MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by MAC224/D
Triacs
Silicon Bidirectional 40 Amperes RMS
Triode Thyristors
. . . designed primarily for full-wave ac control applications such as lighting systems, heater controls, motor controls and power supplies.
•Blocking Voltage to 800 Volts
•All Diffused and Glass-Passivated Junctions for Parameter Uniformity and Stability
•Gate Triggering Guaranteed in Three Modes (MAC224 Series) or Four Modes (MAC224A Series)
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted.)
MAC224
Series
MAC224A
Series
TRIACs
40 AMPERES RMS
200 thru 800 VOLTS
MT2 |
G |
MT1 |
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CASE 221A-04 (TO-220AB)
STYLE 4
Rating |
Symbol |
Value |
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Unit |
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Peak Repetitive Off-State Voltage(1) |
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VDRM |
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Volts |
(TJ = ±40 to 125°C, |
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1/2 Sine Wave 50 to 60 Hz, Gate Open) |
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MAC224-4, MAC224A4 |
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200 |
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MAC224-6, MAC224A6 |
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400 |
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MAC224-8, MAC224A8 |
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600 |
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MAC224-10, MAC224A10 |
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800 |
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On-State RMS Current (T = 75°C)(2) |
I |
T(RMS) |
40 |
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Amps |
C |
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(Full Cycle Sine Wave 50 to 60 Hz) |
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Peak Non-repetitive Surge Current |
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ITSM |
350 |
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Amps |
(One Full Cycle, 60 Hz, TJ = 125°C) |
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Circuit Fusing (t = 8.3 ms) |
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I2t |
500 |
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A2s |
Peak Gate Current (t p 2 μs) |
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IGM |
±2 |
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Amps |
Peak Gate Voltage (t p 2 μs) |
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VGM |
±10 |
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Volts |
Peak Gate Power (t p 2 μs) |
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PGM |
20 |
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Watts |
Average Gate Power (TC = 75°C, t p 8.3 ms) |
PG(AV) |
0.5 |
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Watts |
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Operating Junction Temperature Range |
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TJ |
±40 to 125 |
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°C |
Storage Temperature Range |
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Tstg |
±40 to 150 |
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°C |
Mounting Torque |
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Ð |
8 |
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in. lb. |
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1. VDRM for all types can be applied on a continuous basis. Blocking voltages shall not be tested with a constant current source |
(cont.) |
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such that the voltage ratings of the devices are exceeded. |
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2.This device is rated for use in applications subject to high surge conditions. Care must be taken to insure proper heat sinking when the device is to be used at high sustained currents. (See Figure 1 for maximum case temperatures.)
Motorola, Inc. 1995
MAC224 Series MAC224A Series
THERMAL CHARACTERISTICS
Characteristic |
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Symbol |
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Max |
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Unit |
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Thermal Resistance, Junction to Case |
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RθJC |
1 |
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°C/W |
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Thermal Resistance, Junction to Ambient |
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RθJA |
60 |
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°C/W |
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ELECTRICAL CHARACTERISTICS (TC = 25°C and either polarity of MT2 to MT1 voltage unless otherwise noted.) |
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Characteristic |
Symbol |
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Min |
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Typ |
Max |
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Unit |
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Peak Blocking Current |
IDRM |
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μA |
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(Rated VDRM, Gate Open) TJ = 25°C |
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Ð |
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Ð |
10 |
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TJ = 125°C |
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Ð |
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Ð |
2 |
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mA |
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Peak On-State Voltage |
VTM |
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Ð |
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1.4 |
1.85 |
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Volts |
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(ITM = 56 A Peak, Pulse Width p 2 ms, Duty Cycle p 2%) |
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Gate Trigger Current (Continuous dc) |
IGT |
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mA |
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(VD = 12 V, RL = 100 Ω) |
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MT2(+), G(+); MT2(+), G(±); MT2(+), G(±) |
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Ð |
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25 |
50 |
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MT2(±), G(+) ªAº SUFFIX ONLY |
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Ð |
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40 |
75 |
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Gate Trigger Voltage (Continuous dc) |
VGT |
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Volts |
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(VD = 12 V, RL = 100 Ω) |
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MT2(+), G(+); MT2(±), G(±); MT(+), G(±) |
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Ð |
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1.1 |
2 |
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MT2(±), G(+) ªAº SUFFIX ONLY |
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Ð |
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1.3 |
2.5 |
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Gate Non-Trigger Voltage |
VGD |
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Volts |
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(VD = Rated VDRM, TJ = 125°C, RL = 10 k) |
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MT2(+), G(+); MT2(±), G(±); MT(+), G(±) |
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0.2 |
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Ð |
Ð |
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MT2(±), G(+) |
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0.2 |
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Ð |
Ð |
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Holding Current (VD = 12 Vdc, Gate Open) |
IH |
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Ð |
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30 |
75 |
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mA |
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Gate Controlled Turn-On Time |
tgt |
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Ð |
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1.5 |
Ð |
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μs |
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(VD = Rated VDRM, ITM = 56 A Peak, IG = 200 mA) |
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Critical Rate of Rise of Off-State Voltage |
dv/dt |
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Ð |
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50 |
Ð |
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V/μs |
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(VD = Rated VDRM, Exponential Waveform, TC = 125°C) |
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Critical Rate of Rise of Commutation Voltage |
dv/dt(c) |
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Ð |
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5 |
Ð |
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V/μs |
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(VD = Rated VDRM, ITM = 56 A Peak, Commutating |
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di/dt = 20.2 A/ms, Gate Unenergized, TC = 75°C) |
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C
T , MAXIMUM ALLOWABLE CASE TEMPERATURE (°C)
125
120
115
110
105
100
95
90
85
80
75
0
FIGURE 1 ± RMS CURRENT DERATING |
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FIGURE 2 ± ON-STATE POWER DISSIPATION |
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(WATTS) |
60 |
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54 |
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DISSIPATION |
48 |
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42 |
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36 |
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POWER |
30 |
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24 |
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AVERAGE, |
18 |
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6.0 |
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D |
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0 |
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P |
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10 |
15 |
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5.0 |
20 |
25 |
30 |
35 |
40 |
0 |
5.0 |
10 |
15 |
20 |
25 |
30 |
35 |
40 |
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IT(RMS), RMS ON-STATE CURRENT (AMPS)* |
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IT(RMS), RMS ON-STATE CURRENT (AMPS)* |
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*This device is rated for use in applications subject to high surge conditions. Care must be taken to insure proper heat sinking when the device is to be used at high sustained currents.
2 |
Motorola Thyristor Device Data |