Fairchild Semiconductor FDP7030L, FDB7030L Datasheet

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Fairchild Semiconductor FDP7030L, FDB7030L Datasheet

April 1998

FDP7030L / FDB7030L

N-Channel Logic Level Enhancement Mode Field Effect Transistor

General Description

These N-Channel logic level enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. These devices are particularly suited for low voltage applications such as DC/DC converters and high efficiency switching circuits where fast switching, low in-line power loss, and resistance to transients are needed.

Features

100 A, 30 V. RDS(ON) = 0.007 Ω @ VGS=10 V RDS(ON) = 0.010 Ω @ VGS=5 V.

Critical DC electrical parameters specified at elevated temperature.

Rugged internal source-drain diode can eliminate the need for an external Zener diode transient suppressor.

High density cell design for extremely low RDS(ON).

175°C maximum junction temperature rating.

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S

Absolute Maximum Ratings

TC = 25°C unless otherwise noted

 

 

 

 

 

 

 

 

 

 

 

Symbol

Parameter

 

FDP7030L

 

FDB7030L

 

 

 

 

 

Units

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VDSS

Drain-Source Voltage

 

 

30

 

 

 

 

 

 

 

 

V

VGSS

Gate-Source Voltage - Continuous

 

±20

 

 

 

 

 

 

 

 

V

ID

Drain Current - Continuous

(Note 1)

 

100

 

 

 

 

 

 

 

 

A

 

 

 

 

75

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

- Pulsed

(Note 1)

 

300

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PD

Total Power Dissipation @ TC = 25°C

 

125

 

 

 

 

 

 

 

 

W

 

Derate above 25°C

 

0.83

 

 

 

 

 

 

 

 

W/°C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TJ,TSTG

Operating and Storage Temperature Range

 

-65 to 175

 

 

 

 

 

°C

TL

Maximum lead temperature for soldering purposes,

 

275

 

 

 

 

 

 

 

 

°C

 

1/8" from case for 5 seconds

 

 

 

 

 

 

 

 

 

 

 

 

 

THERMAL CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RθJC

Thermal Resistance, Junction-to-Case

 

1.2

 

 

 

 

 

 

 

 

°C/W

RθJA

Thermal Resistance, Junction-to-Ambient

 

62.5

 

 

 

 

 

 

 

 

°C/W

© 1998 Fairchild Semiconductor Corporation

FDP7030L Rev.D1

Electrical Characteristics (TC = 25°C unless otherwise noted)

Symbol

 

 

Parameter

Conditions

Min

Typ

Max

Unit

 

 

 

 

 

 

 

 

 

DRAIN-SOURCE AVALANCHE RATINGS (Note 1)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

WDSS

 

 

 

Single Pulse Drain-Source Avalanche Energy

VDD = 15 V, ID = 38 A

 

 

200

mJ

IAR

 

 

 

Maximum Drain-Source Avalanche Current

 

 

 

 

 

38

A

OFF CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BVDSS

 

 

 

Drain-Source Breakdown Voltage

VGS = 0 V, ID = 250 µA

30

 

 

V

BV

/

T

J

Breakdown Voltage Temp. Coefficient

ID = 250 µA, Referenced to 25 oC

 

36

 

mV/oC

DSS

 

 

 

 

 

 

 

 

 

IDSS

 

 

 

Zero Gate Voltage Drain Current

VDS = 24 V, VGS = 0 V

 

 

10

µA

 

 

 

 

 

 

 

TJ =125 °C

 

 

1

mA

IGSSF

 

 

 

Gate - Body Leakage, Forward

VGS = 20 V, VDS = 0 V

 

 

100

nA

IGSSR

 

 

 

Gate - Body Leakage, Reverse

VGS = -20 V, VDS = 0 V

 

 

-100

nA

ON CHARACTERISTICS (Note 2)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VGS(th)

 

 

 

Gate Threshold Voltage

VDS = VGS, ID = 250 µA

1

1.5

2

V

V

/

T

 

Gate Threshold Voltage Temp.Coefficient

ID = 250 µA, Referenced to 25 oC

 

-5

 

mV/oC

GS(th)

J

 

 

 

 

 

 

 

 

 

RDS(ON)

 

 

 

Static Drain-Source On-Resistance

VGS = 10 V, ID = 50 A

 

0.006

0.007

Ω

 

 

 

 

 

 

 

TJ = 125°C

 

0.009

0.011

 

 

 

 

 

 

VGS = 5 V, ID = 40 A

 

0.009

0.01

 

ID(on)

 

 

 

On-State Drain Current

VGS = 10 V, VDS = 10 V

60

 

 

A

gFS

 

 

 

Forward Transconductance

VDS = 10 V, ID = 50 A

 

50

 

S

DYNAMIC CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ciss

 

 

 

Input Capacitance

VDS = 15 V, VGS = 0 V,

 

2150

 

pF

 

 

 

 

 

f = 1.0 MHz

 

 

 

 

Coss

 

 

 

Output Capacitance

 

1290

 

pF

 

 

 

 

 

 

 

 

Crss

 

 

 

Reverse Transfer Capacitance

 

 

 

 

420

 

pF

SWITCHING CHARACTERISTICS (Note 2)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tD(on)

 

 

 

Turn - On Delay Time

VDD = 15 V, ID = 75 A,

 

10

20

nS

tr

 

 

 

Turn - On Rise Time

VGS = 10 V, RGEN = 6 Ω

 

160

225

nS

 

 

 

 

RGS = 10 Ω

 

 

 

 

tD(off)

 

 

 

Turn - Off Delay Time

 

70

95

nS

 

 

 

 

 

 

 

tf

 

 

 

Turn - Off Fall Time

 

 

 

 

140

195

nS

 

 

 

 

 

 

 

 

 

 

 

Qg

 

 

 

Total Gate Charge

VDS = 12 V

 

35

50

nC

Qgs

 

 

 

Gate-Source Charge

ID = 50 A, VGS= 4.5 V

 

12

 

nC

 

 

 

 

 

 

 

 

Qgd

 

 

 

Gate-Drain Charge

 

 

 

 

18

 

nC

DRAIN-SOURCE DIODE CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

IS

 

 

 

Maximum Continuos Drain-Source Diode Forward Current

(Note 1)

 

 

100

A

ISM

 

 

 

Maximum Pulsed Drain-Source Diode Forward Current

(Note 2)

 

 

300

A

VSD

 

 

 

Drain-Source Diode Forward Voltage

VGS = 0 V, IS = 50 A (Note 2)

 

1

1.3

V

 

 

 

 

 

 

 

TJ = 125°C

 

0.85

1.1

 

Notes

1.Calculated continuous current based on maximum allowable junction temperature. Actual maximum continuous current limited by package constraints to 75A.

2.Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0%.

FDP7030L Rev.D1

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