28C04A
4K (512 x 8) CMOS EEPROM
•Fast Read Access Time—150 ns
•CMOS Technology for Low Power Dissipation
-30 mA Active
-100 A Standby
• Fast Byte Write Time—200 s or 1 ms
•Data Retention >200 years
•Endurance - Minimum 104 Erase/Write Cycles
-Automatic Write Operation
-Internal Control Timer
-Auto-Clear Before Write Operation
-On-Chip Address and Data Latches
•Data Polling
•Chip Clear Operation
•Enhanced Data Protection
-VCC Detector
-Pulse Filter
-Write Inhibit
•5-Volt-Only Operation
•Organized 512x8 JEDEC standard pinout
-24-pin Dual-In-Line Package
-32-pin PLCC Package
•Available for Extended Temperature Ranges:
-Commercial: 0˚C to +70˚C
-Industrial: -40˚C to +85˚C
The Microchip Technology Inc. 28C04A is a CMOS 4K non-volatile electrically Erasable and Programmable Read Only Memory (EEPROM). The 28C04A is accessed like a static RAM for the read or write cycles without the need of external components. During a “byte write”, the address and data are latched internally, freeing the microprocessor address and data bus for other operations. Following the initiation of write cycle, the device will go to a busy state and automatically clear and write the latched data using an internal control timer. To determine when a write cycle is complete, the 28C04A uses Data polling. Data polling allows the user to read the location last written to when the write operation is complete. CMOS design and processing enables this part to be used in systems where reduced power consumption and reliability are required. A complete family of packages is offered to provide the utmost flexibility in applications.
1996 Microchip Technology Inc.
DIP |
A7 |
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24 |
Vcc |
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A6 |
2 |
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23 |
A8 |
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A5 |
3 |
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22 |
NC |
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A4 |
4 |
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28C04A |
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21 |
WE |
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A3 |
5 |
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20 |
OE |
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A2 |
6 |
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NC |
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A1 |
7 |
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18 |
CE |
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A0 |
8 |
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17 |
I/O7 |
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I/O0 |
9 |
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16 |
I/O6 |
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I/O1 |
10 |
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15 |
I/O5 |
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I/O2 |
11 |
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14 |
I/O4 |
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VSS |
12 |
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13 |
I/O3 |
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PLCC |
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A7 |
NC |
NC |
NU |
Vcc |
WE |
NC |
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4 |
3 |
2 |
1 |
32 |
31 |
30 |
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A6 |
5 |
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29 |
A8 |
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A5 |
6 |
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28 |
NC |
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A4 |
7 |
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28C04A |
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27 |
NC |
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A3 |
8 |
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26 |
NC |
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A2 |
9 |
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25 |
OE |
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A1 |
10 |
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24 |
NC |
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A0 |
11 |
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23 |
CE |
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NC |
12 |
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22 |
I/O7 |
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I/O0 |
13 |
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21 |
I/O6 |
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14 |
15 |
16 |
17 |
18 |
19 |
20 |
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I/O1 |
I/O2 |
Vss |
NU |
I/O3 |
I/O4 |
I/O5 |
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• Pin 1 indicator on PLCC on top of package
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I/O0 |
I/O7 |
VSS |
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Data Protection |
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VCC |
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Circuitry |
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CE |
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Chip Enable/ |
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Output Enable |
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OE |
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Control Logic |
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WE |
Auto Erase/Write |
Data |
Input/Output |
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Timing |
Poll |
Buffers |
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Program Voltage |
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Generation |
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A0 |
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Y |
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Y Gating |
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Decoder |
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L |
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a |
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t |
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c |
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h |
X |
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4K bit |
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e |
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Decoder |
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Cell Matrix |
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A8 |
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DS11126F-page 1 |
28C04A
1.1MAXIMUM RATINGS*
VCC and input voltages w.r.t. VSS ....... |
-0.6V to + 6.25V |
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Voltage on |
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w.r.t. VSS |
-0.6V to +13.5V |
OE |
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Output Voltage w.r.t. VSS ................. |
-0.6V to VCC+0.6V |
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Storage temperature .......................... |
-65˚C to +125˚C |
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Ambient temp. with power applied ....... |
-50˚C to +95˚C |
*Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
TABLE 1-1: PIN FUNCTION TABLE
Name |
Function |
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A0 - A8 |
Address Inputs |
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Chip Enable |
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CE |
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Output Enable |
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OE |
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Write Enable |
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WE |
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I/O0 - I/O7 |
Data Inputs/Outputs |
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VCC |
+5V Power Supply |
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VSS |
Ground |
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NC |
No Connect; No Internal Connection |
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NU |
Not Used; No External Connection is |
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Allowed |
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TABLE 1-2: |
READ/WRITE OPERATION DC CHARACTERISTICS |
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VCC = +5V ±10% |
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Commercial (C): Tamb = |
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0˚C to +70˚C |
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Industrial |
(I): Tamb = -40˚C to +85˚C |
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Parameter |
Status |
Symbol |
Min |
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Max |
Units |
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Conditions |
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Input Voltages |
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Logic ‘1’ |
VIH |
2.0 |
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VCC+1 |
V |
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Logic ‘0’ |
VIL |
-0.1 |
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0.8 |
V |
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Input Leakage |
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ILI |
-10 |
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10 |
A |
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VIN = -0.1V to VCC+1 |
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Input Capacitance |
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CIN |
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10 |
pF |
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VIN = 0V; Tamb = 25˚C; |
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f = 1 MHz |
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Output Voltages |
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Logic ‘1’ |
VOH |
2.4 |
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V |
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IOH = -400 A |
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Logic ‘0’ |
VOL |
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0.45 |
V |
IOL = 2.1 mA |
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Output Leakage |
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ILO |
-10 |
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10 |
A |
VOUT = -0.1V TO VCC + 0.1V |
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Output Capacitance |
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COUT |
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12 |
pF |
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VIN = 0V; TAMB = 25˚C; |
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f = 1 MHz |
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Power Supply Current, Active |
TTL input |
ICC |
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30 |
mA |
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f = 5 MHz (Note 1) |
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VCC = 5.5V |
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Power Supply Current, Standby |
TTL input |
ICC(S)TTL |
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2 |
mA |
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= VIH (0˚C to +70˚C) |
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CE |
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TTL input |
ICC(S)TTL |
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3 |
mA |
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CE |
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= VIH (-40˚C to +85˚C) |
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CMOS input |
ICC(S)CMOS |
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100 |
A |
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CE |
= VCC-0.3 to Vcc+1 |
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Note 1: AC power supply current above 5 MHz; 1 mA/MHz.
DS11126F-page 2 |
1996 Microchip Technology Inc. |
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28C04A |
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TABLE 1-3: |
READ OPERATION AC CHARACTERISTICS |
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AC Testing Waveform: |
VIH = 2.4V; VIL = 0.45V; VOH = 2.0V; VOL = 0.8V |
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Output Load: |
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1 TTL Load + 100 pF |
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Input Rise and Fall Times: 20 ns |
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Ambient Temperature: |
Commercial (C): Tamb = |
0˚C to +70˚C |
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Industrial |
(I): |
Tamb |
= |
-40˚C to +85˚C |
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Parameter |
Sym |
28C04A-15 |
28C04A-20 |
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28C04A-25 |
Units |
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Conditions |
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Min |
Max |
Min |
Max |
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Min |
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Max |
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Address to Output Delay |
tACC |
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150 |
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200 |
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250 |
ns |
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= |
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= VIL |
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OE |
CE |
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to Output Delay |
tCE |
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150 |
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200 |
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250 |
ns |
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= VIL |
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CE |
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OE |
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to Output Delay |
tOE |
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70 |
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80 |
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100 |
ns |
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= VIL |
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OE |
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CE |
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to |
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High Output Float |
tOFF |
0 |
50 |
0 |
55 |
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0 |
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70 |
ns |
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CE |
OE |
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Output Hold from Address, |
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tOH |
0 |
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0 |
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0 |
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ns |
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CE |
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or |
OE, |
whichever occurs first |
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Endurance |
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— |
1M |
— |
1M |
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1M |
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— |
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cycles 25 |
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°C, Vcc = |
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5.0V, Block |
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Mode (Note) |
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Note: This parameter is not tested but guaranteed by characterization. For endurance estimates in a specific application, please consult the Total Endurance Model which can be obtained on our BBS or website.
FIGURE 1-1: READ WAVEFORMS
Address |
VIH |
Address Valid |
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VIL |
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VIH |
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CE |
VIL |
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tCE(2) |
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VIH |
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OE |
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tOFF(1,3) |
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VIL |
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tOE(2) |
tOH |
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VOH |
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High Z |
Data |
High Z |
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VOL |
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Valid Output |
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tACC
VIH
WE
VIL
Notes: (1) tOFF is specified for OE or CE, whichever occurs first
(2)OE may be delayed up to tCE - t OE after the falling edge of CE without impact on tCE
(3)This parameter is sampled and is not 100% tested
1996 Microchip Technology Inc. |
DS11126F-page 3 |