VCC

28

 

 

 

 

 

 

 

 

 

15

I/O3

 

 

8x13.4mm

 

 

RDY/BSY

1

 

 

 

 

 

 

 

 

 

14

VSS

 

 

 

 

A12

2

 

 

 

 

 

 

 

 

 

13

I/O2

• Available for Extended Temperature Ranges:

 

A7

3

 

 

 

 

 

 

 

 

 

 

12

I/O1

 

-

Commercial: 0˚C to +70˚C

 

 

A6

4

 

 

 

 

 

 

 

 

 

 

11

I/O0

 

 

 

A5

5

 

 

 

 

 

 

 

 

 

 

10

A0

 

 

 

 

 

A4

6

 

 

 

 

 

 

 

 

 

 

9

A1

DESCRIPTION

 

 

A3

7

 

 

 

 

 

 

 

 

 

 

8

A2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

The Microchip Technology Inc. 28C64A is a CMOS 64K non-

BLOCK DIAGRAM

 

 

 

 

 

 

 

 

 

volatile electrically Erasable PROM.

The 28C64A

is

 

 

 

 

 

 

 

I/O0

 

 

 

I/O7

accessed like a static RAM for the read or write cycles without

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the need of external components. During a “byte write”, the

VSS

 

Data Protection

 

 

 

 

 

 

 

 

 

address and data are latched internally, freeing the micropro-

VCC

 

 

 

 

 

 

 

 

 

 

 

 

Circuitry

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

cessor address and data bus for other operations. Following

CE

 

Chip Enable/

 

 

 

 

 

 

 

 

 

the initiation of write cycle, the device will go to a busy state

OE

 

Output Enable

 

 

 

 

 

 

 

 

 

 

Control Logic

 

 

 

 

 

 

 

 

 

and automatically clear and write the latched data using an

WE

Auto Erase/Write

Data

 

Input/Output

 

 

 

 

internal control timer. To determine when the write cycle is

Rdy/

 

 

Timing

 

 

Poll

 

 

Buffers

 

Busy

 

 

 

 

 

 

 

 

 

 

 

 

 

complete, the user has a choice of monitoring the Ready/

Program Voltage

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Busy output or using Data polling. The Ready/Busy pin is an

 

 

Generation

 

 

 

 

 

 

 

 

 

A0

 

 

 

 

 

 

 

 

 

 

 

 

 

open drain output, which allows easy configuration in wired-

 

 

 

Y

 

 

 

 

Y Gating

 

 

 

 

 

 

 

 

 

 

or systems. Alternatively, Data polling allows the user to read

 

L

 

Decoder

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the location last written to when the write operation is com-

 

a

 

 

 

 

 

 

 

 

 

 

 

 

 

t

 

 

 

 

 

 

 

 

 

 

 

 

plete. CMOS design and processing enables this part to be

 

c

 

 

 

 

 

 

 

 

 

 

 

 

 

h

 

 

X

 

 

 

 

16K bit

 

used in systems where reduced power consumption and reli-

 

e

 

 

 

 

 

 

 

 

s

 

Decoder

 

 

 

Cell Matrix

 

ability are required. A complete family of packages is offered

 

 

 

 

 

 

 

 

 

 

 

 

 

 

to provide the utmost flexibility in applications

 

A12

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1996 Microchip Technology Inc.

 

 

 

 

 

 

 

 

 

 

DS11109H-page 1

28C64A

1.0ELECTRICAL CHARACTERISTICS

1.1MAXIMUM RATINGS*

VCC and input voltages w.r.t. VSS .......

-0.6V to + 6.25V

Voltage on

 

w.r.t. VSS

-0.6V to +13.5V

OE

Voltage on A9 w.r.t. VSS ......................

-0.6V to +13.5V

Output Voltage w.r.t. VSS ................

-0.6V to VCC+0.6V

Storage temperature ..........................

-65˚C to +125˚C

Ambient temp. with power applied .......

-50˚C to +95˚C

*Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

TABLE 1-1: PIN FUNCTION TABLE

Name

 

 

Function

 

 

 

 

A0 - A12

Address Inputs

 

 

 

 

 

 

 

 

 

Chip Enable

CE

 

 

 

 

 

 

 

Output Enable

OE

 

 

 

 

 

Write Enable

 

WE

I/O0 - I/O7

Data Inputs/Outputs

 

 

 

 

 

 

RDY/Busy

Ready/Busy

 

VCC

+5V Power Supply

VSS

Ground

 

 

NC

No Connect; No Internal Connection

 

 

NU

Not Used; No External Connection is

 

 

 

 

 

 

 

 

 

Allowed

 

 

 

 

 

 

 

 

 

 

 

 

TABLE 1-2:

READ/WRITE OPERATION DC CHARACTERISTIC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCC = +5V ±10%

 

 

 

 

 

 

 

 

 

 

Commercial (C): Tamb = 0˚C to +70˚C

 

 

 

 

 

Industrial

(I): Tamb = -40˚C to +85˚C

 

 

 

 

 

 

 

 

 

 

 

Parameter

Status

Symbol

Min

Max

Units

 

 

 

 

Conditions

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Voltages

 

Logic ‘1’

VIH

2.0

Vcc+1

V

 

 

 

 

 

 

 

Logic ‘0’

VIL

-0.1

0.8

V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Leakage

 

I LI

-10

10

A

 

 

VIN = -0.1V to Vcc +1

 

 

 

 

 

 

 

Input Capacitance

C IN

10

pF

V IN = 0V; Tamb = 25˚C;

 

 

 

 

 

 

 

 

f = 1 MHz (Note 2)

 

 

 

 

 

 

 

 

 

Output Voltages

 

Logic ‘1’

VOH

2.4

 

V

 

IOH = -400 A

 

 

Logic ‘0’

VOL

 

0.45

V

IOL = 2.1 mA

 

 

 

 

 

 

 

 

 

 

Output Leakage

 

I LO

-10

10

A

 

 

VOUT = -0.1V to Vcc

 

 

 

 

 

 

 

 

+0.1V

 

 

 

 

 

 

 

Output Capacitance

C OUT

12

pF

V IN = 0V; Tamb = 25˚C;

 

 

 

 

 

 

 

 

f = 1 MHz (Note 2)

 

 

 

 

 

 

 

Power Supply Current, Active

TTL input

ICC

30

mA

f = 5 MHz (Note 1)

 

 

 

 

 

 

 

 

 

VCC = 5.5V

 

 

 

 

 

 

 

 

 

 

 

Power Supply Current, Standby

TTL input

ICC(S)TTL

2

mA

 

 

 

 

= VIH (0˚C to +70˚C)

 

 

CE

 

 

TTL input

ICC(S)TTL

 

3

mA

 

 

CE

= VIH (-40˚C to +85˚C)

 

 

CMOS input

ICC(S)CMOS

 

100

A

 

 

= VCC-0.3 to Vcc +1

 

 

 

 

CE

 

 

 

 

 

 

 

 

 

 

 

 

Note 1: AC power supply current above 5MHz: 2mA/MHz. 2: Not 100% tested.

DS11109H-page 2

1996 Microchip Technology Inc.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

28C64A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TABLE 1-3:

READ OPERATION AC CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

AC Testing Waveform:

VIH = 2.4V; VIL = 0.45V; VOH = 2.0V; VOL = 0.8V

 

 

 

 

 

 

 

 

 

 

 

 

Output Load:

 

1 TTL Load + 100 pF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Rise and Fall Times:

20 ns

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ambient Temperature:

Commercial (C):

 

Tamb

=

0˚C to +70˚C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Industrial

 

(I):

 

Tamb

=

-40˚C to +85˚C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Parameter

Symbol

28C64A-15

28C64A-20

 

28C64A-25

Units

 

 

Conditions

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Min

Max

Min

Max

 

Min

 

Max

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Address to Output Delay

tACC

150

200

 

250

ns

OE

 

 

=

 

= VIL

 

 

CE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

to Output Delay

tCE

150

200

 

250

ns

OE

 

 

= VIL

 

CE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

to Output Delay

tOE

70

80

 

100

ns

CE

 

 

= VIL

 

OE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

or

 

High to Output Float

tOFF

0

50

0

55

 

0

70

ns (Note 1)

 

CE

OE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Output Hold from Address,

 

 

tOH

0

0

 

0

 

ns

 

(Note 1)

CE

 

or

OE,

whichever occurs first.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Endurance

 

 

 

1M

1M

 

1M

— cycles

25

 

 

°C, Vcc =

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

5.0V, Block

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Mode (Note 2)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Note 1: Not 100% tested.

2:This parameter is not tested but guaranteed by characterization. For endurance estimates in a specific application, please consult the Total Endurance Model which can be obtained on our BBS or website.

FIGURE 1-1: READ WAVEFORMS

Address

VIH

Address Valid

 

 

 

 

VIL

 

 

 

 

 

 

 

VIH

 

 

 

 

 

 

CE

VIL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCE(2)

 

 

 

VIH

 

 

 

 

 

 

OE

 

 

 

 

 

 

tOFF(1,3)

 

VIL

 

 

 

 

 

 

 

 

 

 

tOE(2)

tOH

 

VOH

 

 

 

 

 

High Z

Data

High Z

 

 

 

 

 

VOL

 

 

 

 

 

Valid Output

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tACC

 

VIH

WE

VIL

Notes: (1) tOFF is specified for OE or CE, whichever occurs first

(2)OE may be delayed up to tCE - t OE after the falling edge of CE without impact on tCE

(3)This parameter is sampled and is not 100% tested

1996 Microchip Technology Inc.

DS11109H-page 3

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