Analog Devices DAC8426AR, DAC8426FS, DAC8426FR, DAC8426FP, DAC8426ER Datasheet

a Quad 8-Bit Voltage Out CMOS DAC

Complete with Internal 10 V Reference

DAC8426

FEATURES

No Adjustments Required, Total Error 61 LSB Max

Over Temperature

Four Voltage-Output DACs on a Single Chip Internal 10 V Bandgap Reference

Operates from Single 115 V Supply

Fast 50 ns Data Load Time, All Temperatures Pin-for-Pin Replacement for PM-7226 and AD7226,

Eliminates External Reference

APPLICATIONS

Process Controls

Multichannel Microprocessor Controlled:

System Calibration

Op Amp Offset and Gain Adjust

Level and Threshold Setting

offering a 25 ppm/°C temperature coefficient and 5 mA of external load driving capability.

The DAC8426 contains four 8-bit voltage-output CMOS D/A converters on a single chip. A 10 V output bandgap reference sets the output full-scale voltage. The circuit also includes four input latches and interface control logic.

One of the four latches, selected by the address inputs, is loaded from the 8-bit data bus input when the write strobe is active low. All digital inputs are TTL/CMOS (5 V) compatible. The on-board amplifiers can drive up to 10 mA from either a single or dual supply. The on-board reference that is always connected to the internal DACs has 5 mA available to drive external devices.

Its compact size, low power, and economical cost-per-channel, make the DAC8426 attractive for applications requiring multiple D/A converters without sacrificing circuit-board space. System reliability is also increased due to reduced parts count.

GENERAL DESCRIPTION

The DAC8426 is a complete quad voltage output D/A converter with internal reference. This product fits directly into any existing 7226 socket where the user currently has a 10 V external reference. The external reference is no longer necessary. The internal reference of the DAC8426 is laser-trimmed to ±0.4%

PMI’s advanced oxide-based, silicon-gate, CMOS process allows the DAC8426’s analog and digital circuitry to be manufactured on the same chip. This, coupled with PMI’s highly stable thin-film R-2R resistor ladder, aids in matching and temperature tracking between DACs.

FUNCTIONAL BLOCK DIAGRAM

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Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: [phone] Fax: [phone]

ELECTRICAL CHARACTERISTICS

DAC8426–SPECIFICATIONS (VDD = +15 V 6 10%, AGND = DGND = 0 V, VSS = 0 V, TA = –558C to +1258C applies for DAC8426AR/BR, TA = –408C to +858C applies for DAC8426ER/EP/FR/FP/FS, unless otherwise noted.)

Parameter	Symbol	Conditions		Min	Typ	Max	Units
STATIC PERFORMANCE
Resolution	N			8		±1	Bits
Total Unadjusted Error1	TUE	Includes Reference	A, E				LSB
			B, F			±2	LSB
Relative Accuracy	INL		A, E			±1/2	LSB
			B, F			± 1	LSB
Differential Nonlinearity2	DNL					±1	LSB
Full-Scale Temperature Coefficient	TCGFS	Includes Reference			25		ppm/°C
Zero Scale Error	VZSE					20	mV
Zero Scale Error							μV/°C
Temperature Coefficient	TCVZS	Dual Supply	VSS = –5 V		10
REFERENCE OUTPUT
Output Voltage	VREFOUT	No Load	A, E	9.96		10.04	V
			B, F	9.92		10.08	V
Temperature Coefficient	TCVREFOUT				20		ppm/°C
Load Regulation	LDREG	IL = 5 mA			0.02	0.1	%/mA
Line Regulation	LNREG	VDD ±10%			0.008	0.04	%/V
Output Noise3	en rms	f = 0.1 Hz to 10 Hz			3	10	μV p-p
Output Current	IREFOUT	VREFOUT < 40 mV		5	7		mA
DIGITAL INPUTS
Logic Input “0”	VINL					0.8	V
Logic Input “1”	VINH			2.4			V
Input Current	IIN	VIN = 0 V or VDD			0.1	10	μA
Input Capacitance3	CIN				4	8	pF
POWER SUPPLIES
Positive Supply Current4	IDD				6	14	mA
Negative Supply Current4	ISS	Dual Supply	VSS = –5 V		4	10	mA
Power Dissipation5	PDISS	VDD = ±5%			90	210	mW
Power Supply Sensitivity	PSS				0.0002	0.01	%/%

VDD = +15 V 6 10%, AGND = DGND = 0 V, VSS = 0 V, TA = –558C to +1258C applies for DAC8426AR/BR, TA = –408C to +858C applies for DAC8426ER/EP/FR/FP/FS, unless otherwise noted.

Parameter	Symbol	Conditions	Min	Typ6 Max	Units
DAC OUTPUT
Output Current (Source)3	IOUTSOURCE	Digital In = All Ones	10		mA
Output Current (Sink)3	IOUTSINK	Digital In = All Zeroes VSS = –5 V	350	450	μA
Minimum Load Resistance	RL(MIN)	Digital In = All Ones	2		kΩ
DYNAMIC PERFORMANCE3					V/μs
VOUT Slew Rate	SR	To ± 1/2 LSB, RL = 2 kΩ		4
VOUT Settling Time	tS			3	μs
(Positive or Negative)
Digital Crosstalk	Q			10	nVs
SWITCHING CHARACTERISTICS3
Address To Write Setup Time	tAS		0		ns
Address To Write Hold Time	tAH		0		ns
Data Valid To Write Setup Time	tDS		70		ns
Data Valid To Write Hold Time	tDH		10		ns
Write Pulse Width	tWR		50		ns

NOTES

1Includes Full-Scale Error, Relative Accuracy, and Zero Code Error. Note ± 1 LSB = ± 0.39% error. 2All devices guaranteed monotonic over the full operating temperature range.

3Guaranteed and not subject to production test.

4Digital inputs VIN = VINL or VINH; VOUT and VREFOUT unloaded. 5PDISS calculated by IDD × VDD.

6Typicals represent measured characteristics at TA = +25°C. Specifications subject to change without notice.

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DAC8426

ABSOLUTE MAXIMUM RATINGS
VDD to AGND or DGND . . . . . . . . . . . . . .	. . . –0.3 V, +17 V
VSS to AGND or DGND . . . . . . . . . . . . . . .	. . . . . . –7 V, VDD
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . .	. . –0.3 V, +24 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . .	. . . –0.3 V, +5 V
Digital Input Voltage to DGND . . . . . . . . . .	. . . –0.3 V, VDD
VREFOUT to AGND1 . . . . . . . . . . . . . . . . . .	. . . –0.3 V, VDD
VOUT to AGND1 . . . . . . . . . . . . . . . . . . . . . .	. . . . . . VSS, VDD
Operating Temperature	–55°C to +125°C
Military AR/BR . . . . . . . . . . . . . . . . . . . .

Extended Industrial ER/EP/FR/FP/FS	. . . . –40°C to +85°C
Maximum Junction Temperature . . . . . .	. . . . . . . . . . +150°C
Storage Temperature . . . . . . . . . . . . . . .	. . . –65°C to +150°C
Lead Temperature (Soldering, 60 sec) . .	. . . . . . . . . . +300°C

THERMAL RESISTANCE

Package Type	uJA2	uJC	Units
20-Pin Cerdip (R)	70	7	°C/W
20-Pin Plastic DIP (P)	61	24	°C/W
20-Pin SOL(S)	80	22	°C/W

NOTES

1Outputs may be shorted to any terminal provided the package power dissipation is not exceeded. Typical output short-circuit current to AGND is 50 mA.

2θJA is specified for worst case mounting conditions, i.e., θJA is specified for device in socket for cerdip and P-DIP packages; θJA is specified for device soldered to printed circuit board for SOL package.

CAUTION

1.Do not apply voltages higher than VDD or less than VSS potential on any terminal.

2.The digital control inputs are zener-protected; however, permanent damage may occur on unprotected units from high-energy electrostatic fields. Keep units in conductive foam at all times until ready to use.

3.Do not insert this device into powered sockets. Remove power before insertion or removal.

4.Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to device.

PIN CONNECTIONS

20-Pin Cerdip

(R Suffix)

20-Pin Epoxy DIP

(P Suffix)

20-Pin SOL

(S Suffix)

ORDERING GUIDE1

Model	Total Unadjusted Error	Temperature Range	Package Description
DAC8426AR2	±1 LSB	–55°C to +125°C	20-Pin Cerdip (Q-20)
DAC8426ER	±1 LSB	–40°C to +85°C	20-Pin Cerdip (Q-20)
DAC8426EP	±1 LSB	–40°C to +85°C	20-Pin Plastic DIP (N-20)
DAC8426BR2	±2 LSB	–55°C to +125°C	20-Pin Cerdip (Q-20)
DAC8426FR	±2 LSB	–40°C to +85°C	20-Pin Cerdip (Q-20)
DAC8426FP	±2 LSB	–40°C to +85°C	20-Pin Plastic DIP (N-20)
DAC8426FS3	±2 LSB	–40°C to +85°C	20-Lead SOL (R-20)

NOTES

1Burn-in is available on commercial and industrial temperature range parts in cerdip, plastic DIP, and TO-can packages. 2For devices processed in total compliance to MIL-STD-883, add /883 after part number. Consult factory for 883 data sheet. 3For availability and burn-in information on SO and PLCC packages, contact your local sales office.

Burn-In Circuit

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DAC8426

DICE CHARACTERISTICS

1.	VOUT B	11.	DB3
2.	VOUT A	12.	DB2
3.	VSS	13.	DB1
4. VREF OUT		14. DB0 (LSB)
5. AGND		15. WR
6. DGND		16. A1
7.	DB7 (MSB)	17.	A0
8.	DB6	18.	VDD
9.	DB5	19.	VOUT D
10. DB4		20.	VOUT C

DIE SIZE 0.129 × 0.152 inch, 19,608 sq. mils (3.28 × 3.86 mm, 12.65 sq. mm)

WAFER TEST LIMITS at VDD = +15 V 6 5%; VSS = AGND = DGND = 0 V; unless otherwise specified. TA = +258C. All specifications apply for DACs A, B, C, and D.

			DAC8426GBC
Parameter	Symbol	Conditions	Limits	Units
Total Unadjusted Error	TUE		±2	LSB max
Relative Accuracy	INL		±1	LSB max
Differential Nonlinearity	DNL		±1	LSB max
Full-Scale Error	GFSE		±1	LSB max
Zero Code Error	VZSE		±20	mV max
DAC Output Current	IOUTSOURCE	Digital In = All Ones	10	mA min
Reference Output Voltage	VREFOUT	No Load	10.04	V max
Load Regulation	LDREG	IL = 5 mA	0.1	%/mA max
Line Regulation	LNREG	VDD = ±10 V	0.04	%/V max
Reference Output Current	IREFOUT	VREFOUT < 40 mV	5	mA min
Logic Inputs High	VINH		2.4	V min
Logic Inputs Low	VINL		0.8	V max
Logic Input Current	IIN	VIN = 0 V or VDD	±1	μA max
Positive Supply Current	IDD	VIN = VINL or VINH	14	mA max
Negative Supply Current	ISS	VIN = VINL or VINH’ VSS = –5 V	10	mA max

NOTE

Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the DAC8426 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

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