August 2003
FGH40N6S2 / FGP40N6S2 / FGB40N6S2
600V, SMPS II Series N-Channel IGBT
General Description
The FGH40N6S2, FGP40N6S2 and the FGB40N6S2 are Low Gate Charge, Low Plateau Voltage SMPS II IGBTs combining the fast switching speed of the SMPS IGBTs along with lower gate charge, plateau voltage and avalanche capability (UIS). These LGC devices shorten delay times, and reduce the power requirement of the gate drive. These devices are ideally suited for high voltage switched mode power supply applications where low conduction loss, fast switching times and UIS capability are essential. SMPS II LGC devices have been specially designed for:
•Power Factor Correction (PFC) circuits
•Full bridge topologies
•Half bridge topologies
•Push-Pull circuits
•Uninterruptible power supplies
•Zero voltage and zero current switching circuits
IGBT (co-pack) formerly Developmental Type TA49438
Features
•100kHz Operation at 390V, 24A
•200kHZ Operation at 390V, 18A
•600V Switching SOA Capability
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Typical Fall Time. . . . . . . . . . . |
85ns at TJ = 125oC |
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Low Gate Charge . . . . . . . . . |
35nC at VGE = 15V |
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Low Plateau Voltage . . . . . . . |
. . . . . .6.5V Typical |
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UIS Rated . . . . . . . . . . . . . . . |
. . . . . . . . . . 260mJ |
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Low Conduction Loss |
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Package |
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Symbol |
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TO-247 |
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TO-220AB |
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TO-263AB |
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COLLECTOR |
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COLLECTOR |
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E |
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(Back-Metal) |
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(Flange) |
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Device Maximum Ratings TC= 25°C unless otherwise noted |
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Symbol |
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Parameter |
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Ratings |
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Units |
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BVCES |
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Collector to Emitter Breakdown Voltage |
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600 |
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V |
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IC25 |
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Collector Current Continuous, TC = 25°C |
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75 |
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A |
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IC110 |
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Collector Current Continuous, TC = 110°C |
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35 |
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A |
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ICM |
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Collector Current Pulsed (Note 1) |
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180 |
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A |
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VGES |
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Gate to Emitter Voltage Continuous |
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±20 |
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V |
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VGEM |
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Gate to Emitter Voltage Pulsed |
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±30 |
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V |
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SSOA |
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Switching Safe Operating Area at TJ = 150°C, Figure 2 |
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100A at 600V |
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EAS |
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Pulsed Avalanche Energy, ICE = 30A, L = 1mH, VDD = 50V |
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260 |
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mJ |
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PD |
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Power Dissipation Total TC = 25°C |
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290 |
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W |
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Power Dissipation Derating TC > 25°C |
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2.33 |
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W/°C |
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TJ |
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Operating Junction Temperature Range |
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-55 to 150 |
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°C |
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TSTG |
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Storage Junction Temperature Range |
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-55 to 150 |
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°C |
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CAUTION: Stresses above those listed in “Device Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. Pulse width limited by maximum junction temperature.
FGB40N6S2 / FGP40N6S2 / FGH40N6S2
©2003 Fairchild Semiconductor Corporation |
FGH40N6S2 / FGP40N6S2 / FGB40N6S2 RevA5 |
Package Marking and Ordering Information
Device Marking |
Device |
Package |
Reel Size |
Tape Width |
Quantity |
40N6S2 |
FGH40N6S2 |
TO-247 |
Tube |
N/A |
30 |
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40N6S2 |
FGP40N6S2 |
TO-220AB |
Tube |
N/A |
50 |
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40N6S2 |
FGB40N6S2 |
TO-263AB |
Tube |
N/A |
50 |
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40N6S2 |
FGB40N6S2T |
TO-263AB |
330mm |
24mm |
800 |
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Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol |
Parameter |
Test Conditions |
Min |
Typ |
Max |
Units |
Off State Characteristics
BVCES |
Collector to Emitter Breakdown Voltage |
IC = 250µ A, VGE = 0 |
600 |
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V |
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BVECS |
Emitter to Collector Breakdown Voltage |
IC = -10mA, VGE = 0 |
20 |
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V |
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ICES |
Collector to Emitter Leakage Current |
VCE = 600V |
TJ = 25°C |
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250 |
µ A |
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TJ = 125°C |
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2.0 |
mA |
IGES |
Gate to Emitter Leakage Current |
VGE = ± 20V |
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±250 |
nA |
On State Characteristics
VCE(SAT) |
Collector to Emitter Saturation Voltage |
IC = 20A, |
TJ = 25°C |
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1.9 |
2.7 |
V |
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VGE = 15V |
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TJ = 125°C |
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1.7 |
2.0 |
V |
Dynamic Characteristics
QG(ON) |
Gate Charge |
IC = 20A, |
VGE = 15V |
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35 |
42 |
nC |
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VCE = 300V |
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= 20V |
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45 |
55 |
nC |
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GE |
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VGE(TH) |
Gate to Emitter Threshold Voltage |
IC = 250µ A, VCE = VGE |
3.5 |
4.3 |
5.0 |
V |
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VGEP |
Gate to Emitter Plateau Voltage |
IC = 20A, VCE = 300V |
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6.5 |
8.0 |
V |
Switching Characteristics
SSOA |
Switching SOA |
TJ = 150°C, VGE = 15V, RG = 3Ω |
100 |
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A |
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L = 100µ H, VCE = 600V |
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td(ON)I |
Current Turn-On Delay Time |
IGBT and Diode at TJ = 25°C, |
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8.0 |
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t |
Current Rise Time |
ICE = 20A, |
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10 |
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rI |
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VCE = 390V, |
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td(OFF)I |
Current Turn-Off Delay Time |
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35 |
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VGE = 15V, |
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tfI |
Current Fall Time |
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55 |
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RG = 3Ω |
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EON1 |
Turn-On Energy (Note 2) |
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115 |
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µ J |
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L = 200µ H |
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EON2 |
Turn-On Energy (Note 2) |
Test Circuit - Figure 26 |
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200 |
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µ J |
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EOFF |
Turn-Off Energy (Note 3) |
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195 |
260 |
µ J |
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td(ON)I |
Current Turn-On Delay Time |
IGBT and Diode at TJ = 125°C |
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14 |
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t |
Current Rise Time |
ICE = 20A, |
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18 |
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rI |
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VCE = 390V, |
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td(OFF)I |
Current Turn-Off Delay Time |
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68 |
85 |
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VGE = 15V, |
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tfI |
Current Fall Time |
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85 |
105 |
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RG = 3Ω |
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EON1 |
Turn-On Energy (Note 2) |
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115 |
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µ J |
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L = 200µ H |
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EON2 |
Turn-On Energy (Note 2) |
Test Circuit - Figure 26 |
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380 |
450 |
µ J |
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EOFF |
Turn-Off Energy (Note 3) |
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375 |
600 |
µ J |
Thermal Characteristics
Rθ JC |
Thermal Resistance Junction-Case |
TO-247 |
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0.43 |
°C/W |
NOTE:
2. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. EON1 is the turn-on loss
of the IGBT only. EON2 is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJ as the IGBT. The diode type is specified in figure 26.
3. Turn-Off Energy Loss (EOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending at the point where the collector current equals zero (ICE = 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
FGB40N6S2 / FGP40N6S2 / FGH40N6S2
©2003 Fairchild Semiconductor Corporation |
FGH40N6S2 / FGP40N6S2 / FGB40N6S2 RevA5 |
Typical Performance Curves TJ = 25°C unless otherwise noted |
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/FGH40N6S2 |
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90 |
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TO EMITTER CURRENT (A) |
125 |
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80 |
PACKAGE LIMITED |
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TJ = 150oC, RG = 3Ω , VGE = 15V, L = 100µ H |
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COLLECTOR CURRENT (A) |
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DC |
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COLLECTOR, |
25 |
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FGP40N6S2 |
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CE |
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FGB40N6S2 |
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T |
C |
, CASE TEMPERATURE (oC) |
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V , COLLECTOR TO EMITTER VOLTAGE (V) |
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CE |
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Figure 1. DC Collector Current vs Case |
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Figure 2. Minimum Switching Safe Operating Area |
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Temperature |
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1000 |
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TC = 75oC |
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CIRCUIT WITHSTAND TIME ( s) |
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VCE = 390V, RG = 3Ω , TJ = 125 C |
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SHORT CIRCUIT CURRENT (A) |
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OPERATING, FREQUENCY (kHz) |
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450 |
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VGE = 15V |
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fMAX1 = 0.05 / (td(OFF)I + td(ON)I) |
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ISC |
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fMAX2 = (PD - PC) / (EON2 + EOFF) |
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PC = CONDUCTION DISSIPATION |
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350 |
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10 |
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(DUTY FACTOR = 50%) |
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VGE = 10V |
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R |
= 0.27oC/W, SEE NOTES |
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θ JC |
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tSC |
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300 |
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MAX |
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SHORT |
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PEAK, |
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f |
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SC |
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TJ = 125 C, RG = 3Ω , L = 200µ H, VCE = 390V |
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ICE, COLLECTOR TO EMITTER CURRENT (A) |
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VGE, GATE TO EMITTER VOLTAGE (V) |
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Figure 3. Operating Frequency vs Collector to |
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Figure 4. Short Circuit Withstand Time |
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Emitter Current |
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(A) |
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DUTY CYCLE < 0.5%, VGE =10V |
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DUTY CYCLE < 0.5%, VGE =15V |
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(A) |
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PULSE DURATION = 250µ s |
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PULSE DURATION = 250µ s |
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CURRENT |
35 |
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CURRENT |
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EMITTER |
25 |
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EMITTER |
25 |
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TO |
15 |
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TO |
15 |
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COLLECTOR |
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COLLECTOR |
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T |
= 25oC |
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= 25oC |
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TJ = 150oC |
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TJ = 150oC |
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CE |
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CE |
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0 |
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TJ = 125 C |
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0 |
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TJ = 125 C |
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0.0 |
0.2 |
0.4 |
0.6 |
0.8 |
1.0 |
1.2 |
1.4 |
1.6 |
1.8 |
2.0 |
2.2 |
2.4 |
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0.0 |
0.2 |
0.4 |
0.6 |
0.8 |
1.0 |
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1.6 |
1.8 |
2.0 |
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VCE, COLLECTOR TO EMITTER VOLTAGE (V) |
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VCE, COLLECTOR TO EMITTER VOLTAGE (V) |
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Figure 5. Collector to Emitter On-State Voltage |
Figure 6. Collector to Emitter On-State Voltage |
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©2003 Fairchild Semiconductor Corporation |
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FGH40N6S2 / FGP40N6S2 / FGB40N6S2 RevA5 |
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