Texas Instruments WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD Datasheet

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152N – JUNE 20 3 – REVISED APRIL 2021

SWRS152N – JUNE 2013 – REVISED APRIL 2021

WL18x1MOD, WL18x5MOD WiLink™ 8 Single-Band Combo Module – Wi-Fi®, Bluetooth ®, and Bluetooth Low Energy (LE)

1 Features

•General

–Integrates RF, power amplifiers (PAs), clock, RF switches, filters, passives, and power management

–Quick hardware design with TI module collateral and reference designs

–Operating temperature: –20°C to +70°C

–Small form factor: 13.3 × 13.4 × 2 mm

–100-pin MOC package

–FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas

•Wi-Fi®

–WLAN baseband processor and RF transceiver support of IEEE Std 802.11b, 802.11g, and 802.11n

–20and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for high throughput: 80 Mbps (TCP), 100 Mbps (UDP)

–2.4-GHz MRC support for extended range

–Fully calibrated: production calibration not required

–4-bit SDIO host interface support

–Wi-Fi direct concurrent operation (multichannel, multirole)

•Bluetooth® and Bluetooth low energy (WL183xMOD only)

–Bluetooth 5.1 secure connection compliant and CSA2 support (declaration ID: D032799)

–Host controller interface (HCI) transport for Bluetooth over UART

–Dedicated audio processor support of SBC encoding + A2DP

–Dual-mode Bluetooth and Bluetooth low energy

–TI's Bluetooth and Bluetooth low energy certified stack

•Key benefits

–Reduces design overhead

–Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other WiFi devices on different RF channel (Wi-Fi networks)

–Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna

–Different provisioning methods for in-home devices connectivity to Wi-Fi in one step

–Lowest Wi-Fi power consumption in connected idle (< 800 µA)

–Configurable wake on WLAN filters to only wake up the system

–Wi-Fi and Bluetooth single antenna coexistence

2 Applications

•Internet of things (IoT)

•Multimedia

•Home electronics

•Home appliances and white goods

•Industrial and home automation

•Smart gateway and metering

•Video conferencing

•Video camera and security

3 Description

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux® and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

Device Information(1)

PART NUMBER	PACKAGE	BODY SIZE
WL1801MOD	QFM (100)	13.3 mm × 13.4 mm × 2 mm
WL1805MOD	QFM (100)	13.3 mm × 13.4 mm × 2 mm
WL1831MOD	QFM (100)	13.3 mm × 13.4 mm × 2 mm
WL1835MOD	QFM (100)	13.3 mm × 13.4 mm × 2 mm

(1)For more information, see Section 12.

An©IMPORTANT2021 Texas InstrumentsNOTICEIncorporatedthe end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,	1
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intellectual property matters and other important disclaimers. PRODUCTION DATA.

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4 Functional Block Diagram

Figure 4-1 shows a functional block diagram of the WL1835MOD variant.

ZigBee					RF_ANT2
COEX				BG1
Interface
BT_UART			WRF2		F
WLAN_SDIO		<![if ! IE]> <![endif]>MAC/PHY		BG2
					RF_ANT1
BT_EN			WRF1		2.4-GHz
WLAN_EN					SPDT
				BT	F
32.768 kHz		<![if ! IE]> <![endif]>MAC/PHY	BTRF
	26M XTAL
VIO
VBAT		PM

Copyright © 2017, Texas Instruments Incorporated

NOTE: Dashed lines indicate optional configurations and are not applied by default.

Figure 4-1. WL1835MOD Functional Block Diagram

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Table of Contents

1	Features............................................................................		1
2	Applications.....................................................................		1
3	Description.......................................................................		1
4	Functional Block Diagram..............................................		2
5	Revision History..............................................................		3
6 Device Comparison.........................................................			4
	6.1	Related Products........................................................	4
7	Terminal Configuration and Functions..........................		5
	7.1	Pin Attributes...............................................................	6
8	Specifications..................................................................		9
	8.1	Absolute Maximum Ratings........................................	9
	8.2	ESD Ratings...............................................................	9
	8.3	Recommended Operating Conditions.........................	9
	8.4	External Digital Slow Clock Requirements................	10
	8.5	Thermal Resistance Characteristics for MOC
	100-Pin Package.........................................................		10
	8.6	WLAN Performance: 2.4-GHz Receiver
	Characteristics.............................................................		11
	8.7	WLAN Performance: 2.4-GHz Transmitter Power....	12
	8.8	WLAN Performance: Currents..................................	13
	8.9	Bluetooth Performance: BR, EDR Receiver
	Characteristics—In-Band Signals................................		13
	8.10 Bluetooth Performance: Transmitter, BR ...............		15
	8.11 Bluetooth Performance: Transmitter, EDR..............		15
	8.12 Bluetooth Performance: Modulation, BR.................		15
	8.13 Bluetooth Performance: Modulation, EDR..............		16
	8.14 Bluetooth low energy Performance: Receiver
	Characteristics – In-Band Signals...............................		16
	8.15 Bluetooth low energy Performance: Transmitter
	Characteristics.............................................................		16

8.16		Bluetooth low energy Performance: Modulation
Characteristics.............................................................			17
8.17		Bluetooth BR and EDR Dynamic Currents.............	17
8.18		Bluetooth low energy Currents................................	17
8.19		Timing and Switching Characteristics.....................	18
9 Detailed Description......................................................			26
9.1	WLAN Features........................................................		27
9.2	Bluetooth Features....................................................		27
9.3	Bluetooth Low Energy Features................................		28
9.4	Device Certification...................................................		28
9.5	Module Markings.......................................................		30
9.6	Test Grades...............................................................		30
9.7	End Product Labeling................................................		31
9.8	Manual Information to the End User.........................		31
10 Applications, Implementation, and Layout...............			32
10.1		Application Information...........................................	32
11 Device and Documentation Support..........................			38
11.1 Device Support........................................................			38
11.2 Support Resources.................................................			41
11.3 Trademarks.............................................................			41
11.4 Electrostatic Discharge Caution..............................			41
11.5 Glossary..................................................................			41
12 Mechanical, Packaging, and Orderable
Information....................................................................			42
12.1		TI Module Mechanical Outline................................	42
12.2		Tape and Reel Information......................................	42
12.3		Packaging Information............................................	45

5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from November 1, 2017 to April 26, 2021		Page
• Updated the numbering format for tables, figures and cross-references throughout the document...................		1
•	Updated to "Bluetooth 5.1 Secure Connection..." in Section 1 ..........................................................................	1
• Updated Section 6.1, Related Products .............................................................................................................		4
• Updated "Bluetooth 4.2" to "Bluetooth 5.1" in Section 9.2 ...............................................................................		27
• Updated "Bluetooth 4.2" to "Bluetooth 5.1" in Section 9.3 ...............................................................................		28
•	Deleted the sentence that began "Moreover, the module is also Wi-Fi certified..." in the first paragraph in
	Section 9.4, Device Certification ......................................................................................................................	28

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6 Device Comparison

The TI WiLink 8 module offers four footprint-compatible 2.4-GHz variants providing stand-alone Wi-Fi and Bluetooth combo connectivity. Table 6-1 compares the features of the module variants.

Table 6-1. TI WiLink™ 8 Module Variants

FEATURE		DEVICE
	WL1835MOD	WL1831MOD		WL1805MOD	WL1801MOD
WLAN 2.4-GHz SISO(1)
WLAN 2.4-GHz MIMO(1)
WLAN 2.4-GHz MRC(1)
Bluetooth

(1)SISO: single input, single output; MIMO: multiple input, multiple output; MRC: maximum ratio combining, supported at 802.11 g/n.

6.1 Related Products

For information about other devices in this family of products or related products, see the following links.

Wireless connectivity overview	Lowest power and longest range across 14 wireless connectivity
	standards
Sub-1 GHz SimpleLink™ wireless	High performance, long range wireless and ultra-low power
MCUs	consumption
Reference Designs for WL1835MOD	Find reference designs leveraging the best in TI technology to solve
	your system-level challenges

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7 Terminal Configuration and Functions

Figure 7-1 shows the pin assignments for the 100-pin MOC package.

<![if ! IE]> <![endif]>GND

<![if ! IE]> <![endif]>GND

<![if ! IE]> <![endif]>GND

<![if ! IE]> <![endif]>EXT 32K

<![if ! IE]> <![endif]>GND

<![if ! IE]> <![endif]>VIO

<![if ! IE]> <![endif]>GND

<![if ! IE]> <![endif]>WLAN EN

<![if ! IE]> <![endif]>BT EN

<![if ! IE]> <![endif]>WL UART DBG

<![if ! IE]> <![endif]>BT UART DBG

<![if ! IE]> <![endif]>GND

<![if ! IE]> <![endif]>GND

<![if ! IE]> <![endif]>VBAT IN

<![if ! IE]> <![endif]>VBAT IN

<![if ! IE]> <![endif]>GND

<![if ! IE]> <![endif]>PIN 33 -

<![if ! IE]> <![endif]>PIN 34 -

<![if ! IE]> <![endif]>PIN 35 -

<![if ! IE]> <![endif]>PIN 36 -

<![if ! IE]> <![endif]>PIN 37 -

<![if ! IE]> <![endif]>PIN 38 -

<![if ! IE]> <![endif]>PIN 39 -

<![if ! IE]> <![endif]>PIN 40 -

<![if ! IE]> <![endif]>PIN 41 -

<![if ! IE]> <![endif]>PIN 42 -

<![if ! IE]> <![endif]>PIN 43 -

<![if ! IE]> <![endif]>PIN 44 -

<![if ! IE]> <![endif]>PIN 45 -

<![if ! IE]> <![endif]>PIN 46 -

<![if ! IE]> <![endif]>PIN 47 -

<![if ! IE]> <![endif]>PIN 48 -

										PIN 49 - GND
PIN 32 - RF_ANT1										PIN 50 - BT_HCI_RTS
PIN 31 - GND	GND	GND	GND		GND	GND		GND		PIN 51 - BT_HCI_CTS
PIN 30 - GND										PIN 52 - BT_HCI_TX
PIN 29 - GND	GND	GND	GND		GND	GND		GND		PIN 53 - BT_HCI_RX
PIN 28 - GND										PIN 54 - GND
PIN 27 - GPIO1	GND	GND	GND		GND	GND		GND		PIN 55 - GND
PIN 26 - GPIO2										PIN 56 - BT_AUD_IN
PIN 25 - GPIO4										PIN 57 - BT_AUD_OUT
PIN 24 - GND					GND					PIN 58 - BT_AUD_FSYNC
PIN 23 - GND	GND	GND	GND			GND		GND		PIN 59 - GND
PIN 22 - RESERVED2										PIN 60 - BT_AUD_CLK
PIN 21 - RESERVED1	GND	GND	GND		GND	GND		GND		PIN 61 - GND
PIN 20 - GND										PIN 62 - RESERVED3
PIN 19 - GND	GND	GND	GND		GND	GND		GND		PIN 63 - GND
PIN 18 - RF_ANT2										PIN 64 - GND
PIN 17 - GND
										PIN 2 INDICATOR
<![if ! IE]> <![endif]>PIN 16 - GND	<![if ! IE]> <![endif]>PIN 15 - GND PIN 14 - WLAN IRQ	<![if ! IE]> <![endif]>PIN 13 - WL SDIO D3 PIN 12 - WL SDIO D2	<![if ! IE]> <![endif]>PIN 11 - WL SDIO D1 PIN 10 - WL SDIO D0	<![if ! IE]> <![endif]>PIN 9 - GND	<![if ! IE]> <![endif]>PIN 8 - WL SDIO CLK PIN 7 - GND	<![if ! IE]> <![endif]>PIN 6 - WL SDIO CMD	<![if ! IE]> <![endif]>PIN 5 - GPIO12	<![if ! IE]> <![endif]>PIN 4 - GPIO10 PIN 3 - GPIO9	<![if ! IE]> <![endif]>PIN 2 - GPIO11	<![if ! IE]> <![endif]>PIN 1 - GND

Figure 7-1. 100-Pin MOC Package (Bottom View)

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7.1 Pin Attributes

Table 7-1 describes the module pins.

Table 7-1. Pin Attributes

PIN

TYPE/

SHUTDOWN

AFTER

VOLTAGE

CONNECTIVITY(2)

DESCRIPTION(3)

PIN NAME

POWER

NO.

DIR

STATE(1)

LEVEL

1801

1805

1831

1835

UP(1)

Clocks and Reset Signals

WLAN SDIO clock.

WL_SDIO_CLK

8

I

Hi-Z

Hi-Z

1.8 V

v

v

v

v

Must be driven by the

host.

EXT_32K

36

ANA

–

v

v

v

v

Input sleep clock:

32.768 kHz

WLAN_EN

40

I

PD

PD

1.8 V

v

v

v

v

Mode setting: high =

enable

BT_EN

41

I

PD

PD

1.8 V

x

x

v

v

Mode setting: high =

enable

Power-Management Signals

VIO_IN

38

POW

PD

PD

1.8 V

v

v

v

v

Connect to 1.8-V

external VIO

VBAT_IN

46

POW

VBAT

v

v

v

v

Power supply input, 2.9

to 4.8 V

VBAT_IN

47

POW

VBAT

v

v

v

v

Power supply input, 2.9

to 4.8 V

TI Reserved

GPIO11

2

I/O

PD

PD

1.8 V

v

v

v

v

Reserved for future

use. NC if not used.

GPIO9

3

I/O

PD

PD

1.8 V

v

v

v

v

Reserved for future

use. NC if not used.

GPIO10

4

I/O

PU

PU

1.8 V

v

v

v

v

Reserved for future

use. NC if not used.

GPIO12

5

I/O

PU

PU

1.8 V

v

v

v

v

Reserved for future

use. NC if not used.

RESERVED1

21

I

PD

PD

1.8 V

x

x

x

x

Reserved for future

use. NC if not used.

RESERVED2

22

I

PD

PD

1.8 V

x

x

x

x

Reserved for future

use. NC if not used.

GPIO4

25

I/O

PD

PD

1.8 V

v

v

v

v

Reserved for future

use. NC if not used.

RESERVED3

62

O

PD

PD

1.8 V

x

x

x

x

Reserved for future

use. NC if not used.

WLAN Functional Block: Int Signals

WL_SDIO_CMD_1V8

6

I/O

Hi-Z

Hi-Z

1.8 V

v

v

v

v

WLAN SDIO command

WL_SDIO_D0_1V8

10

I/O

Hi-Z

Hi-Z

1.8 V

v

v

v

v

WLAN SDIO data bit 0

WL_SDIO_D1_1V8

11

I/O

Hi-Z

Hi-Z

1.8 V

v

v

v

v

WLAN SDIO data bit 1

WL_SDIO_D2_1V8

12

I/O

Hi-Z

Hi-Z

1.8 V

v

v

v

v

WLAN SDIO data bit 2

WLAN SDIO data bit

3. Changes state to

PU at WL_EN or

WL_SDIO_D3_1V8

13

I/O

Hi-Z

PU

1.8 V

v

v

v

v

BT_EN assertion for

card detects. Later

disabled by software

during initialization.

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Table 7-1. Pin Attributes (continued)

		PIN	TYPE/	SHUTDOWN	AFTER	VOLTAGE	CONNECTIVITY(2)				DESCRIPTION(3)
	PIN NAME				POWER
		NO.	DIR	STATE(1)		LEVEL	1801	1805	1831	1835
					UP(1)
											WLAN SDIO out-of-
											band interrupt line.
											Set to rising edge
											(active high) by
											default. (To extract
	WL_IRQ_1V8	14	O	PD	0	1.8 V	v	v	v	v	the debug option
											WL_RS232_TX/RX
											interface out, pull up
											the IRQ line at power
											up before applying
											enable.)
											2.4-GHz ANT2 TX, RX;
	RF_ANT2	18	ANA			–	x	v	x	v	2.4-GHz secondary
											antenna MRC/MIMO
											only.
											WL_RS232_RX (when
	GPIO2	26	I/O	PD	PD	1.8 V	v	v	v	v	WLAN_IRQ = 1 at
											power up)
											WL_RS232_TX (when
	GPIO1	27	I/O	PD	PD	1.8 V	v	v	v	v	WLAN_IRQ = 1 at
											power up)
											2.4-GHz WLAN
	RF_ANT1	32	ANA			–	v	v	v	v	main antenna SISO,
											Bluetooth
	WL_UART_DBG	42	O	PU	PU	1.8 V	v	v	v	v	Option: WLAN logger
	Bluetooth Functional Block: Int Signals
	BT_UART_DBG	43	O	PU	PU	1.8 V	x	x	v	v	Option: Bluetooth
											logger
	BT_HCI_RTS_1V8	50	O	PU	PU	1.8 V	x	x	v	v	UART RTS to host. NC
											if not used.
	BT_HCI_CTS_1V8	51	I	PU	PU	1.8 V	x	x	v	v	UART CTS from host.
											NC if not used.
	BT_HCI_TX_1V8	52	O	PU	PU	1.8 V	x	x	v	v	UART TX to host. NC if
											not used.
	BT_HCI_RX_1V8	53	I	PU	PU	1.8 V	x	x	v	v	UART RX from host.
											NC if not used.
											Bluetooth PCM/I2S
	BT_AUD_IN	56	I	PD	PD	1.8 V	x	x	v	v	bus. Data in. NC if not
											used.
											Bluetooth PCM/I2S
	BT_AUD_OUT	57	O	PD	PD	1.8 V	x	x	v	v	bus. Data out. NC if not
											used.
											Bluetooth PCM/I2S
	BT_AUD_FSYNC	58	I/O	PD	PD	1.8 V	x	x	v	v	bus. Frame sync. NC if
											not used.
	BT_AUD_CLK	60	I/O	PD	PD	1.8 V	x	x	v	v	Bluetooth PCM/I2S
											bus. NC if not used.

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Table 7-1. Pin Attributes (continued)

		PIN	TYPE/	SHUTDOWN	AFTER	VOLTAGE	CONNECTIVITY(2)				DESCRIPTION(3)
	PIN NAME				POWER
		NO.	DIR	STATE(1)		LEVEL	1801	1805	1831	1835
					UP(1)
	Ground Pins
	GND	1	GND			–	v	v	v	v
	GND	7	GND			–	v	v	v	v
	GND	9	GND			–	v	v	v	v
	GND	15	GND			–	v	v	v	v
	GND	16	GND			–	v	v	v	v
	GND	17	GND			–	v	v	v	v
	GND	19	GND			–	v	v	v	v
	GND	20	GND			–	v	v	v	v
	GND	23	GND			–	v	v	v	v
	GND	24	GND			–	v	v	v	v
	GND	28	GND			–	v	v	v	v
	GND	29	GND			–	v	v	v	v
	GND	30	GND			–	v	v	v	v
	GND	31	GND			–	v	v	v	v
	GND	33	GND			–	v	v	v	v
	GND	34	GND			–	v	v	v	v
	GND	35	GND			–	v	v	v	v
	GND	37	GND			–	v	v	v	v
	GND	39	GND			–	v	v	v	v
	GND	44	GND			–	v	v	v	v
	GND	45	GND			–	v	v	v	v
	GND	48	GND			–	v	v	v	v
	GND	49	GND			–	v	v	v	v
	GND	54	GND			–	v	v	v	v
	GND	55	GND			–	v	v	v	v
	GND	59	GND			–	v	v	v	v
	GND	61	GND			–	v	v	v	v
	GND	63	GND			–	v	v	v	v
	GND	64	GND			–	v	v	v	v
	GND	G1 –	GND			–	v	v	v	v
		G36

(1)PU = pullup; PD = pulldown; Hi-Z = high-impedance

(2)v = connect; x = no connect

(3)Host must provide PU using a 10-kΩ resistor for all non-CLK SDIO signals.

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8 Specifications

All specifications are measured at the module pins using the TI WL1835MODCOM8 evaluation board. All measurements are performed with VBAT = 3.7 V, VIO = 1.8 V, 25°C for typical values with matched RF antennas, unless otherwise indicated.

Note

For level-shifting I/Os with the TI WL18x5MOD, see the Level Shifting WL18xx I/Os application report.

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

	MIN	MAX	UNIT
VBAT		4.8(2)	V
VIO	–0.5	2.1	V
Input voltage to analog pins	–0.5	2.1	V
Input voltage limits (CLK_IN)	–0.5	VDD_IO	V
Input voltage to all other pins	–0.5	(VDD_IO + 0.5 V)	V
Operating ambient temperature	–20	70 (3)	°C
Storage temperature, Tstg	–40	85	°C

(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)4.8 V cumulative to 2.33 years, including charging dips and peaks

(3)In the WL18xx system, a control mechanism exists to ensure Tj < 125°C. When Tj approaches this threshold, the control mechanism manages the transmitter patterns.

8.2ESD Ratings

				VALUE	UNIT
	V(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)	±1000	V
			Charged device model (CDM), per JEDEC specification JESD22-C101(2)	±250

(1)JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

				MIN	TYP	MAX	UNIT
	VBAT (1)	DC supply range for all modes		2.9	3.7	4.8	V
	VIO	1.8-V I/O ring power supply voltage		1.62	1.8	1.95	V
	VIH	I/O high-level input voltage		0.65 × VDD_IO		VDD_IO	V
	VIL	I/O low-level input voltage		0		0.35 × VDD_IO	V
	VIH_EN	Enable inputs high-level input voltage		1.365		VDD_IO	V
	VIL_EN	Enable inputs low-level input voltage		0		0.4	V
	VOH	High-level output voltage	At 4 mA	VDD_IO –0.45		VDD_IO	V
	VOL	Low-level output voltage	At 4 mA	0		0.45	V
	Tr,Tf	Input transitions time Tr,Tf from 10% to 90% (digital I/O)(2)		1		10	ns
	Tr	Output rise time from 10% to 90% (digital pins)(2)	CL < 25 pF			5.3	ns
	Tf	Output fall time from 10% to 90% (digital pins)(2)	CL < 25 pF			4.9	ns
		Ambient operating temperature		–20		70	°C
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over operating free-air temperature range (unless otherwise noted)

		MIN	TYP	MAX	UNIT
Maximum	WLAN operation			2.8	W
power
	Bluetooth operation			0.2
dissipation

(1)4.8 V is applicable only for 2.33 years (30% of the time). Otherwise, maximum VBAT must not exceed 4.3 V.

(2)Applies to all digital lines except PCM and slow clock lines.

8.4External Digital Slow Clock Requirements

The supported digital slow clock is 32.768 kHz digital (square wave). All core functions share a single input.

		CONDITION	MIN	TYP	MAX	UNIT
	Input slow clock frequency			32768		Hz
	Input slow clock accuracy (initial,	WLAN, Bluetooth			±250	ppm
	temperature, and aging)
Tr, Tf	Input transition time (10% to 90%)				200	ns
	Frequency input duty cycle		15%	50%	85%
VIH, VIL	Input voltage limits	Square wave,	0.65 x VDD_IO		VDD_IO	Vpeak
		DC coupled	0		0.35 x VDD_IO
	Input impedance		1			MΩ
	Input capacitance				5	pF

8.5 Thermal Resistance Characteristics for MOC 100-Pin Package

THERMAL METRICS(1)		(°C/W)(2)
θJA	Junction to free air(3)	16.6
θJB	Junction to board	6.06
θJC	Junction to case(4)	5.13

(1)For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application Report.

(2)These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:

•JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70°C is assumed.

(3)According to the JEDEC EIA/JESD 51 document

(4)Modeled using the JEDEC 2s2p thermal test board with 36 thermal vias

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8.6 WLAN Performance: 2.4-GHz Receiver Characteristics

over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin.

PARAMETER	CONDITION		MIN	TYP	MAX	UNIT
	RF_ANT1 pin 2.4-GHz SISO
Operation frequency range			2412		2484	MHz
	1 Mbps DSSS			–96.3
	2 Mbps DSSS			–93.2
	5.5 Mbps CCK			–90.6
	11 Mbps CCK			–87.9
	6 Mbps OFDM			–92.0
	9 Mbps OFDM			–90.4
	12 Mbps OFDM			–89.5
	18 Mbps OFDM			–87.2
	24 Mbps OFDM			–84.1
	36 Mbps OFDM			–80.7
	48 Mbps OFDM			–76.5
	54 Mbps OFDM			–74.9
	MCS0 MM 4K			–90.4
Sensitivity: 20-MHz bandwidth. At < 10% PER limit	MCS1 MM 4K			–87.6		dBm
	MCS2 MM 4K			–85.9
	MCS3 MM 4K			–82.8
	MCS4 MM 4K			–79.4
	MCS5 MM 4K			–75.2
	MCS6 MM 4K			–73.5
	MCS7 MM 4K			–72.4
	MCS0 MM 4K 40 MHz			–86.7
	MCS7 MM 4K 40 MHz			–67.0
	MCS0 MM 4K MRC			–92.7
	MCS7 MM 4K MRC			–75.2
	MCS13 MM 4K			–73.7
	MCS14 MM 4K			–72.3
	MCS15 MM 4K			–71.0
	OFDM		–20.0	–10.0
Maximum input level	CCK		–10.0	–6.0		dBm
	DSSS		–4.0	–1.0
Adjacent channel rejection: Sensitivity level +3 dB for	2 Mbps DSSS		42.0
	11 Mbps CCK		38.0			dB
OFDM; Sensitivity level +6 dB for 11b
	54 Mbps OFDM		2.0

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8.7 WLAN Performance: 2.4-GHz Transmitter Power

over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin.

PARAMETER	CONDITION(1)	MIN	TYP		MAX	UNIT
		RF_ANT1 Pin 2.4-GHz SISO
	1 Mbps DSSS		17.3
	2 Mbps DSSS		17.3
	5.5 Mbps CCK		17.3
	11 Mbps CCK		17.3
	6 Mbps OFDM		17.1
	9 Mbps OFDM		17.1
	12 Mbps OFDM		17.1
	18 Mbps OFDM		17.1
	24 Mbps OFDM		16.2
	36 Mbps OFDM		15.3
	48 Mbps OFDM		14.6			dBm
	54 Mbps OFDM		13.8
Output Power: Maximum RMS output power measured	MCS0 MM		16.1
	MCS1 MM		16.1
at 1 dB from IEEE spectral mask or EVM(2)
	MCS2 MM		16.1
	MCS3 MM		16.1
	MCS4 MM		15.3
	MCS5 MM		14.6
	MCS6 MM		13.8
	MCS7 MM(3)		12.6
	MCS0 MM 40 MHz		14.8
	MCS7 MM 40 MHz		11.3
		RF_ANT1 + RF_ANT2
	MCS12 (WL18x5)		18.5
	MCS13 (WL18x5)		17.4			dBm
	MCS14 (WL18x5)		14.5
	MCS15 (WL18x5)		13.4
		RF_ANT1 + RF_ANT2
Operation frequency range		2412			2484	MHz
Return loss			–10.0			dB
Reference input impedance			50.0			Ω

(1)Maximum transmitter power (TP) degradation of up to 30% is expected, starting from 80°C ambient temperature on MIMO operation

(2)Regulatory constraints limit TI module output power to the following:

•Channel 14 is used only in Japan; to keep the channel spectral shaping requirement, the power is limited: 14.5 dBm.

•Channels 1, 11 at OFDM legacy and HT 20-MHz rates: 12 dBm

•Channels 1, 11 at HT 40-MHz rates: 10 dBm

•Channel 7 at HT 40-MHz lower rates: 10 dBm

•Channel 5 at HT 40-MHz upper rates: 10 dBm

•All 11B rates are limited to 16 dBm to comply with the ETSI PSD 10 dBm/MHz limit.

•All OFDM rates are limited to 16.5 dBm to comply with the ETSI EIRP 20 dBm limit.

•For clarification regarding power limitation, see the WL18xx .INI File Application Report.

(3)To ensure compliance with the EVM conditions specified in the PHY chapter of IEEE Std 802.11™ – 2012:

•MCS7 20 MHz channel 12 output power is 2 dB lower than the typical value.

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•MCS7 20 MHz channel 8 output power is 1 dB lower than the typical value.

8.8WLAN Performance: Currents

over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin.

	PARAMETER	SPECIFICATION	TYP (AVG) –25°C	UNIT
		Low-power mode (LPM) 2.4-GHz RX SISO20 single chain	49
		2.4 GHz RX search SISO20	54
		2.4-GHz RX search MIMO20	74
		2.4-GHz RX search SISO40	59
		2.4-GHz RX 20 M SISO 11 CCK	56
	Receiver	2.4-GHz RX 20 M SISO 6 OFDM	61	mA
		2.4-GHz RX 20 M SISO MCS7	65
		2.4-GHz RX 20 M MRC 1 DSSS	74
		2.4-GHz RX 20 M MRC 6 OFDM	81
		2.4-GHz RX 20 M MRC 54 OFDM	85
		2.4-GHz RX 40-MHz MCS7	77
		2.4-GHz TX 20 M SISO 6 OFDM 15.4 dBm	285
		2.4-GHz TX 20 M SISO 11 CCK 15.4 dBm	273
	Transmitter	2.4-GHz TX 20 M SISO 54 OFDM 12.7 dBm	247	mA
		2.4-GHz TX 20 M SISO MCS7 11.2 dBm	238
		2.4-GHz TX 20 M MIMO MCS15 11.2 dBm	420
		2.4-GHz TX 40 M SISO MCS7 8.2 dBm	243

8.9 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals

over operating free-air temperature range (unless otherwise noted)

PARAMETER(1) (2)	CONDITION	MIN	TYP	MAX	UNIT
Bluetooth BR, EDR operation		2402		2480	MHz
frequency range
Bluetooth BR, EDR channel			1		MHz
spacing
Bluetooth BR, EDR input			50		Ω
impedance
Bluetooth BR, EDR	BR, BER = 0.1%		–92.2
sensitivity(2)
	EDR2, BER = 0.01%		–91.7		dBm
Dirty TX on
	EDR3, BER = 0.01%		–84.7
Bluetooth EDR BER floor at	EDR2	1e-6
sensitivity + 10 dB
Dirty TX off (for 1,600,000	EDR3	1e-6
bits)
Bluetooth BR, EDR maximum	BR, BER = 0.1%	–5.0
usable input power
	EDR2, BER = 0.1%	–15.0			dBm
	EDR3, BER = 0.1%	–15.0
Bluetooth BR intermodulation	Level of interferers for n = 3, 4, and 5	–36.0	–30.0		dBm

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over operating free-air temperature range (unless otherwise noted)

PARAMETER(1) (2)	CONDITION		MIN	TYP	MAX	UNIT
	BR, co-channel				10
	EDR, co-channel	EDR2			12
		EDR3			20
	BR, adjacent ±1 MHz				–3.0
Bluetooth BR, EDR C/I	EDR, adjacent ±1 MHz,	EDR2			–3.0
	(image)
		EDR3			2.0
performance
Numbers show wanted	BR, adjacent +2 MHz				–33.0
signal-to-interfering-signal
	EDR, adjacent +2 MHz	EDR2			–33.0		dB
ratio. Smaller numbers
indicate better C/I		EDR3			–28.0
performances (Image
	BR, adjacent –2 MHz				–20.0
frequency = –1 MHz)
	EDR, adjacent –2 MHz	EDR2			–20.0
		EDR3			–13.0
	BR, adjacent ≥Ι±3Ι MHz				–42.0
	EDR, adjacent ≥Ι±3Ι MHz	EDR2			–42.0
		EDR3			–36.0
Bluetooth BR, EDR RF return				–10.0			dB
loss

(1)All RF and performance numbers are aligned to the module pin.

(2)Sensitivity degradation up to –3 dB may occur due to fast clock harmonics with dirty TX on.

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8.10 Bluetooth Performance: Transmitter, BR

over operating free-air temperature range (unless otherwise noted)

PARAMETER(1)			MIN	TYP	MAX	UNIT
BR RF output power(2)		VBAT ≥ 3 V(3)		11.7		dBm
		VBAT < 3 V(3)		7.2
BR gain control range				30.0		dB
BR power control step				5.0		dB
BR adjacent channel power |M-N| = 2				–43.0		dBm
BR adjacent channel power |M-N| > 2				–48.0		dBm

(1)All RF and performance numbers are aligned to the module pin.

(2)Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command.

(3)VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%.

8.11Bluetooth Performance: Transmitter, EDR

over operating free-air temperature range (unless otherwise noted)

PARAMETER(1)			MIN	TYP	MAX	UNIT
EDR output power(2)		VBAT ≥ 3 V(3)		7.2		dBm
		VBAT < 3 V(3)		5.2
EDR gain control range				30		dB
EDR power control step				5		dB
EDR adjacent channel power |M-N| = 1				–36		dBc
EDR adjacent channel power |M-N| = 2				–30		dBm
EDR adjacent channel power |M-N| > 2				–42		dBm

(1)All RF and performance numbers are aligned to the module pin.

(2)Values reflect default maximum power. Maximum power can be changed using a VS command.

(3)VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%.

8.12Bluetooth Performance: Modulation, BR

over operating free-air temperature range (unless otherwise noted)

CHARACTERISTICS(1)	CONDITION(2)		MIN	TYP	MAX	UNIT
BR –20-dB bandwidth				925	995	kHz
	∆f1avg	Mod data = 4 1s, 4 0s:	145	160	170	kHz
		111100001111...
BR modulation characteristics	∆f2max ≥ limit for	Mod data = 1010101...	120	130		kHz
	at least 99.9% of all
	Δf2max
	∆f2avg, ∆f1avg		85%	88%
BR carrier frequency drift	One-slot packet		–25		25	kHz
	Threeand five-slot		–35		35	kHz
	packet
BR drift rate	lfk+5 – fkl , k = 0 to max				15	kHz/50 µs
BR initial carrier frequency tolerance(3)	f0–fTX		±75		±75	kHz

(1)All RF and performance numbers are aligned to the module pin.

(2)Performance values reflect maximum power.

(3)Numbers include XTAL frequency drift over temperature and aging.

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