HP StorageWorks 2300 User Manual

user’s guide

hp StorageWorks disk system 2300

Edition E0902

Notice

© Hewlett-Packard Company, 2002. All rights reserved.

A6490-96014

Hewlett-Packard Company makes no warranty of any kind with regard to this material, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose. Hewlett-Packard shall not be liable for errors contained herein or for incidental or consequential damages in connection with the furnishing, performance, or use of this material.

This document contains proprietary information, which is protected by copyright. No part of this document may be photocopied, reproduced, or translated into another language without the prior written consent of Hewlett-Packard. The information contained in this document is subject to change without notice.

Format Conventions

WARNING	Identifies a hazard that can cause
	personal injury
Caution	Identifies a hazard that can cause
	hardware or software damage
Note	Identifies significant concepts or
	operating instructions

this font - used for all text to be typed verbatim: all commands, path names, file names, and directory names also, text displayed on the screen

<this font> - used for variables used in commands

this font - used for GUI menu options and screen controls

Trademark Information

Red Hat is a registered trademark of Red Hat Co.

C.A. UniCenter TNG is a registered trademark of Computer Associates International, Inc.

Microsoft, Windows NT, and Windows 2000 are registered trademarks of Microsoft Corporation

HP, HP-UX are registered trademarks of HewlettPackard Company. Command View, Secure Manager, Business Copy, Auto Path, Smart Plug-Ins are trademarks of Hewlett-Packard Company

Adobe and Acrobat are trademarks of Adobe Systems Inc.

Java and Java Virtual Machine are trademarks of Sun Microsystems Inc.

NetWare is a trademark of Novell, Inc.

AIX is a registered trademark of International Business Machines, Inc.

Tru64 and OpenVMS are registered trademarks of Compaq Corporation.

contents

1 Product Description			11
General Description		11
Features 13
Status Indicators		15
Power/Standby Switch			16
High Availability		16
Clustering (NT) 16
Upgradability 16
Environmental Services			17
Hardware Event Monitoring 17
Components	18
Disk Modules and Disk Module Filler Panels 18
BCCs and BCC Filler Panels				19
Power Supply/Fan Module 22
Hardware/Software Requirements				24
Topologies	27
Definitions	33
High availability (HA) 33
Hot-pluggable		33
JBOD 33
LVD	33
PDU and PDRU 33
Ultra160 SCSI		34

2 Installation 35

Preparation 36

Electrical Requirements 36

Choosing PDUs 37

3

Installing PDUs		39
Software Requirements			42
Auto-Termination	43
Step 1: Gather Tools	44
Step 2: Unpack the Product			44
Step 3: Install the device		47
Installing the Storage Device into a Rack System/E 47
Installing the storage device into an HP Computer Cabinet 56
Installing the Storage Device into a Rittal-Style Rack 64
Install the Disk System			70
Step 4: Install BCCs	71
Step 5: Set DIP Switches		74
Step 6: Connect SCSI and Power Cables 75
Step 7: Install Disk Modules			78
Step 8: Turn on the Disk System				80
Step 9: Verify Devices on the Host				81
Sample IOSCAN	81
Where do you go from here? 82

3 Configuration 83

Viewing a Disk System in IOSCAN 84
Sample IOSCAN	84
Setting DIP Switches	85
Rationale 87
Disk Addressing 88
Disk Slots and Addressing 89
Setting Up the Hardware Event Monitor		90
Aliasing Devices (HP-Qualified Only) 90
Updating Firmware (HP-Qualified Only)		91
Command View SDM	91

Supported Operating Systems 92

Installing CommandView SDM 92

HP TopTools 93

Supported Operating Systems 93

Installing HP TopTools 5.0 93

4

4 Troubleshooting 95

Overview 96

Event Notification (HP-UX Systems) 97

HP Command View SDM 100

TopTools 100

Status LEDs 101

Isolating Faults 104

5	Removal and Replacement 107
Disk Module		110
Preparation (HP-UX 11.XX)			110
	To Determine If a Volume Group or Physical Volume Group Is
	Active	111
	To Determine If the Physical Volume Is Attached 111
	To Replace Attached Physical Volumes 112
	To Replace Unattached Physical Volumes 114
	NT 114
Windows 2000 115
Tools 115
Procedure		115
BCC	119
Tools 119
Procedure		119
BCC Filler Panel 122
Power Supply		123
Tools 123
Procedure		123
Disk System		125
Tools 125
Procedure		125
Top Cover (HP-Qualified Only)			128
Tools 128
Procedure		128
Midplane (HP-Qualified Only)			130
Tools 130
Procedure		130

5

Deskside Base/External Covers (HP-Qualified Only) 133

Powering Down the Disk System 133

Removing the deskside base and external covers from the disk system 133 Tools 133

Procedure 133

Reinstalling the deskside base and external covers on the disk system. 138

6 Reference 141

Product Models 141

Upgrade Products 142

PDU/PDRU Products 143

Replaceable Parts 144

Specifications 145

Dimensions 145

Weight 145

AC Power Input 146

DC Power Output 146

Heat Output 146

Environment 146

Acoustics 147

Safety Certifications 147

EMC Compliance 147

Regulatory Statements 148

A.FCC Statement (For U.S.A. Only) 148

B.IEC Statement (Worldwide) 148

C.Spécification ATI Classe A (France) 148

D.Product Noise Declaration (Germany) 149

E.VCCI Statement (Japan) 150

Harmonics Conformance (Japan)

150

F.BCIQ EMC Statement (Taiwan) 150

G.Declaration of Conformity 151 Product Web Site 152

Related Documents 152

6

figures

Figure 1	Disk System - Racked Views				14
Figure 2	Disk System Deskside Views				15
Figure 3	Disk Module 19
Figure 4	BCC	20
Figure 5	BCC Filler Panel		21
Figure 6	Power Supply/Fan Module			22
Figure 7	Basic Configuration - Single Host, Single Disk System 28
Figure 8	Single Host, Split Bus Configuration					29
Figure 9	Single Host PV-Links Configuration					30
Figure 10	Two Host Non-High Availability Configuration 31
Figure 11	Two Host High Availability Configuration						32
Figure 12	PDRU Placement in 1.6-Meter Rack					40
Figure 13	PDRU Placement in a 2.0-Meter Rack					41
Figure 14	Host Bus Adapter HP A5149A				43
Figure 15	Disk System Accessories			45
Figure 16	Disk System ContentsDisk System Contents						46
Figure 17	HP Rack System/E Rail Kit Contents					48
Figure 18	HP Rack System/E Installation Overview 49
Figure 19	Locating the site for the device installation in a System/E
	Rack	51
Figure 20	Installing clipnuts for an HP Rack System/E						51
Figure 21	Installing rails in an HP Rack System/E 52
Figure 22	Installing the enclosure clipnut
	53
Figure 23	Installing the storage device in the Rack System/E							54
Figure 24	Installing enclosure rail clamps in an HP Rack
	System/E 55
Figure 25	HP Computer Cabinet Rail Kit Contents 56
Figure 26	HP Computer Cabinet Installation Overview						57
Figure 27	Locating the site for the device installation in an HP
	Computer Cabinet		58
Figure 28	Installing rail clip nuts in the HP Computer Cabinet							59
Figure 29	Installing rails in the HP Computer Cabinet						60

7

Figure 30	Installing enclosure retention clipnuts in an HP Computer
	Cabinet 61
Figure 31	Installing the storage device in an HP Computer Cabinet									62
Figure 32	Installing a filler panel in an HP Computer Cabinet								63
Figure 33	Rittal-Style Rail Kit Contents				64
Figure 34	Rail Alignment 65
Figure 35	Front Screw Installation			66
Figure 36	Rear Slide Extension		67
Figure 37	Center Nut Tightening			67
Figure 38	Installing a Disk System into the Rittal-Style Rack								68
Figure 39	Moving a Disk System Retention Bracket							69
Figure 40	Bolting the Disk System to the Front Column of the Rack									69
Figure 41	BCC Installation	72
Figure 42	BCC Filler Panel	73
Figure 43	BCC DIP Switches		74
Figure 44	Wiring Scheme for 1.6-Meter Rack						76
Figure 45	Wiring Scheme for 2.0-Meter Rack						77
Figure 46	Disk Module Installation 78
Figure 47	On/Off Switch and System LEDs					80
Figure 48	DIP Switches 86
Figure 49	Disk Module Slots and SCSI Addresses							89
Figure 50	Sample Hardware Event Notification						99
Figure 51	LED Status Indicators			101
Figure 52	Disk System Field Replaceable Units (FRUs) 108
Figure 53	Disk Module Removal			117
Figure 54	BCC Removal and Replacement					120
Figure 55	BCC DIP Switches		121
Figure 56	BCC Filler Panel Installation				122
Figure 57	Power Supply Removal and Replacement							124
Figure 58	Disk System Removal and Replacement							126
Figure 59	Top Cover Assembly		129
Figure 60	Midplane Assembly		132
Figure 61	End Cap Removal and Replacement						134
Figure 62	Base Removal and Replacement					135
Figure 63	Base Removal from Chassis				136
Figure 64	Removal from Cover		137
Figure 65	Installing Disk System into Cover					138
Figure 66	Installing Base to Cover and Chassis						139
Figure 67	End Cap Replacement			140

8

tables

Table 1	Inrush (Surge) Current and Duration 36
Table 2	Maximum Operating Current 36
Table 3	Recommended PDU/PDRUs for Multiple Disk Systems in
	HP Computer Cabinets 38
Table 4	Recommended PDU/PDRUs for Multiple Disk Systems in
	HP System/E Racks	38
Table 5	Disk System Accessories 44
Table 6	Disk System Contents 46
Table 7	Rail Positions for Sequential Disk Systems		50
Table 8	DIP Switch Settings	85
Table 9	DIP Switch Usage	87
Table 10	Disk and BCC SCSI Addresses for Full and Split Bus
	Modes 88
Table 11	LED Functions 102
Table 12	Troubleshooting Table 104
Table 13	JBOD Enclosure Field Replaceable Units		109
Table 14	Upgrade Products 142
Table 15	PDU/PDRU Products 143
Table 16	Replacement and Exchange Part Numbers		144
Table 17	Product Weights 145

9

10

Product Description	1

General Description

Hewlett-Packard’s StorageWorks Disk System 2300 (referred to in this guide as the disk system) is a high-availability Ultra160 SCSI storage product. Dual SCSI ports on dual bus controllers provide LVD connections to the host. Fourteen slots accept high-speed, high-capacity LVD SCSI disks connected to an LVD midplane. Maximum data throughput is 160 Mbytes/sec. Thirteen disk systems fill a 2-meter System/E rack. Filled with 18-Gbyte disks, the 2-meter Rack System/E yields 3.3 Terabytes of storage; with 36-Gbyte disks, 6.6 Terabytes of storage and with 73-Gbyte disks, 13.3 Terabytes.

Modular and redundant components are easy to upgrade and maintain. Disks, power supply/fan modules, and bus control cards (BCCs) are replaceable parts that plug into individual slots in the front and back of the disk system. Redundant power supply/fan modules, and BCCs can be removed and replaced without interrupting storage operations. Disks also can be replaced with the system on and with only the affected file systems taken off-line. Hewlett-Packard technical support is optional for these procedures.

Special electronics and HP-UX software enable remote monitoring and diagnostics. Sensors on the BCCs monitor the disk system environment, including temperature, voltage, fan speed, and component status. HewlettPackard’s Command View SDM reports any changes in environmental status to user-defined locations. Standard HP-UX diagnostic utilities also report environmental data for enhanced troubleshooting.

Product Description

11

HP Command View SDM (Software Device Manager) software is designed to provide storage management for HP disk systems. This software, available on the HP Command View SDM CD-ROM, provides simple, yet sophisticated device management tools for the disk system. HP Command View SDM is supported on the following:

■HP-UX 11.00 (see Support Plus web site for the required patches)

■HP-UX 11.11 (see Support Plus web site for the required patches)

■Windows NT 4.0 (Service Pack 6a or greater)

■Windows 2000 (Service Pack 1 or greater)

■Linux Red Hat 7.2

HP TopTools is a web-based, device management tool that enables administrators and MIS managers to use a web browser to obtain information about devices on their network. It provides specific management to the following HP products:

■HP Vectra and Brio Desktops

■HP Kayak and Visualize Workstations

■HP Omnibook Notebooks

■HP Netservers

■HP Procurve and AdvanceStack networking devices

■HP LaserJet and JetDirect products

■HP Jornada PC Companions

■HP StorageWorks products

■HP Network Attached Storage (NAS) products

■HP-UX systems with EMS

■Windows systems

12 Product Description

Features

The disk system occupies 3 EIA units in a standard 19-inch rack. Disk drives mount in the front of the system. Redundant power supplies, and BCCs mount in the back. See Figure 1 and Figure 2 below. For disk slots and SCSI addressing, see Figure 49.

Description Product

Product Description 13

14 Product Description

Description Product

Status Indicators

LEDs on the disk system enable you to detect and replace failed components and so prevent or minimize users’ downtime. For additional information about LEDs, see Chapter 4, Troubleshooting.

On the front of the disk system, a pair of LEDs indicates the status of the disk system, and an LED for each slot shows disk I/O activity:

■The system power LED (B in Figure 1) indicates that power is on or off.

■The system fault LED (C in Figure 1) indicates whether or not a fault has occurred anywhere in the disk system.

■At the bottom of each disk module, the left LED (F in Figure 1) indicates the presence of I/O activity on the disk.

■The second LED on each disk module (E in Figure 1) can be flashed to help a customer engineer (CE) locate the disk for physical inspection or removal.

■The second LED is also used as a fault indicator for that specific disk module.

LEDs (I and K in Figure 2) on the back of the disk system indicate the status of replaceable components and the SCSI bus: See Chapter 4, Troubleshooting, for specific LED information.

Product Description 15

Power/Standby Switch

Located at the upper right corner of the front of the disk system, the power switch (D in Figure 1) interrupts DC power from the power supplies to the BCCs and other internal components. Input AC power to the power supplies is controlled by the power cords and the AC source.

High Availability

High availability is a general term describing computer systems that are designed to minimize planned and unplanned downtime. The disk system supports current systems’ high availability requirements through the following features:

■Hot-pluggable, high-capacity, high-speed disks

■Redundant, hot-pluggable, user-replaceable power supplies and BCCs

■Online firmware upgrades

■Hardware event monitoring and real-time error reporting

Clustering (NT)

The HP Disk System 2300 is Microsoft® Cluster certified for a variety of solutions. For specific information about supported configurations, see the Hewlett-Packard Company or Microsoft web pages:

http://hp.com

http://microsoft.com

Upgradability

You can increase disk system storage capacity by:

■Replacing disk drives with higher-capacity disk drives

■Adding disks in unused slots

None of these actions require shutting down the product, but some may require the use of system utilities to manage file systems.

Upgrade BCC and disk firmware using an on-line download function. See

Chapter 3, Updating Firmware.

16 Product Description

Environmental Services

Environmental services circuitry monitors the following elements:

■Fan rotation

■Power supply output

■Power supply status (fan status)

■Disk drive status, presence

■BCC status

■Temperature

■Self-test results

Each BCC reports the status of all elements in the disk system, even if the BCC does not have direct access to the element.

Additionally, the EEPROM on each BCC stores 2 Kbytes of configuration information and user-defined data, including the manufacturer serial number, and product number.

Hardware Event Monitoring

A hardware event monitor monitors the disk system and reports changes in environmental status to Hewlett-Packard’s Event Monitoring System (EMS) for HP-UX. Hardware event monitoring is an important tool for implementing high availability. Using hardware event monitors, you can virtually eliminate undetected hardware failures that interrupt system operation or cause data loss.

The EMS Hardware Monitors User’s Guide is available in Adobe® Acrobat® format on the HP document web site, http://www.docs.hp.com/hpux/systems/.

Description Product

Product Description 17

Components

User-replaceable components enable high availability and easy maintenance.

This section describes the following components:

■Disks and disk fillers

■BCCs and BCC fillers

■Power supply/fan modules

Disk Modules and Disk Module Filler Panels

Disk modules, shown in Figure 3, contain 3.5-inch Low Profile Ultra 3 LVD disks.

The disk module’s components are protected by a metal grill on the disk module’s bottom side.

WARNING Disks require careful handling and ESD precautions.

The plastic parts of the disk are safe to touch:

■Extractor handle (A in Figure 3)

■Latch tab (B)

You may also safely touch the top and bottom of the disk module without damaging the disk module.

A metal grill protects exposed circuits against damage when the disk module is laid circuit-side down on a flat surface.

The initial disk options for this product are 18-GByte, 36-GByte, and 73-Gbyte 10 K RPM disk drives. 18-GByte and 36-GByte 15 K RPM disk drives are also supported. A label on the disk carrier shows the storage capacity and rotational speed of the installed disk. Obtain information about the latest disk options from HP sales representatives.

Caution	Fillers must be installed in unused slots in order to maintain even
	cooling for the installed disk modules.

18 Product Description

Description Product

BCCs and BCC Filler Panels

BCCs (Bus Control Cards) plug into two slots in the back of the disk system. Each BCC connects to both LVD (low voltage differential) buses inside the disk system. In full bus mode (DIP switch 1 set to “|”), both BCCs have access to all installed disks. The two SCSI buses are bridged. If either BCC fails and LVM primary and alternate paths are defined, data can be accessed through the other BCC. In split bus mode (DIP switch 1 set to “0”), the left BCC (as viewed from the rear of the disk system), is on the high numbered bank (with disk slots 8, 9, 10, 11,12, 13, and 14) and the right BCC is on the low numbered bank (with disk slots 0, 1, 2, 3,4, 5, and 6) of disk slots. See Figure 1.

Two SCSI ports (B in Figure 4) on each BCC provide dual LVD connections to the same or separate hosts. If a host is connected to one of the BCC ports, an LVD terminator must be connected to the other port on that BCC.

Product Description 19

Other features of the BCC are:

■LEDs (C) indicating BCC status and bus configuration

■DIP switches (D) on the rear panel: 1 Bus Mode (full or split bus)

2 Monitor Mode (SAF-TE or SES)

■Locking thumbscrews (E)

■Cam levers (F)

20 Product Description

BCC circuitry provides the following functions:

■Bus configuration (see “Setting DIP Switches” in Chapter 3)

■Bus expansion (LVD)

■SCSI environmental services (see page 17)

■System fault detection

A BCC filler panel (Figure 5) replaces the second BCC when redundancy is not required.

Caution	The BCC filler panel maintains even cooling inside the disk
	system when the second BCC is not present. A BCC filler panel
	must be installed if the BCC is removed.

Description Product

Product Description 21

Power Supply/Fan Module

Redundant, hot-pluggable 340-watt power supplies convert wide-ranging AC voltage from an external main to stable DC output and deliver it to the midplane. Each power supply has an internal fan, an AC receptacle (A in Figure 6), two ejector handles (D) with thumbscrews (C), and 2 LEDs (B). Internal control prevents the rear DC output connector from becoming energized when the power supply is removed from the disk system.

22 Product Description

Power supplies share the load reciprocally; that is, each supply automatically increases its output to compensate for reduced output from the other, and vice versa. If one power supply fails, the other delivers the entire load.

Internal circuitry triggers a fault when the internal fan or other part fails. At the same time, the power fault LED (amber) illuminates, and, if enabled, the hardware event monitor sends an event message. The power supply fan remains on if other parts fail in order to maintain cooling air flow through the system. If the fan fails, the power supply shuts down. The fan in the other working power supply will increase to full speed to compensate for the failed fan. The failed power supply/fan module must be removed and the replacement power supply/ fan module installed within two minutes. In the event of a failure, if a replacement fan module/power supply is not available, leave the failed power supply/fan module installed until you are ready to replace it. This should be done to maintain proper cooling for the disk system.

Internal circuitry senses fan motion and triggers a fault when the speed of the power supply’s internal fan falls below a critical level. At the same time, the LED turns amber, and, if enabled, the hardware event monitor sends an event message.

Description Product

Product Description 23

Hardware/Software Requirements

The disk system is supported on the following operating systems:

■HP-UX 11.00 with HWE 0302 (March 2002 Patch bundles) or greater

■HP-UX 11.11 with HWE 0302 (March 2002 Patch bundles) or greater

■Linux Red Hat 6.2, 7.0, 7.1

■Windows NT 4.0 (Advanced Server, Enterprise Edition)

■Windows 2000 (Server and Advanced Server)

■Microsoft Windows.Net (Server and Advanced Server)

■SCO UnixWare 7.11

■SCO OpenServer 5.06

■HP MPE/iX 7.0

The following SCSI host bus adapters (HBAs) support the Disk System 2300:

■A4999A, Ultra2 Low Voltage Differential SCSI Host Bus Adapter for B-, C-, J-, and X-Class systems

■A5140A Single Port Ultra 2 SCSI HBA Host bus adapter for A-, L-, V-Class, and Superdome.

■A5149A, Single Port Ultra 2 SCSI HBA (PCI bus) Host bus adapter for rp54X0, rp7400, rp7410, and rp8400 servers and A-, N-, L-, V-Class, and Superdome systems (Full length card).

■A5150A, Dual Port Ultra 2 SCSI (PCI bus) Host bus adapter for rx4610 and rx9610 servers and A-, N-, L-, V-Class, and Superdome systems (Full length card).

■A5159A, Dual Part FWD SCSI PCI Host bus adapter for rx4610 and rx9610 servers

■A5838A, Dual-Port 100Base-T/Dual-Port Wide Ultra2 Host bus adapter for A-, N-, L-, V-Class, and Superdome systems.

■A5856A, RAID 4Si - 4-Port Ultra2 LVD/SE RAID Host bus adapter for rp54X0, rp7400, rp7410, and rp8400 servers, and A-, N-, L-, V-Class, and Superdome systems.

■A6828A, Single Port Ultra 160 SCSI HBA (PCI bus) Host bus adapter for rp54X0, rp7400, rp7410, and rp8400 servers, and A-, N-, L-, V-Class, and Superdome systems (Full length card).

24 Product Description

■A6829A, Dual Port Ultra160 SCSI (PCI bus) adapter Host bus adapter for rp54X0, rp7400, rp7410, and rp8400 servers and A-, N-, L-, V-Class, and Superdome systems (Full length card).

The following host bus adapters are supported on HP Netservers:

■C7430A, PCI Ultra2 wide Host bus adapter

■D5025A, HP Ultra/Wide SCSI Host bus adapter for Netservers

■D9161A, NetRAID 4M/64MB Cache Host bus adapter for HP Netservers

■D9351A, NetRAID 4M/128MB Cache Host bus adapter for HP Netservers

■P3413A, Single port Ultra160 SCSI Host bus adapter for HP Netservers

Description Product

Product Description 25

The following HP Netserver models are supported by the Disk System 2300:

■rc7100

■tc7100

■tc 6100

■tc4100

■tc3100

■rx4610

■LXr8000

■LXr8500

■LH3/LH3r

■LH4/LH4r

■LH3000/LH3000r

■LH6000/LH6000r

■LC2000/LC2000r

■LT6000

■LPr

■LP1000r

■LP2000r

■E45/E50

■E55/E60

■E200/E200se

■E800

The following host bust adapters are not supported at this time:

■D2140A, NetRAID 1Si Host bus adapter

■D5955A, NetRAID 3Si Host bus adapter

■P3410A, NetRAID 1M Ultra160 SCSI Host bus adapter with 64MB

■P3411A/B, NetRAID 2M Ultra160 SCSI Host bus adapter with 64MB

■P3475A/B, NetRAID 2M Ultra160 SCSI Host bus adapter with 128MB

26 Product Description

Topologies

The disk system supports high availability through redundant components and redundant connections to redundant hosts. Each SCSI port on a BCC can be connected to a different host bus adapter in the same or different hosts. Internal mirroring within the disk system is also possible.

Basic high availability topologies are described on the following pages. For information about specific supported topologies, consult an HP sales representative.

This disk system can hold up to 14 disk modules. The maximum number of disk modules can be installed in either Full Bus Mode or Split Bus Mode. However, host and disk drive addressing must be closely managed.

Full Bus Mode

The maximum of 14 disk modules can be supported in Full Bus Mode provided there there is only one host bus adapter (HBA) connection and the HBA has the SCSI address of 7.

If more than one host connection is required, the slot with the SCSI address corresponding to the SCSI address of the additional host must not have a disk module installed in it to avoid bus contention. For example, if two connections are made to a Disk System 2300 with HBAs having SCSI addresses of 6 and 7, then SCSI ID 6 (slot 7)must not have a disk module installed in it.

Note	SCSI address 15 should never be used by an HBA when
	connecting to a Disk System 2300 because this address is reserved
	on the SCSI bus for the enclosure services microprocessor.

Connecting one disk system to redundant hosts achieves system level high availability. A single host bus adapter in each host is connected to a different port in the disk system. With the disk system in full bus mode (switch 1 on), each host can reach all the disks. If the right BCC (viewed from the rear of the disk system) fails in this topology, there is still one path to the disks through BCC B. With the disk system in split bus mode (two internal busses), the Disk System 2300 supports data mirroring between the two internal busses within the same disk system. All connections from the host to the disk system are SCSI LVD cables.

Description Product

Product Description 27

Another type of high availability topology connects mirrored disk systems to redundant hosts. Dual host bus adapters in each host are connected to mirrored disk systems. With the disk systems in full bus mode (switch 1 on), each host can reach all disks in both disk systems. If one of the disk systems fails in this topology, all hosts will still have access to the data on the mirrored disk system. All connections from the host to the disk system are SCSI LVD cables.

Due to SCSI ID limitations, daisy chaining of the Disk System 2300 is not supported. The maximum storage capacity with this type of configuration is approximately one Terabyte. This configuration does not provide any redundant paths to the data, however there is some hardware redundancy provided by the disk system hardware (i.e. power supply/fan modules and BCCs). This configuration can be used for boot, root, swap, or file system storage. Using Mirror/UX software, one or more mirrors can be created on the same hardware path to provide a basic level of data protection.

In figures 7 through 11, any BCC shown with only one cable connection should be understood to have a terminator attached to the other SCSI connector.

28 Product Description

Description Product

The disk system can be connected to a single host with two host bus adapters (HBAs) in a split bus configuration. See Figure 8. Each HBA will do reads and writes to a maximum of seven disks. This configuration can provide a maximum capacity of approximately 1.1 Terabytes. This configuration can also do basic mirroring across different hardware paths, still providing a maximum data capacity of approximately 0.5 Terabytes. This configuration can also yield a maximum performance of 320 MB/s, since each BCC card is capable of 160MB/ s performance in a split bus mode.

Product Description 29

Data path redundancy can be secured with the configuration shown in Figure 9. Using an additional host bus adapter (HBA) and the LVM software, alternate links can be created, providing a redundant path to data for each disk system. In addition, a separate mirror path can be created for data protection. This configuration provides protection against any single component failure (i.e., cables, HBAs, disks). Figure 9 depicts connecting two disk systems to a single host.

The only limit on the number of disk systems per system is the maximum number of supported HBAs. For large configuration, it is recommended that multiple CPUs have large amounts of memory to handle the system load. Each disk system in this configuration is capable of 160MB/s performance. Due to SCSI ID limitations, a maximum of 13 disks is supported per disk system (13 disks + 2 HBAs + 1 SES = 16 SCSI IDs).

30 Product Description