Analog Devices DAC312ER, DAC312HS, DAC312HP, DAC312FR-883, DAC312FR Datasheet

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a		12-Bit High Speed Multiplying
a		D/A Converter
		DAC312

FEATURES

Differential Nonlinearity: 61/2 LSB

Nonlinearity: 0.05%

Fast Settling Time: 250 ns High Compliance: –5 V to +10 V Differential Outputs: 0 to 4 mA

Guaranteed Monotonicity: 12 Bits Low Full-Scale Tempco: 10 ppm/8C

Circuit Interface to TTL, CMOS, ECL, PMOS/NMOS Low Power Consumption: 225 mW

Industry Standard AM6012 Pinout Available In Die Form

GENERAL DESCRIPTION

The DAC312 series of 12-bit multiplying digital-to-analog converters provide high speed with guaranteed performance to 0.012% differential nonlinearity over the full commercial operating temperature range.

The DAC312 combines a 9-bit master D/A converter with a 3-bit (MSBs) segment generator to form an accurate 12-bit D/A converter at low cost. This technique guarantees a very uniform step size (up to ±1/2 LSB from the ideal), monotonicity to 12-bits and integral nonlinearity to 0.05% at its differential current outputs. In order to provide the same performance with a 12-bit R-2R ladder design, an integral nonlinearity over temperature of 1/2 LSB (0.012%) would be required.

The 250 ns settling time with low glitch energy and low power consumption are achieved by careful attention to the circuit design and stringent process controls. Direct interface with all popular logic families is achieved through the logic threshold terminal.

PIN CONNECTIONS

20-Pin Hermetic DIP (R-Suffix),

20-Pin Plastic DIP (P-Suffix),

20-Pin SOL (S-Suffix)

High compliance and low drift characteristics (as low as

10 ppm/°C) are also features of the DAC312 along with an excellent power supply rejection ratio of ±.001% FS/% V. Operating over a power supply range of +5/–11 V to ±18 V the device consumes 225 mW at the lower supply voltages with an absolute maximum dissipation of 375 mW at the higher supply levels.

With their guaranteed specifications, single chip reliability and low cost, the DAC312 device makes excellent building blocks for A/D converters, data acquisition systems, video display drivers, programmable test equipment and other applications where low power consumption and complete input/output versatility are required.

FUNCTIONAL BLOCK DIAGRAM

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Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 Fax: 617/326-8703

DAC312–SPECIFICATIONS

ELECTRICAL CHARACTERISTICS

(@ VS = 615 V, IREF = 1.0 mA, 08C ≤ TA ≤ +708C for DAC312E and –408C ≤ TA ≤ +858C for DAC312F, DAC312H, unless otherwise noted. Output characteristics refer

to both IOUT and IOUT.)

DAC312E

DAC312F

DAC312H

Parameter

Symbol

Conditions

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Units

Resolution

Bits

Monotonicity

±0.0125

±0.0250

Bits

Differential Nonlinearity

DNL

Deviation from Ideal

%FS

Step Size2

±0.5

±1

LSB

Nonlinearity

INL

Deviation from Ideal

±0.05

%FS

Straight Line1

Full-Scale Current

IFS

VREF = 10 V

R14 = R15 = 10 kΩ2

3.967

3.999

4.031

3.935

3.999

4.063

3.935

3.999

4.063

Full-Scale Tempco

TCIFS

±5

±20

±10

±40

±80

ppm/°C

±0.005

±0.002

±0.001

±0.004

±0.008

%FS/°C

Output Voltage Compliance

VOC

DNL Specification Guaran-

teed over Compliance Range

–5

+10

–5

+10

–5

+10

Full-Scale Symmetry

IFSS

|IFS|–|IFS|

±0.4

±1

±0.4

±2

±0.4

±2

μA

Zero-Scale Current

IZS

To ±1/2 LSB, All Bits

0.10

μA

Settling Time

Switched ON or OFF1

250

500

250

500

250

500

Propagation Delay–All Bits

tPLH

All Bits Switched 50% Point

tPHL

Logic Swing to 50% Point

Output1

MΩ

Output Resistance

>10

Output Capacitance

COUT

Logic Input

Levels “0”

VIL

VLC = GND

0.8

Levels “1”

VIH

VLC = GND

Logic Input Current

IIN

VIN = –5 to +18 V

μA

Logic Input Swing

VIS

–5

+18

–5

+18

–5

+18

Reference Bias Current

I15

–0.5

–2

–0.5

–2

–0.5

–2

μA

Reference Input

R14(eq) = 800 Ω, CC = 0 pF1

mA/μs

Slew Rate

dl/dt

Power Supply Sensitivity

PSSIFS+

V+ = +13.5 V to +16.5 V,

±0.0005

±0.001

±0.0005

±0.001

±0.0005

±0.001

V– = –15 V

%FS/%

PSSIFS–

V– = –13.5 V to –16.5 V,

±0.00025

±0.001

±0.00025

±0.001

±0.00025

±0.001

V+ = +15 V

%FS/%

Power Supply Range

V+

VOUT = 0 V

4.5

V–

VOUT = 0 V

–18

–10.8

–18

–10.8

–18

–10.8

Power Supply Current

I+

V+ = +5 V, V– = –15 V

3.3

I–

V+ = +15 V, V– = –15 V

–13.9

–18

–13.9

–18

–13 9

–18

I+

V+ = +5 V, V– = –15 V

3.9

I–

V+ = +15 V, V– = –15 V

–13.9

–18

–13.9

–18

–13.9

–18

Power Dissipation

V+ = +5 V, V– = –15 V

225

305

225

305

225

305

V+ = +15 V, V– = –15 V

267

375

267

375

267

375

TYPICAL ELECTRICAL CHARACTERISTICS @ 258C; VS = 615 V, and IREF = 1.0 mA, unless otherwise noted. Output characteristics refer to both IOUT and IOUT.

			DAC312N	DAC312G
Parameter	Symbol	Conditions	Typical	Typical	Units

Reference Input					mA/μs
Slew Rate	dl/dt		8	8	mA/μs

Propagation Delay	tPLH, tPHL	Any Bit	25	25	ns
Settling Time	tS	To ±1/2 LSB, All
		Bits Switched ON	250	250	ns
		or OFF.

Full-Scale	TCIFS		±10	±10	ppm/°C

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DAC312

ELECTRICAL CHARACTERISTICS @ VS = 615 V, IREF = 1.0 mA, 08C ≤ TA ≤ 708C for DAC312E and –408C ≤ TA ≤ +858C for

DAC312F, DAC312H, unless otherwise noted. Output characteristics refer to both IOUT and IOUT. Continued

DAC312E

DAC312F

DAC312H

Parameter

Symbol

Conditions

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Units

Logic Input

Levels “0”

VIL

VLC = GND

0.8

Logic Input

Levels “1”

VIH

VLC = GND

Logic Input

μA

Current

IIN

VIN = –5 V to +18 V

Logic Input

Swing

VIS

–5

+18

–5

+18

–5

+18

Reference Bias

μA

Current

I15

–0.5

–2

–0.5

–2

–0.5

–2

Reference Input

dl/dt

R14(eq) = 800 Ω

mA/μs

Slew Rate

CC = 0 pF (Note 1)

V+ = +13.5 V to +16.5 V,

±0.0005

±0.001

±0.0005

±0.001

±0.0005

±0.001

%FS/%

Power Supply

PSSIFS+

V– = –15 V

±0.00025

±0.001

±0.00025

±0.001

±0.00025

±0.001

Sensitivity

PSSIFS–

V– = –13.5 V to –16.5 V,

%FS/%

V+ = +15 V

Power Supply

V+

4.5

Range

V–

VOUT = 0 V

–18

–10.8

–18

–10.8

–18

–10.8

I+

3.3

Power Supply

I–

V+ = +5 V, V– = –15 V

–13.9

–18

–13.9

–18

–13.9

–18

Current

I+

V+ = +15 V, V– = –15 V

3.9

I–

–13.9

–18

–13.9

–18

–13.9

–18

Power

V+ = +5 V, V– = –15 V

225

305

225

305

225

305

Dissipation

V+ = +15 V, V– = –15 V

267

375

267

375

267

375

NOTES

1Guaranteed by design.

2TA = +25°C for DAC312H grade only. Specifications subject to change without notice.

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DAC312

WAFER TEST LIMITS @ VS = 615 V, IREF = 1.0 mA, TA = 258C, unless otherwise noted. Output characteristics refer to both IOUT and IOUT.

			DAC312N	DAC312G
Parameter	Symbol	Conditions	Limit	Limit	Units

Resolution			12	12	Bits min

Monotonicity			12	12	Bits min

Nonlinearity			±0.05	±0.05	%FS max

Output Voltage		Full-Scale Current	+10	+10	V max
Compliance	Voc	Change <1/2 LSB	–5	–5	V min

Full-Scale		VREF = 10.000 V	4.031	4.063	mA max
Current		R14, R15 = 10.000 kΩ	3.967	3.935	mA min
Full-Scale Symmetry	IFSS		±1	±2	μA max
Zero-Scale Current	IZS		0.1	0.1	μA max
Differential	DNL	Deviation from	±0.012	±0.025	%FS max
Nonlinearity		Ideal Step Size	±1/2	±1	Bits (LSB) max
Logic Input Levels “0”	VIL	VLC = GND	0.8	0.8	V max
Logic Input Levels “1”	VIH	VLC = GND	2	2	V min
Logic Input Swing	VIS		+18	+18	V max
			–5	–5	V min

Reference Bias					μA max
Current	I15		–2	–2	μA max
Power Supply	PSSIFS+	V+ = +13.5 V to +16.5 V, V– = –15 V	±0.001	±0.001
Sensitivity	PSSIFS–	V– = –13.5 V to –16.5 V, V+ = +15 V	±0.001	±0.001	%/%max
Power Supply	I+	VS = +15 V	7	7
Current	I–	IREF ≤ 1.0 mA	–18	–18	mA max
Power		VS = +15 V
Dissipation	PD	IREF ≤ 1.0 mA	375	375	mW max

NOTE

Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.

DICE CHARACTERISTICS

1.	B1	(MSB)	11.	B11
2.	B2		12.	B12 (LSB)
3.	B3		13.	VLC/AGND
4.	B4		14.	VREF(+)
5.	B5		15.	VREF(–)
6. B6			16. COMP
7.	B7		17.	V–
8.	B8		18.	IO
9.	B9		19.	IO
10.	B10		20.	V+

DIE SIZE 0.141 × 0.096 inch, 13,536 sq. mils (3.58 × 2.44 mm, 8.74 sq. mm)

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DAC312

ABSOLUTE MAXIMUM RATINGS1
Operating Temperature	0°C to +70°C
DAC312E . . . . . . . . . . . . . . . . . . . . . . . . . . .	0°C to +70°C
DAC312F, DAC312H . . . . . . . . . . . . . . . . . .	–40°C to +85°C
Junction Temperature . . . . . . . . . . . . . . . . . . . .	–65°C to +150°C

Storage Temperature (Tj) . . . . . . . . . . . . . . . . . –65°C to +125°C

Lead Temperature (Soldering, 60 sec)		. . . . . . . . . .	. . . . . . 300°C
Power Supply Voltage . . . . . .	. . . . . . .	. . . . . . . . . .	. . . . . . ±18 V
Logic Inputs . . . . . . . . . . . . .	. . . . . . .	. . . . . . . . .	–5 V to +18 V
Analog Current Outputs . . . . . . . . . . . . . . . . . . . .			–8 V to +12 V
Reference Inputs V14, V15 . . .	. . . . . . .	. . . . . . . . . .	. . . V– to V+
Reference Input Differential Voltage (V14, V15) . . . .			. . . . . . ±18 V
Reference Input Current (I14)	. . . . . . .	. . . . . . . . . .	. . . . 1.25 mA
Package Type	uJA2	uJC	Units
20-Pin Hermetic DIP (R)	76	11	°C/W
20-Pin Plastic DIP (P)	69	27	°C/W
20-Pin SOL (S)	88	25	°C/W

NOTES

1Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted.

2θJA is specified for worst case mounting conditions, i.e., θJA is specified for device in socket for cerdip and P-DIP packages; θJA is specified for device soldered to printed circuit board for SOL package.

ORDERING GUIDE1

		Temperature	Package	Package
Model	DNL	Range	Description	Option

DAC312ER2	± 1/2 LSB	0°C to +70°C	Cerdip-20	Q-20
DAC312FR	± 1 LSB	–40°C to +85°C	Cerdip-20	Q-20
DAC312BR/883	± 1 LSB	–55°C to +125°C	Cerdip-20	Q-20
DAC312HP	± 1 LSB	–40°C to +85°C	Plastic DIP-20	N-20
DAC312HS	± 1 LSB	–40°C to +85°C	SOL-20	R-20

NOTES

1Burn-in is available on commercial and industrial temperature range parts in cerdip, plastic DIP, and TO-can packages.

2For devices processed in total compliance to MIL-STD-883, add/883 after part number. Consult factory for 883 data sheet.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the DAC312 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

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