Siemens BUZ102 Datasheet

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Siemens BUZ102 Datasheet

BUZ 102

SIPMOS ®Power Transistor

N channel

Enhancement mode

Avalanche-rated

dv/dt rated

Low on-resistance

175°C operating temperature

• also in TO-220 SMD available

 

 

 

 

Pin 1

 

 

Pin 2

 

Pin 3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

G

 

 

 

D

 

S

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Type

VDS

ID

RDS(on)

 

Package

 

 

 

Ordering Code

 

BUZ 102

50 V

42 A

0.023 Ω

 

TO-220 AB

 

 

 

C67078-S1351-A2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Maximum Ratings

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Parameter

 

 

 

Symbol

 

 

Values

Unit

 

 

 

 

 

 

 

 

 

 

 

 

Continuous drain current

 

 

ID

 

 

 

 

 

 

A

TC = 111 °C

 

 

 

 

 

 

 

 

42

 

 

 

Pulsed drain current

 

 

IDpuls

 

 

 

 

 

 

 

 

 

TC = 25 °C

 

 

 

 

 

 

 

 

168

 

 

 

Avalanche energy, single pulse

 

EAS

 

 

 

 

 

 

 

mJ

ID = 42 A, VDD = 25 V, RGS = 25 Ω

 

 

 

 

 

 

 

 

 

 

 

 

L = 102 µH, Tj = 25 °C

 

 

 

 

 

 

 

180

 

 

 

Reverse diode dv/dt

 

 

dv/dt

 

 

 

 

 

 

 

kV/µs

IS = 42 A, VDS = 40 V, diF/dt = 200 A/µs

 

 

 

 

 

 

 

 

 

 

 

Tjmax = 175 °C

 

 

 

 

 

 

 

 

6

 

 

 

Gate source voltage

 

 

VGS

 

 

 

± 20

 

V

 

Power dissipation

 

 

Ptot

 

 

 

 

 

 

 

W

TC = 25 °C

 

 

 

 

 

 

 

 

200

 

 

 

Operating temperature

 

 

Tj

 

 

-55 ... + 175

 

°C

Storage temperature

 

 

Tstg

 

 

-55 ... + 175

 

 

 

Thermal resistance, chip case

 

RthJC

 

 

 

0.83

K/W

Thermal resistance, chip to ambient

 

RthJA

 

 

 

75

 

 

DIN humidity category, DIN 40 040

 

 

 

 

 

 

 

E

 

 

 

 

 

 

 

 

 

 

 

IEC climatic category, DIN IEC 68-1

 

 

 

 

 

55 / 175 / 56

 

 

 

 

 

 

 

 

 

 

 

 

 

Semiconductor Group

 

1

 

 

 

 

 

07/96

 

BUZ 102

Electrical Characteristics, at Tj = 25°C, unless otherwise specified

Parameter

Symbol

 

Values

 

Unit

 

 

 

 

 

 

 

 

min.

typ.

max.

 

 

 

 

 

 

 

Static Characteristics

 

 

 

 

 

 

 

 

 

 

Drainsource breakdown voltage

V(BR)DSS

 

 

 

V

VGS = 0 V, ID, Tj = -40 °C

 

50

-

-

 

Gate threshold voltage

VGS(th)

 

 

 

 

VGS=VDS, ID = 1 mA

 

2.1

3

4

 

Zero gate voltage drain current

IDSS

 

 

 

 

VDS = 50 V, VGS = 0 V, Tj = 25 °C

 

-

0.1

1

µA

VDS = 50 V, VGS = 0 V, Tj = -40 °C

 

-

1

100

nA

VDS = 50 V, VGS = 0 V, Tj = 150 °C

 

-

10

100

µA

Gate-source leakage current

IGSS

 

 

 

nA

VGS = 20 V, VDS = 0 V

 

-

10

100

 

Drain-Source on-resistance

RDS(on)

 

 

 

Ω

VGS = 10 V, ID = 42 A

 

-

0.017

0.023

 

Semiconductor Group

2

07/96

BUZ 102

Electrical Characteristics, at Tj = 25°C, unless otherwise specified

Parameter

Symbol

 

Values

 

Unit

 

 

 

 

 

 

 

 

min.

typ.

max.

 

 

 

 

 

 

 

Dynamic Characteristics

 

 

 

 

 

 

 

 

 

 

Transconductance

gfs

 

 

 

S

VDS³ 2 * ID * RDS(on)max, ID = 42 A

 

10

28

-

 

Input capacitance

Ciss

 

 

 

pF

VGS = 0 V, VDS = 25 V, f = 1 MHz

 

-

1620

2160

 

Output capacitance

Coss

 

 

 

 

VGS = 0 V, VDS = 25 V, f = 1 MHz

 

-

550

825

 

Reverse transfer capacitance

Crss

 

 

 

 

VGS = 0 V, VDS = 25 V, f = 1 MHz

 

-

240

360

 

Turn-on delay time

td(on)

 

 

 

ns

VDD = 30 V, VGS = 10 V, ID = 3 A

 

 

 

 

 

RGS = 50 W

 

-

25

38

 

Rise time

tr

 

 

 

 

VDD = 30 V, VGS = 10 V, ID = 3 A

 

 

 

 

 

RGS = 50 W

 

-

95

140

 

Turn-off delay time

td(off)

 

 

 

 

VDD = 30 V, VGS = 10 V, ID = 3 A

 

 

 

 

 

RGS = 50 W

 

-

300

400

 

Fall time

tf

 

 

 

 

VDD = 30 V, VGS = 10 V, ID = 3 A

 

 

 

 

 

RGS = 50 W

 

-

160

215

 

Semiconductor Group

3

07/96

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