Siemens BUZ307 Datasheet

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Siemens BUZ307 Datasheet

BUZ 307

SIPMOS ®Power Transistor

• N channel

• Enhancement mode

• Avalanche-rated

 

 

 

 

 

 

 

Pin 1

 

 

Pin 2

 

Pin 3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

G

 

 

 

D

 

S

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Type

VDS

ID

RDS(on)

 

Package

 

 

 

Ordering Code

 

BUZ 307

800 V

3 A

3 Ω

 

TO-218 AA

 

 

 

C67078-S3100-A2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Maximum Ratings

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Parameter

 

 

 

Symbol

 

 

Values

Unit

 

 

 

 

 

 

 

 

 

 

 

 

Continuous drain current

 

 

ID

 

 

 

 

 

 

A

TC = 35 °C

 

 

 

 

 

 

 

 

3

 

 

 

Pulsed drain current

 

 

IDpuls

 

 

 

 

 

 

 

 

 

TC = 25 °C

 

 

 

 

 

 

 

 

12

 

 

 

Avalanche current,limited by Tjmax

 

IAR

 

 

 

3

 

 

 

Avalanche energy,periodic limited by Tjmax

EAR

 

 

 

8

 

mJ

Avalanche energy, single pulse

 

EAS

 

 

 

 

 

 

 

 

 

ID = 3 A, VDD = 50 V, RGS = 25 Ω

 

 

 

 

 

 

 

 

 

 

 

 

L = 66.6 mH, Tj = 25 °C

 

 

 

 

 

 

 

320

 

 

 

Gate source voltage

 

 

VGS

 

 

 

± 20

 

V

 

Power dissipation

 

 

Ptot

 

 

 

 

 

 

 

W

TC = 25 °C

 

 

 

 

 

 

 

 

75

 

 

 

Operating temperature

 

 

Tj

 

 

-55 ... + 150

 

°C

Storage temperature

 

 

Tstg

 

 

-55 ... + 150

 

 

 

Thermal resistance, chip case

 

RthJC

 

 

 

1.67

K/W

Thermal resistance, chip to ambient

 

RthJA

 

 

 

75

 

 

 

DIN humidity category, DIN 40 040

 

 

 

 

 

 

 

E

 

 

 

 

 

 

 

 

 

 

 

IEC climatic category, DIN IEC 68-1

 

 

 

 

 

55 / 150 / 56

 

 

 

 

 

 

 

 

 

 

 

 

 

Semiconductor Group

 

1

 

 

 

 

 

09/96

 

BUZ 307

Electrical Characteristics, at Tj = 25°C, unless otherwise specified

Parameter

Symbol

 

Values

 

Unit

 

 

 

 

 

 

 

 

min.

typ.

max.

 

 

 

 

 

 

 

Static Characteristics

 

 

 

 

 

 

 

 

 

 

Drainsource breakdown voltage

V(BR)DSS

 

 

 

V

VGS = 0 V, ID = 0.25 mA, Tj = 25 °C

 

800

-

-

 

Gate threshold voltage

VGS(th)

 

 

 

 

VGS=VDS, ID = 1 mA

 

2.1

3

4

 

Zero gate voltage drain current

IDSS

 

 

 

µA

VDS = 800 V, VGS = 0 V, Tj = 25 °C

 

-

0.1

1

 

VDS = 800 V, VGS = 0 V, Tj = 125 °C

 

-

10

100

 

Gate-source leakage current

IGSS

 

 

 

nA

VGS = 20 V, VDS = 0 V

 

-

10

100

 

Drain-Source on-resistance

RDS(on)

 

 

 

Ω

VGS = 10 V, ID = 1.5 A

 

-

2.7

3

 

Semiconductor Group

2

09/96

BUZ 307

Electrical Characteristics, at Tj = 25°C, unless otherwise specified

Parameter

Symbol

 

Values

 

Unit

 

 

 

 

 

 

 

 

min.

typ.

max.

 

 

 

 

 

 

 

Dynamic Characteristics

 

 

 

 

 

 

 

 

 

 

Transconductance

gfs

 

 

 

S

VDS³ 2 * ID * RDS(on)max, ID = 1.5 A

 

1

1.8

-

 

Input capacitance

Ciss

 

 

 

pF

VGS = 0 V, VDS = 25 V, f = 1 MHz

 

-

1400

1860

 

Output capacitance

Coss

 

 

 

 

VGS = 0 V, VDS = 25 V, f = 1 MHz

 

-

85

130

 

Reverse transfer capacitance

Crss

 

 

 

 

VGS = 0 V, VDS = 25 V, f = 1 MHz

 

-

30

45

 

Turn-on delay time

td(on)

 

 

 

ns

VDD = 30 V, VGS = 10 V, ID = 3 A

 

 

 

 

 

RGS = 50 W

 

-

20

30

 

Rise time

tr

 

 

 

 

VDD = 30 V, VGS = 10 V, ID = 3 A

 

 

 

 

 

RGS = 50 W

 

-

60

90

 

Turn-off delay time

td(off)

 

 

 

 

VDD = 30 V, VGS = 10 V, ID = 3 A

 

 

 

 

 

RGS = 50 W

 

-

80

110

 

Fall time

tf

 

 

 

 

VDD = 30 V, VGS = 10 V, ID = 3 A

 

 

 

 

 

RGS = 50 W

 

-

50

65

 

Semiconductor Group

3

09/96

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