SGS Thomson Microelectronics ST72F321AR9, ST72F321AR7, ST72F321AR6, ST72F321R9, ST72F321R7 Datasheet

...

0 (0)

Rev. 1.9

August 2003 1/185

ST72321

8-BIT MCU WITH NESTED INTERRUPTS, FLASH, 10-BIT ADC ,

FIVE TIMERS, SPI, SCI, I

C INTERFACE

■ Memories

– 32K to 60K dual voltage High De nsity Flash

(HDFlash) or ROM with read-out protection capability. In-Application Programming and

In-Circuit Programming for HDFlash devices – 1K to 2K RAM – HDFlash endurance: 100 cycles, data reten-

tion: 20 years at 55°C

■ Clock , Res et And Supp ly M a nagement

– Enhanced low voltage supervisor (LVD) for

main supply and auxiliary voltage detector

(AVD) with interrupt capability – Clock sources: crystal/ceramic res onator os-

cillators , internal RC osci llator, clock secu rity

system and bypass for external clock – PLL for 2x frequency multiplication – Four Power Saving Modes: Halt, Active-Halt,

Wait and Slow

■ Interrupt Management

– Nested interrupt controller – 14 interrupt vectors plus TRAP and RESET – Top Level Interrupt (TLI) pin on 64-pin devices – 15 external interrupt lines (on 4 vectors)

■ Up to 48 I/O Ports

– 48/32 multifunctional bidirectional I/O lines – 34/22 alternate function lines – 16/12 high sink outputs

■ 5 Timers

– Main Clock Controller with: Real time base,

Beep and Clock-out capab ilities – Configurable watchdog timer – Two 16-bit timers with: 2 input captures, 2 out-

put compares, external clock input on one tim-

er, PWM and pulse generator modes – 8-bit PWM Auto-reload timer with: 2 input cap-

tures, 4 PWM outputs, output compare and

time base interrupt, external clock with event detector

■ 3 Communications Interfaces

– SPI synchronous serial interface – SCI asynchronous serial interface (LIN com-

patible)

–I

C multimaster interface

■ 1 Analog peripheral

– 10-bit ADC with up to 16 input pins

■ Instruction Set

– 8-bit Data Manipulation – 63 Basic Instructions – 17 main Addressing Modes – 8 x 8 Unsigned Multiply Instruction

■ Development Tools

– Full hardware/software development package – In-Circuit Testing capability

Device Summary

TQFP64

10 x 10

TQFP64

14 x 14

Features ST72321(R/AR/J)9 ST72321(R/AR/J)7 ST72321(R/AR)6

Program memory - byte s 60K 48K 32K RAM (stack) - bytes 2048 (256) 1536 (256) 1024 (256) Operat ing Voltage 3.8V to 5.5V Temp. Range up to -40°C to +125°C Package TQFP64 14x14 (R), TQFP64 10x10 (AR), TQ F P 44 10x10 (J)

Table of Cont ents

185

2/185

1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 REGISTER & MEMORY MAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4 FLASH PROGRAM MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.3 STRUCTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.3.1 Read-out Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.4 ICC INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

4.5 ICP (IN-CIRCUIT PROGRAMMING) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

4.6 IAP (IN-APPLICATION PROGRAMMING) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

4.7 RELATED DOCUMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

4.7.1 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

5 CENTRAL PROCESSING UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.2 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.3 CPU REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

6 SUPPLY, RESET AND CLOCK MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

6.1 PHASE LOCKED LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

6.2 MULTI-OSCILLATOR (MO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

6.3 RESET SEQUENCE MANAGER (RSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

6.3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

6.3.2 As ynchronous External RES ET pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

6.3.3 External Power-On RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

6.3.4 Internal Low Voltage Detector (LVD) RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

6.3.5 Inte rnal Watchdog RE SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

6.4 SYSTEM INTEGRITY MANAGEMENT (SI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

6.4.1 Low Voltage Detector (LVD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

6.4.2 Aux iliary Voltage Detector (AVD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

6.4.3 Clock Security System (CSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

6.4.4 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

6.4.5 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

7 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

7.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

7.2 MASKING AND PROCESSING FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

7.3 INTERRUPTS AND LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

7.4 CONCURRENT & NESTED MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

7.5 INTERRUPT REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

7.6 EXTERNAL INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

7.6.1 I/O Port Interrupt Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

7.7 EXTERNAL INTERRUPT CONTROL REGISTER (EICR) . . . . . . . . . . . . . . . . . . . . . . . 39

8 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

8.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

8.2 SLOW MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

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3/185

8.3 WAIT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

8.4 ACTIVE-HALT AND HALT MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

8.4.1 ACTIVE-HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

8.4.2 HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

9 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

9.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

9.2 FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

9.2.1 I nput Mode s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

9.2.2 Output Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

9.2.3 Alternate Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

9.3 I/O PORT IMPLEMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

9.4 LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

9.5 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

9.5.1 I/O Port Implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

10 ON-CHIP PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

10.1 WATCHDOG TIMER (WDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

10.1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

10.1.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

10.1.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

10.1.4 How to Program the Watchdog Timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

10.1.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

10.1.6 Hardware Watchdog Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

10.1.7 Using Halt Mode with the WDG (WDGHALT option) . . . . . . . . . . . . . . . . . . . . . . . 55

10.1.8 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

10.1.9 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

10.2 MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK AND BEEPER (MCC/RTC) . 57

10.2.1 Programmable CPU Clock Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

10.2.2 Clock-out Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

10.2.3 Real Time Clock Timer (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

10.2.4 Beeper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

10.2.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

10.2.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

10.2.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

10.3 PWM AUTO-RELOAD TIMER (ART) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

10.3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

10.3.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

10.3.3 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65

10.4 16-BIT TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

10.4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

10.4.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

10.4.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

10.4.4 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

10.4.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

10.4.6 Summary of Timer modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

10.4.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

10.5 SERIAL PERIPHERAL INTERFACE (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

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10.5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

10.5.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

10.5.3 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

10.5.4 Clock Phase and Clock Polarity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

10.5.5 Error Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

10.5.6 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

10.5.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

10.5.8 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

10.6 SERIAL COMMUNICATIONS INTERFACE (SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

10.6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

10.6.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

10.6.3 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

10.6.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

10.6.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

10.6.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

10.6.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

10.7 I2C BUS INTERFACE (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

10.7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

10.7.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

10.7.3 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113

10.7.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

10.7.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

10.7.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

10.7.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

10.8 10-BIT A/D CONVERTER (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

10.8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

10.8.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126

10.8.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

10.8.4 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

10.8.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

10.8.6 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128

11 INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

11.1 CPU ADDRESSING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

11.1.1 Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

11.1.2 Immediate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

11.1.3 Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

11.1.4 Indexed (No Offset, Short, Long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

11.1.5 Indirect (Short, Long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

11.1.6 Indirect Indexed (Short, Long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

11.1.7 Relative mode (Direct, Indirect) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

11.2 INSTRUCTION GROUPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

12 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

12.1 PARAMETER CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

12.1.1 Minimum and Maximum v alues . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

12.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

12.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

12.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

12.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

Table of Cont ents

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12.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

12.2.1 Voltage Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

12.2.2 Current Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

12.2.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

12.3 OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

12.3.1 General Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

12.3.2 Operating Conditions with Low Voltage Detector (LVD) . . . . . . . . . . . . . . . . . . . . 139

12.3.3 Auxiliary Voltage Detector (AVD) Thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

12.3.4 External Voltage Detector (EVD) Thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

12.4 SUPPLY CURRENT CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

12.4.1 RUN and SLOW Modes (Flash devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141

12.4.2 WAIT and SLOW WAIT Modes (Flash devices) . . . . . . . . . . . . . . . . . . . . . . . . . . 142

12.4.3 RUN and SLOW Modes (ROM devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143

12.4.4 WAIT and SLOW WAIT Modes (ROM devices) . . . . . . . . . . . . . . . . . . . . . . . . . . 143

12.4.5 HALT and ACTIVE-HALT Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144

12.4.6 Supply and Clock Managers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144

12.4.7 On-Chip Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145

12.5 CLOCK AND TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146

12.5.1 General Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146

12.5.2 External Clock Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146

12.5.3 Crystal and Ceramic Resonat or Os cillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147

12.5.4 RC Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149

12.5.5 Clock Security System (CSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150

12.5.6 PLL Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150

12.6 MEMORY CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

12.6.1 RAM and Hardware Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

12.6.2 FLASH Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

12.7 EMC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

12.7.1 Functional EMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

12.7.2 Electro Magnetic Interference (EMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

12.7.3 Absolute Electrical Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153

12.7.4 ESD Pin Protection Strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155

12.8 I/O PORT PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157

12.8.1 General Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157

12.8.2 Output Driving Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158

12.9 CONTROL PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160

12.9.1 Asynchronous RESET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160

12.9.2 ICCSEL/VPP Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

12.10 TIMER PERIPHERAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

12.10.18-Bit PWM-ART A uto-R eload Time r . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

12.10.216-Bit Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161

12.11 COMMUNICATION INTERFACE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . 162

12.11.1SPI - Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162

12.11.2I2C - Inter IC Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164

12.12 10-BIT ADC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165

12.12.1Analog Power Supply and Reference Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166

12.12.2General PCB Design Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166

Table of Cont ents

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12.12.3ADC Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167

13 PACKAGE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168

13.1 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168

13.2 THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170

13.3 SOLDERING AND GLUEABILITY INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171

14 ST72321 DEVICE CONFIGURATION AND ORDERING INFORMATION . . . . . . . . . . . . . . . 172

14.1 FLASH OPTION BYTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172

14.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE . . . . 174

14.2.1 Version-Specific Sales Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175

14.3 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177

14.3.1 Socket and Emulator Adapter Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177

14.4 ST7 APPLICATION NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178

15 IMPORTANT NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

15.1 SILICON IDENTIFICATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

15.2 ALL FLASH AND ROM DEVICES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

15.2.1 External RC option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

15.2.2 CSS Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

15.2.3 Safe Connection of OSC1/OSC2 P ins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

15.2.4 Unexpected Reset Fetch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

15.2.5 Internal RC Oscillator with LVD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

15.2.6 Read-out protection with LVD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

15.2.7 16-bit Timer PWM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180

15.3 FLASH REV “S” AND ALL ROM DEVICES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181

15.3.1 External clock source with PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181

15.3.2 LVD Startup behaviour . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181

15.4 FLASH REV “S” AND ROM REV “Y” DEVICES ONLY . . . . . . . . . . . . . . . . . . . . . . . . . 182

15.4.1 I/O Port D Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182

15.5 ALL ROM DEVICES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182

15.5.1 LVD Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182

15.5.2 AVD not supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182

15.5.3 Internal RC oscillator operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182

16 SUMMARY OF CHANGES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184

To obtain the most recent version of this datasheet,

please check at www.st.com>products>technical literature>datasheet. Please also pay special attention to the Section “IMPORTANT NOTES” on page 180

ST72321

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1 INTRODUCTION

The ST72321R, ST72321AR and ST72321J devices are members of the ST7 microcontroller family designed for mid-range applications

All devices are based on a common industrystandard 8-bit core, featuring an enhanced instruction set and are available with FLASH or ROM program memory.

Under software control, all devices c an be place d in WAIT, SLOW, ACTIVE-HALT or HALT mode,

reducing power consumption when the application is in idle or stand-by state.

The enhanced instruction set and addressing modes of the ST7 offer both power and flexibility to software developers, enabling the design of highly efficient and compact application code. In addition to standard 8-bit data management, all ST7 microcontrollers feature true bit manipulation, 8x8 unsigned multiplication and indirect addressing modes.

Figure 1. Device Block Diagram

8-BI T CO RE

ALU

ADDRESS AND DATA BUS

OSC1

CONTROL

PROGRAM

(16K - 60K B ytes)

RESET

PORT F

PF7:0

(8-bits )

TIM E R A

BEEP

PORT A

RAM

(512 - 2048 Bytes)

PORT C

10-BIT ADC

AREF

SSA

PORT B

PB7:0

(8-bits)

PWM ART

PORT E

PE7:0 (8-bits)

SCI

TIMER B

PA7:0

(8-bits)

PORT D

PD7:0

(8-bits)

SPI

PC7:0

(8-bits)

WATCHDOG

TLI

OSC

LVD

OSC2

MEMORY

MCC/RTC/BEEP

EVD

AVD

I2C

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2 PIN DESCRIPTION

Figure 2. 64-Pin TQFP 14x14 and 10x10 Package Pinout

AREF

SSA

DD_3

SS_3

MCO / AIN8 / PF0

BEEP / (HS) PF1

(HS) PF2

OCMP2_A / AIN9 / PF3

OCMP1_A / AIN10 / PF4

ICAP2_A / AIN11 / PF5

ICAP1_A / (HS) PF6

EXTCLK_A / (HS) PF7

AIN4 / PD4

AIN5 / PD5

AIN6 / PD6

AIN7 / PD7

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49

47 46 45 44 43

17 18 19 20 21 22 23 24 29 30 31 3225 26 27 28

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

ei2

ei3

ei0

ei1

PWM3 / PB0 PWM2 / PB1 PWM1 / PB2

PWM0 /PB3

ARTCLK /(HS) PB4

ARTIC1 / PB5 ARTIC2 / PB6

PB7 AIN0 / PD0 AIN1 / PD1 AIN2 / PD2 AIN3 / PD3

(HS) PE4 (HS) PE5 (HS) PE6 (HS) PE7

PA1 PA0 PC7 / SS

/ AIN15

PC6 / SCK / ICCCLK PC5 / MOSI / AIN14 PC4 / MISO / ICCDATA PC3 (HS) / ICAP1_B PC2 (HS) / ICAP2_B PC1 / OCMP1_B / AIN13 PC0 / OCMP2_B / AIN12 V

SS_0

DD_0

SS_1

DD_1

PA3 (HS) PA2

OSC1

OSC2

TLI

EVD

RESET

/ ICCSEL

PA7 (HS) / SCLI

PA6 (HS) / SDAI

PA5 (HS)

PA4 (HS)

PE3

PE2

PE1 / RDI

PE0 / TDO

(HS) 20mA high sink capability eix associated external interrupt vector

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Figure 3. 44-Pin Device Pinout

MCO / AIN8 / PF0

BEEP / (HS) PF1

(HS) PF 2

OCMP1_A / AI N10 / P F4

ICAP1_A / (HS) PF6

EXTCLK_A / (HS) PF7

DD_0

SS_0

AIN5 / PD5

AREF

SSA

44 43 42 41 40 39 38 37 36 35 34

33 32 31 30 29 28 27 26 25 24 23

12 13 14 15 16 17 18 19 20 21 22

1 2 3 4 5 6 7 8 9 10 11

ei2

ei3

ei0

ei1

PWM0 / PB3

ARTCLK / (HS) PB4

AIN0 / PD0 AIN1 / PD1 AIN2 / PD2 AIN3 / PD3 AIN4 / PD4

PE1 / RDI

PWM3 /PB0 PWM2 / PB1 PWM1 / PB2

PC6 / SCK / ICCCLK PC5 / MOSI / AIN14 PC4 / MISO / ICCDATA PC3 (HS) / ICAP1_B PC2 (HS) / ICAP2_B PC1 / OCMP1_B / AIN13 PC0 / OCMP2_B / AIN12

SS_1

DD_1

PA3 (HS) PC7 / SS

/ AIN15

RESET

/ ICCSEL

PA7 (HS) / SCLI

PA6 (HS) / SDAI

PA5 (HS)

PA4 (HS)

PE0 / TDO

OSC1

OSC2

eix associated external interrupt vector

(HS) 20mA high sink capability

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PIN DESCRIPTION (Cont’d) For external pin connection guidelines, refer to See “ELECTRICAL CHARACTERISTICS” on page 136.

Legend / Abbreviations for Table 1:

Type: I = input, O = output, S = supply Input level: A = Dedicated analog input In/Output level: C = CMOS 0.3V

/0.7V

CT= CMOS 0.3VDD/0.7VDD with input trigger T

= TTL 0.8V / 2V with Schmitt trigger Output level: HS = 20mA high sink (on N-buffer only) Port and control configuration:

– Input: float = floating, wpu = weak pull-up, int = interrupt

, ana = analog

– Output: OD = open drain

, PP = push-pull Refer to “I/O PORTS” on page 46 for more details on the software configuration of the I/O ports. The RESET con fi g ur at i on of each pin i s sh o wn in bo ld. This config u ra tion is valid as long as the devi ce is

in reset state.

Table 1. Device Pin Description

Pin n°

Pin Name

Type

Level Port

Main

function

(after reset)

Alternate function

TQFP64

TQFP44

Input

Output

Input Output

float

wpu

int

ana

1 - PE4 (HS) I/O CTHS X X X X Port E4 2 - PE5 (HS) I/O C

HS X X X X Port E5

3 - PE6 (HS) I/O C

HS X X X X Port E6

4 - PE7 (HS) I/O C

HS X X X X Port E7

5 2 PB0/PWM3 I/O C

X ei2 X X Port B0 PWM Output 3

6 3 PB1/PWM2 I/O C

X ei2 X X Port B1 PWM Output 2

7 4 PB2/PWM1 I/O C

X ei2 X X Port B2 PWM Output 1

8 5 PB3/PWM0 I/O C

X ei2 X X Port B3 PWM Output 0

9 6 PB4 (HS)/ARTCLK I/O C

HS X ei3 X X Port B4 PWM-ART External Clock

10 - PB5 / ARTIC1 I/O C

X ei3 X X Port B5 PWM-ART Input Capture 1

11 - PB6 / ARTIC2 I/O C

X ei3 X X Port B6 PWM-ART Input Capture 2

12 - PB7 I/O C

X ei3 X X Port B7

13 7 PD0/AIN0 I/O C

X X X X X Port D0 ADC Analog Input 0

14 8 PD1/AIN1 I/O C

X X X X X Port D1 ADC Analog Input 1

15 9 PD2/AIN2 I/O C

X X X X X Port D2 ADC Analog Input 2

16 10 PD3/AIN3 I/O C

X X X X X Port D3 ADC Analog Input 3

17 11 PD4/AIN4 I/O C

X X X X X Port D4 ADC Analog Input 4

18 12 PD5/AIN5 I/O C

X X X X X Port D5 ADC Analog Input 5

19 - PD6/AIN6 I/O C

X X X X X Port D6 ADC Analog Input 6

20 - PD7/AIN7 I/O C

X X X X X Port D7 ADC Analog Input 7

21 13 V

AREF

I Analog Reference Voltage for ADC

22 14 V

SSA

S Analog Ground Voltage

23 - V

DD_3

S Digital Main Supply Voltage

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24 - V

SS_3

S Digital Ground Voltage

25 15 PF0/MCO/AIN8 I/O C

X ei1 X X X Port F0

Main clock out (f

OSC

/2)

ADC Analog Input 8

26 16 PF1 (HS)/BEEP I/O C

HS X ei1 X X Port F1 Beep signal output

27 17 PF2 (HS) I/O C

HS X ei1 X X Port F2

28 - PF3/OCMP2_A/AIN9 I/O C

X X X X X Port F3

Timer A Output Compare 2

ADC Analog Input 9

29 18 PF4/OCMP1_A/AIN10 I/O C

X X X X X Port F4

Timer A Output Compare 1

ADC Analog Input 10

30 - PF5/ICAP2_A/AIN11 I/O C

X X X X X Port F5

Timer A Input Capture 2

ADC Analog Input 11

31 19 PF6 (HS)/ICAP1_A I/O C

HS X X X X Port F6 Timer A Input Capture 1

32 20 PF7 (HS)/EXTCLK_A I/O C

HS X X X X Port F7

Timer A External Clock Source

33 21 V

DD_0

S Digital Main Supply Voltage

34 22 V

SS_0

S Digital Ground Voltage

35 23 PC0/OCMP2_B/AIN12 I/O C

X X X X X Port C0

Timer B Output Compare 2

ADC Analog Input 12

36 24 PC1/OCMP1_B/AIN13 I/O C

X X X X X Port C1

Timer B Output Compare 1

ADC Analog Input 13

37 25 PC2 (HS)/ICAP2_B I/O C

HS X X X X Port C2 Timer B Input Capture 2

38 26 PC3 (HS)/ICAP1_B I/O C

HS X X X X Port C3 Timer B Input Capture 1

39 27 PC4/MISO/ICCDATA I/O C

X X X X Port C4

SPI Master In / Slave Out Data

ICC Data Input

40 28 PC5/MOSI/AIN14 I/O C

X X X X X Port C5

SPI Master Out / Slave In Data

ADC Analog Input 14

PC6/SCK/ICCCLK I/O C

X X X X Port C6

SPI Serial Clock

ICC Clock Output

42 - PC7/SS

/AIN15 I/O C

X X X X X Port C7

SPI Slave Select (active low)

ADC Analog Input 15

43 - PA0 I/O C

X ei0 X X Port A0

44 - PA1 I/O C

X ei0 X X Port A1

45 31 PA2 I/O C

X ei0 X X Port A2

46 32 PA3 (HS) I/O C

HS X ei0 X X Port A3

47 33 V

DD_1

S Digital Main Supply Voltage

48 34 V

SS_1

S Digital Ground Voltage

49 35 PA4 (HS) I/O C

HS X X X X Port A4

Pin n°

Pin Name

Type

Level Port

Main

function

(after reset)

Alternate function

TQFP64

TQFP44

Input

Output

Input Output

float

wpu

int

ana

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Notes:

1. In the interrupt input column, “eiX” def ine s the associate d external in terrupt vecto r. If the weak pul l-up column (wpu) is merged with the interrupt column (int), then the I/O configuration is pull-up interrupt input, else the configuration is floating interrupt input.

2. In the open drain output column, “T” defines a true open drain I/O (P-Buffer and protection diode to V

are not implemented). See See “I/O PORTS” on page 46. and Section 12.8 I/O PORT PIN CHARACTER-

ISTICS for more details.

3. OSC1 and OSC2 pins connect a crystal/ceram ic resonator, or an external source t o the on-c hi p osc illator; see Section 1 INTRODUCTION and Section 12.5 CLOCK AND TIMING CHARACTERISTICS for more details.

4. On the chip, each I/O port has 8 pads. Pads that are not bonded to external pins are in input pull-up configuration after reset. The c onfiguration of these pads mu st be kept at reset st at e to av oi d ad ded c urrent consumption.

50 36 PA5 (HS) I/O CTHS X X X X Port A5 51 37 PA6 (HS)/SDAI I/O C

HS X T Port A6 I2C Data

52 38 PA7 (HS)/SCLI I/O CTHS X T Port A7 I2C Clock

53 39 VPP/ ICCSEL I

Must be tied low. In flash programming mode, this pin acts as the programming voltage input VPP. See Section 12.9.2 for more details. High voltage must not be applied to ROM devices

54 - RESET

I/O C

Top priority non maskable interrupt. 55 - EVD External voltage detector 56 40 TLI I C

X Top level interrupt input pin

57 41 V

SS_2

S Digital Ground Voltage

58 42 OSC2

I/O Resonator oscillator inverter output

59 43 OSC1

External clock input or Resonator oscil-

lator inverter input 60 44 V

DD_2

S Digital Main Supply Voltage

61 1 PE0/TDO I/O C

X X X X Port E0 SCI Transmit Data Out

62 - PE1/RDI I/O C

X X X X Port E1 SCI Receive Data In

63 - PE2 I/O C

X Port E2

64 - PE3 I/O C

X X X X Port E3

Pin n°

Pin Name

Type

Level Port

Main

function

(after reset)

Alternate function

TQFP64

TQFP44

Input

Output

Input Output

float

wpu

int

ana

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3 REGISTER & MEMORY MAP

As sho wn i n Figure 4, the MCU is capable of ad- dressing 64K bytes of memories and I/O registers.

The available memory locations consist of 128 bytes of register locations, up to 2Kbytes of RAM and up to 60Kbytes of user program memory. The RAM space includes u p to 256 by t es fo r the stack from 0100h to 01FFh.

The highest address bytes contain the user re set and interrupt vectors.

IMPORTANT: Memory locations marked as “Reserved” must ne ver be accessed. Accessi ng a reseved area can have u npredictable effects on t he device.

Figure 4. Me m ory M a p

0000h

RAM

Program Memory

(60K, 48K or 32K)

Interrupt & Reset Vectors

HW Registers

0080h

007Fh

0FFFh

(see Table 2)

1000h

FFDFh FFE0h

FFFFh

(see Table 7)

0880h

Reserved

087Fh

Short Addressing RAM (zero page)

256 Bytes Stack

16-bit Addressing

RAM

0100h

01FFh

0080h

0200h

00FFh

or 087Fh

32 KBytes

8000h

60 KBytes

48 KBytes

FFFFh

1000h

4000h

(2048, 1536 or 1024 By tes)

or 067F h

or 047F h

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Table 2. Hardware Register Map

Address Block

Label

Reset

Status

Remarks

0000h 0001h 0002h

Port A

PADR PADDR PAOR

Port A Data Register Port A Data Direction Register Port A Option Register

00h

00h 00h

R/W R/W R/W

0003h 0004h 0005h

Port B

PBDR PBDDR PBOR

Port B Data Register Port B Data Direction Register Port B Option Register

00h

00h 00h

R/W R/W R/W

0006h 0007h 0008h

Port C

PCDR PCDDR PCOR

Port C Data Register Port C Data Direction Register Port C Option Register

00h

00h 00h

R/W R/W R/W

0009h 000Ah 000Bh

Port D

PDDR PDDDR PDOR

Port D Data Register Port D Data Direction Register Port D Option Register

00h

00h 00h

R/W R/W R/W

000Ch 000Dh 000Eh

Port E

PEDR PEDDR PEOR

Port E Data Register Port E Data Direction Register Port E Option Register

00h

00h 00h

R/W R/W

R/W

000Fh 0010h 0011h

Port F

PFDR PFDDR PFOR

Port F Data Register Port F Data Direction Register Port F Option Register

00h

00h 00h

R/W R/W R/W

0012h

0017h

Reserved Area (6 Bytes)

0018h 0019h 001Ah 001Bh 001Ch 001Dh 001Eh

I2CCR I2CSR1 I2CSR2 I2CCCR I2COAR1 I2COAR2 I2CDR

C Control Register

C Status Register 1

C Status Register 2

C Clock Control Register

C Own Address Register 1

C Own Address Register2

C Data Register

00h 00h 00h 00h 00h 00h 00h

R/W Read Only Read Only R/W R/W R/W R/W

001Fh 0020h

Reserved Area (2 Bytes)

0021h 0022h 0023h

SPI

SPIDR SPICR SPICSR

SPI Data I/O Register SPI Control Register SPI Control/Status Register

xxh 0xh 00h

R/W R/W R/W

0024h 0025h 0026h 0027h

ITC

ISPR0 ISPR1 ISPR2 ISPR3

Interrupt Software Priority Register 0 Interrupt Software Priority Register 1 Interrupt Software Priority Register 2 Interrupt Software Priority Register 3

FFh FFh FFh FFh

R/W R/W R/W R/W

0028h EICR External Interrupt Control Register 00h R/W 0029h FLASH FCSR Flash Control/Status Register 00h R/W

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002Ah WATCHDOG WDGCR Watchdog Control Register 7Fh R/W

002Bh SICSR System Integrity Control/Status Register 000x 000x b R/W 002Ch

002Dh

MCC

MCCSR MCCBCR

Main Clock Control / Status Register Main Clock Controller: Beep Control Register

00h 00h

R/W R/W

002Eh

0030h

Reserved Area (3 Bytes)

0031h 0032h 0033h 0034h 0035h 0036h 0037h 0038h 0039h 003Ah 003Bh 003Ch 003Dh 003Eh 003Fh

TIMER A

TACR2 TACR1 TACSR TAIC1HR TAIC1LR TAOC1HR TAOC1LR TACHR TACLR TAACHR TAACLR TAIC2HR TAIC2LR TAOC2HR TAOC2LR

Timer A Control Register 2 Timer A Control Register 1 Timer A Control/Status Register Timer A Input Capture 1 High Register Timer A Input Capture 1 Low Register Timer A Output Compare 1 High Register Timer A Output Compare 1 Low Register Timer A Counter High Register Timer A Counter Low Register Timer A Alternate Counter High Register Timer A Alternate Counter Low Register Timer A Input Capture 2 High Register Timer A Input Capture 2 Low Register Timer A Output Compare 2 High Register Timer A Output Compare 2 Low Register

00h 00h

xxxx x0xx b

xxh

xxh 80h 00h FFh

FCh FFh FCh

xxh

xxh 80h 00h

R/W R/W R/W Read Only Read Only R/W R/W Read Only Read Only Read Only Read Only Read Only Read Only R/W

R/W 0040h Reserved Area (1 Byte)

0041h 0042h 0043h 0044h 0045h 0046h 0047h 0048h 0049h 004Ah 004Bh 004Ch 004Dh 004Eh 004Fh

TIMER B

TBCR2 TBCR1 TBCSR TBIC1HR TBIC1LR TBOC1HR TBOC1LR TBCHR TBCLR TBACHR TBACLR TBIC2HR TBIC2LR TBOC2HR TBOC2LR

Timer B Control Register 2 Timer B Control Register 1 Timer B Control/Status Register Timer B Input Capture 1 High Register Timer B Input Capture 1 Low Register Timer B Output Compare 1 High Register Timer B Output Compare 1 Low Register Timer B Counter High Register Timer B Counter Low Register Timer B Alternate Counter High Register Timer B Alternate Counter Low Register Timer B Input Capture 2 High Register Timer B Input Capture 2 Low Register Timer B Output Compare 2 High Register Timer B Output Compare 2 Low Register

00h 00h

xxxx x0xx b

xxh

xxh 80h 00h

FFh FCh FFh FCh

xxh

xxh 80h 00h

R/W R/W R/W Read Only Read Only R/W R/W Read Only Read Only Read Only Read Only Read Only Read Only R/W R/W

0050h 0051h 0052h 0053h 0054h 0055h 0056h 0057h

SCI

SCISR SCIDR SCIBRR SCICR1 SCICR2 SCIERPR

SCIETPR

SCI Status Register SCI Data Register SCI Baud Rate Register SCI Control Register 1 SCI Control Register 2 SCI Extended Receive Prescaler Register Reserved area SCI Extended Transmit Prescaler Register

C0h

xxh 00h

x000 0000b

00h 00h

---

00h

Read Only R/W R/W R/W R/W R/W

R/W

Address Block

Label

Reset

Status

Remarks

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Legend: x=undefined, R/W=read/write Notes:

1. The contents of the I/O port DR registers are read able only i n out put conf iguration. I n i nput conf iguration, the values of the I/O pins are returned instead of the DR register contents.

2. The bits associated with unavailable pins must always keep their reset value.

0058h

006Fh

Reserved Area (24 Bytes)

0070h 0071h 0072h

ADC

ADCCSR ADCDRH ADCDRL

Control/Status Register Data High Register Data Low Register

00h 00h 00h

R/W Read Only Read Only

0073h 0074h 0075h 0076h 0077h

0078h 0079h 007Ah

007Bh 007Ch 007Dh

PWM ART

PWMDCR3 PWMDCR2 PWMDCR1 PWMDCR0 PWMCR ARTCSR ARTCAR ARTARR ARTICCSR ARTICR1 ARTICR2

PWM AR Timer Duty Cycle Register 3 PWM AR Timer Duty Cycle Register 2 PWM AR Timer Duty Cycle Register 1 PWM AR Timer Duty Cycle Register 0 PWM AR Timer Control Register Auto-Reload Timer Control/Status Register Auto-Reload Timer Counter Access Register Auto-Reload Timer Auto-Reload Register AR Timer Input Capture Control/Status Reg. AR Timer Input Capture Register 1 AR Timer Input Capture Register 1

00h 00h 00h 00h 00h 00h 00h 00h

00h 00h 00h

R/W R/W R/W R/W R/W R/W R/W R/W R/W Read Only Read Only

007Eh 007Fh

Reserved Area (2 Bytes)

Address Block

Label

Reset

Status

Remarks

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4 FLASH PROGRAM ME MORY

4.1 Introduction

The ST7 dual voltage High Density Flash (HDFlash) is a non-volatile memory that can be electrically erased as a single block or by individual sectors and programmed on a Byte-by-Byte basis using an external V

supply.

The HDFlash devices can be programmed and erased off-board (plugge d in a programm ing tool) or on-board using ICP (In-Circuit Programming) or IAP (In-Application Programming).

The array matrix organ isation allows each sector to be erased and reprogramm ed without affecting other sectors.

4.2 Main Features

■ Three Flash programming modes :

– Insertion in a programming tool. In this m ode,

all sectors including option bytes can be programmed or erased.

– ICP (In-Circuit Programming). In this mode, all

sectors including option bytes can be programmed or erased without removing the device from the application board.

– IAP (In-Application Programming) In this

mode, all sectors except Sector 0, can be programmed or erased without removing the device from the application board a nd wh ile the application is running.

■ ICT (In-Circuit Testing) for downloading and

executing user application test patterns in RAM

■ Read-out protection against piracy ■ Register Access Security System (RASS) to

prevent accidental programming or erasing

4. 3 S tructure

The Flash memory is organised in sectors and can be used for both code and data storage.

Depending on the overall Flash memory size in the microcontroller device, there are up to three user sectors (see Table 3). Each of these sectors can be erased independently to avoid unnecessary erasing of the whole Flas h memory when only a partial erasing is required.

The first two sectors have a fixed siz e of 4 Kby tes (see Figure 5). They are mapped in the upper part of the ST7 addressing space so t he reset and interrupt vectors are located in Sector 0 (F000hFFFFh).

Table 3. Sectors available in Flash devices

4.3.1 Read-out Protection

Read-out protection, when s elected, makes it impossible to extract the memory content from the microcontroller, thus preventing piracy. Even ST cannot access the user code.

In flash devices, this protection is removed by reprogramming the option. In this case, the entire program memory is first automatically erased and the device can be reprogrammed.

Read-out protection selection depend s on the device type:

– In Flash devices it is enabled and removed

through the FMP_R bit in the option byte.

– In ROM devices it is enabled by mask option

specified in the Option List.

Note: The LVD is not supported if read-out protection is enabled

Figure 5. Me m ory M a p and Sector Address

Flash Size (bytes) Available Sectors

4K Sector 0 8K Sectors 0,1

> 8K Sectors 0,1, 2

4 Kbytes

2Kbytes

SECTOR 1 SECTOR 0

16 Kbytes

SECTOR 2

8K 16K 32K 60K

FLASH

FFFFh

EFFFh

DFFFh

3FFFh 7FFFh

1000h

24 Kbytes

MEMORY SIZE

8Kbytes 40 Kbytes

52 Kbytes

9FFFh BFFFh D7FFh

4K 10K 24K 48K

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FLASH PROGRAM MEMORY (Cont’d)

4.4 ICC Interface

ICC needs a m inimum of 4 and u p t o 6 pins to be connected to the programming tool (see Figure 6). These pins are:

– RESET

: device reset

–V

: device power supply ground

– ICCCLK: ICC output serial clock pin – ICCDATA: ICC input/output serial data pin – ICCSEL/V

: programming voltage

– OSC1(or OSCIN): main clock input for exter-

nal source (optional)

–V

: application board power su pply (option-

al, see Figure 6, Note 3)

Figure 6. Typical ICC Interface

Notes:

1. If the ICCCLK or ICCDATA pins are only u sed as outputs in t he ap plication, n o s ign al iso lation is necessary. As soon as the Programming Tool is plugged to the board, even if an ICC session is not in progress, the ICCCLK and ICCDATA pins are not available for the application. If they are used as inputs by the application, isolation such as a serial resistor has to implemented in case another device forces the signal. Refer to the Programming Tool documentation for recommended resistor values.

2. During the ICC session, the programming tool must control the RESET

pin. This can lead to conflicts between the programming tool and the application reset circuit if it drives more than 5mA at high level (push pull output or pull-up resistor<1K). A schottky diode can be us ed to iso late the application RESET circuit in this case. When using a classical RC network with R>1K or a reset man-

agement IC with open drain ou tput and pu ll-up resistor>1K, no additional com ponents are needed. In all cases the user must ensure that no external reset is generated by the application during the ICC session.

3. The use of Pin 7 of the ICC con nector de pends on the Programming Tool architecture. This pin must be connected when using most ST Programming Tools (it is used to monitor the application power supply). Please refer to the Programming Tool manual.

4. Pin 9 has to be co nnected to the OS C1 or OSCIN pin of the ST7 when the clock is not available in the application or if the sel ected clock opt ion is not programmed in t he option byte. ST7 devices with multi-oscillator capability need to have OSC2 grounded in this case.

ICC CONNECTOR

ICCDATA

ICCCLK

RESET

HE10 CONNECTOR TYPE

APPLICATION POWER SUPPLY

246810

975 3

PROGRAMMING TOOL

ICC CONNECTOR

APPLICATION BOARD

ICC Cab le

OPTIONAL (See No te 3)

10kΩ

ICCSEL/VPP

ST7

OSC1

OSC2

OPTIONAL

See Note 1

See Note 2

APPLICATION RESET SOURCE

APPLICATI ON

I/O

(See No te 4)

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FLASH PROGRAM MEMORY (Cont’d)

4.5 ICP (In-Circuit Programming)

To perform ICP the microcontroller must be switched to ICC (In-Circuit Communication) mode by an external controller or programming tool.

Depending on the ICP code dow nloaded in RAM, Flash memory programming can be fully customized (number of bytes to prog ram, program locations, or selection serial communication interface for downloading).

When using an STMicroelectronics or third-party programming tool that supp orts ICP and the specific microcontroller device, the user needs only to implement the ICP hardware interface on the application board (see Figure 6). For more details on the pin locations, refer to the device pinout description.

4.6 IA P ( I n-Ap plication P rogramming )

This mode uses a BootLoader program previously stored in Sector 0 by the us er (in ICP mode or by plugging the device in a programming tool).

This mode is fully controlled by user software. This allows it to be adapted to the user application, (user-defined strategy for entering programming mode, choice of comm unications protocol used t o fetch the data to be stored, etc.). For example, it is possible to download code from the SPI, SCI, USB

or CAN interface and program it in the Flash. IAP mode can be used to program any of the Flash sectors except Sector 0, whi ch is write/erase protected to allow recovery in case errors occur during the programming operation.

4.7 Related Documentation

For details on Flash program ming and ICC protocol, refer to the ST7 Flash Programming Reference Manual and to the ST7 ICC Protocol Re ference Manual

4.7.1 Register Description FLASH CONTROL/STATUS REGISTER (FCSR)

Read/Write Reset Value: 0000 0000 (00h)

This register is reserved for use by Programming Tool software. It controls the Flash programming and erasing operations. Flash Control/Status Register Address and Reset Value

00000000

Address

(Hex.)

Label

76543210

0029h

FCSR

Reset Value00000000

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5 CENTRAL PRO CESSING UNIT

5.1 INTRODUCTION

This CPU has a full 8-bit architecture and contains six internal registers allowing efficient 8-bit data manipulation.

5.2 MAIN FEATURES

■ Enable executing 63 basic instructions ■ Fast 8-bit by 8-bit multiply ■ 17 main addressing modes (with indirect

addressing mode)

■ Two 8-bit index registers ■ 16-bit stack pointer ■ Low power HALT and WAIT modes ■ Priority maskable hardware interrupts ■ Non-maskable software/hardware interrupts

5.3 CPU REGISTERS

The 6 CPU registers shown in Figure 7 are not present in the memory mapping and are accessed by spec ifi c ins t ru c tio n s .

Accumulator (A)

The Accumulator is an 8-bit general purpose register used to hold operands and the res ults of the arithmetic and logic calculations and to manipulate data.

Index Registers (X and Y)

These 8-bit registers are used to create effective addresses or as tempo rary storage areas f or data manipulation. (The Cross -Assembler generates a precede instruction (PRE) to indicate that the following instruction refers to the Y register.)

The Y register is not affected by the interrupt automatic procedures.

Program Counter (PC)

The program counter is a 16-bit register containing the address of the next instruction to be executed by the CPU. It is made of two 8-bit registers PCL (Program Counter Low which is the LSB) and PCH (Program Counter High which is the MSB).

Figure 7. CPU Registers

ACCUMULA TOR

X INDEX REGISTER

Y INDEX REGISTER

STACK POINTER

CONDITION CODE REGISTER

PROGRAM COUNTER

1C1I1HI0NZ

RESET VALUE = RESET VECTOR @ FFFEh-FFFFh

15 8

PCH

PCL

RESET VALUE = STACK HIGHER ADDRESS

RESET VALUE =

1X11X1XX

RESET VALUE = XXh

X = Undefined Value

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CENTRAL PROC ESSING UNIT (Cont’d) Condition Code Register (CC)

Read/Write Reset Value: 111x1xxx

The 8-bit Condition Code regist er contains the i nterrupt masks and four flags representative of the result of the instruction just executed. This register can also be handled by the PUSH and POP instructions.

These bits can be individually tested and/or controlled by specific instructions.

Arithmetic Management Bits

Bit 4 = H

Half carry

This bit is set by hardware when a carry occurs between bits 3 and 4 of t he ALU during an ADD or ADC instructions. It is reset by hardware during the same instructio n s.

0: No half carry has occurred. 1: A half carry has occurred.

This bit is tested using the JRH or JRNH instruction. The H bit is useful in BCD arithmetic subroutine s .

Bit 2 = N

Negative

This bit is set and cleared by hardware. It is representative of the result sign of the last arithmetic, logical or data manipulation. I t’s a copy of the result 7

bit. 0: The result of the last operation is positive or null. 1: The result of the last operation is negative

(i.e. the most significant bit is a logic 1).

This bit is accesse d by the JRMI and JRPL instructions.

Bit 1 = Z

Zero

This bit is set and cleared by hardware. This bit indicates that the result of the last arithmetic, logical or data manipulation is zero. 0: The result of the last operation is different from

zero.

1: The result of the last operation is zero. This bit is accessed by the JREQ and JRNE test

instructions. Bit 0 = C

Carry/borrow.

This bit is set and cleared b y hardware and software. It indicates an overflow or an un derflow has occurred during the last arithmetic operation. 0: No overflow or underflow has occurred. 1: An overflow or underflow has occurred.

This bit is driven by the SCF and RCF instructions and tested by the JRC and JRNC instructions. It i s also affected by the “bit test and branch”, shift and rotate instructions.

Interrupt Manageme nt B i ts

Bit 5,3 = I1, I0

Interrupt

The combination of the I1 and I0 bits gives the current interrupt software priority.

These two bits are set/cleared by hardware when entering in interrupt. The loaded value is given by the corresponding bits in the interrupt software priority registers (IxSPR). They can be also set/ cleared by software with the RIM, SIM, IRET, HALT, WFI and PUSH/POP instructions.

See the interrupt management chapter for more details.

11I1HI0NZ

Interrupt Software Priorit y I1 I0

Level 0 (main) 1 0 Level 1 0 1 Level 2 0 0 Level 3 (= interrupt disable) 1 1

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CENTRAL PROC ESSING UNIT (Cont’d) Stack Poi nter (SP)

Read/Write Reset Value: 01 FFh

The Stack Pointer is a 16-bit register which is always pointing to the next free location in the stack. It is then decremented after data has been pushed onto the stack and incremented before data is popped from the stack (see Figure 8).

Since the stack is 256 bytes deep, the 8 most significant bits are forced by hard ware. Following a n MCU Reset, or after a Reset Stack Pointer instruction (RSP), the Stack Pointer contains its reset value (the SP7 to SP0 bits are set) which is the stack higher address.

The least significant byte of the Stack Pointer (called S) can be directly accessed by a LD instruction.

Note: When the lower limit is exceeded, the Stack Pointer wraps around to the stack upper limit, without indicating the stack overflow. The previously stored information is then o verwritten and therefore lost. The stack also wraps in case of an underflow.

The stack is used to sav e the return address during a subroutine call and the CPU context during an interrupt. The user may also directly manipulate the stack by means of the PUSH and POP instructions. In the case of an interrupt, the PCL is stored at the first location po inted t o by t he SP. Th en t he other registers are stored in the next locations as shown in Figure 8.

– When an interrupt is received, the SP is decre-

mented and the context is pushed on the stack.

– On return from interrupt, the SP is incremented

and the context is popped from the stack.

A subroutine call occupies two locations and an interrupt five locat ion s i n the stack ar ea.

Figure 8. Stack Manipulation Example

15 8

00000001

SP7 SP6 SP5 SP4 SP3 SP2 SP1

SP0

PCH PCL

PCH

PCL

PCH

PCL

PCH

PCL

PCH

PCH PCL

CALL

Subroutine

Interrupt

Event

PUSH Y POP Y IRET

RET

or RSP

@ 01FFh

@ 0100h

Stack Higher Address = 01FFh Stack Lower Address =

0100h

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6 SUPPLY, RESET AND CLO CK MANAGEMENT

The device includes a range of utility features for securing the application in critical situations (for example in case of a power brown-out), and reducing the number of external components. An overview is shown in Figure 10.

For more details, refer to dedicated parametric section.

Main features

■ Optional PLL for multiplyi ng the frequency by 2

(not to be used with internal RC oscillator)

■ Reset Sequence Manager (RSM) ■ Multi-Oscillator Clock Management (MO)

– 5 Crysta l/ C er amic resona tor o sc illa t or s – 1 Interna l RC o s c illat o r

■ System Integrity Management (SI)

– Main supply Low voltage detection (LVD) – Auxiliary Voltage detector (AVD) with interrupt

capability for monitoring the main supply or the EVD pin

– Clock Security System (CSS) with Cl ock Filte r

and Backup Safe Oscillator (enabled by op-

tion byte)

6.1 PHASE LOCKED LOOP

If the clock frequency input to the PLL is in the range 2 to 4 MHz, the PLL can be used to multiply the frequency by two to obtain an f

OSC 2

of 4 to 8 MHz. The PLL is enabled by option byte. If the PLL is disabled, then f

OSC2 = fOSC

/2.

Caution: T he PLL is not rec ommended for ap plications where timing accuracy is required. See “PLL Characteristics” on page 150.

Figure 9. PLL Block Diagram

Figure 10. Clock, Reset and Supply Block Diagram

PLL OPTION BIT

PLL x 2

OSC2

/ 2

OSC

LOW VOLTAG E

DETECTOR

(LVD)

OSC2

AUXILIARY VOLTAGE

DETECTOR

(AVD)

MULTI-

OSCILLATOR

(MO)

OSC1

RESET

EVD

RESET SEQUENCE

MANAGER

(RSM)

CLOCK FILTER

SAFE

OSC

CLOCK SECURITY SYSTEM

(CSS)

OSC2

MAIN CLOCK

CSS Interrupt Request

AVD Interrupt Requ est

CONTR O LLER

PLL

SYSTEM INTEGRITY MAN AGEMENT

WATCHDOG

SICSR

TIMER (W DG )

WITH REALTIME

CLOCK (MCC/R T C)

AVD

AVD AVD

LVD

CSS

IEIE

CSSDWDG

OSC

OSC2

(option)

CPU

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6.2 MULTI-OSCILLATOR (MO)

The main clock of the ST7 can be generated by three different source types coming from the multioscillator block:

■ an external source ■ 4 crystal or ceramic resonator oscillators ■ an internal high frequency RC oscillator

Each oscillator is optimized for a given freq uency range in terms of consumption and is selectable through the option byte. The assoc iated hardware configurations are shown in Table 4. Refer to the electrical characteristics section for more details.

Caution: T he OSC1 and/or OSC2 pins must not be left unconnected. F or the purposes o f Failure Mode and Effect Analysis, it should be noted that if the OSC1 and/or OSC2 pins are left unconnected, the ST7 main osc illator m ay sta rt an d, in this configuration, could generate an f

OSC

clock frequency in excess of the allowed maximum (>16MHz.), putting the ST7 in an unsafe/undefined state. The product behaviour must therefore be considered undefined when the OSC pins are le ft unconnected.

External Clock Source

In this external clock mode, a clock signal (square, sinus or triangle) with ~50% duty cycle has to drive the OSC1 pin while the OSC2 pin is tied to ground.

Note: External clock sou rce is not suppo rted with the PLL enabled.

Crystal/Ceramic Oscillators

This family of oscillators has the advantage of producing a very accurate rate on the main clock of the ST7. The s election within a list of 4 oscillators with different frequency ran ges has to be done by option byte in order to redu ce consumption (refer to Se ction 14.1 on p age 172 for more details on the frequency ranges). In this mode o f the multioscillator, the resonator and the load capacitors have to be placed as close as possible to the oscillator pins in order to minimize output distortion and start-up stabilization time. The loading capacitance values must be adjusted according to the selected osci lla tor .

These oscillators are not stopped during the RESET phase to avoid losing time in the oscillator start-up phase.

Internal RC Oscillator

This oscillator allows a low cost solution for the main clock of the ST7 using only an internal resistor and capac it or. Int ernal RC oscilla tor mod e has the drawback of a lower frequency accuracy and should not be used in applications that require accurate timin g .

In this mode, the two oscillator pins have to be tied to ground.

Table 4. ST7 Clock Sources

Hardware Configuration

External ClockCrystal/Ceramic ResonatorsInternal RC Oscillator

OSC1 OSC2

EXTERNAL

ST7

SOURCE

OSC1 OSC2

LOAD

CAPACITORS

ST7

OSC1 OSC2

ST7

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6.3 RESET SEQUENCE MANAGER (RSM)

6.3.1 Introd uc tion

The reset sequence manager in cludes three RESET sources as shown in Figure 12:

■ External RESET source pulse ■ Internal LVD RESET (Low Voltage Detection) ■ Internal WATCHDOG RESET

These sources act on the RESET

pin and it is al-

ways kept low during the delay phase. The RESET service routine vector is fixed at ad-

dresses FFFEh-FFFFh in the ST7 memory map. The basic RE SET sequence consists o f 3 p has es

as shown in F igure 11:

■ Active Phase depending on the RESET source ■ 256 or 4096 CPU clock cycle delay (selected by

opt ion byte)

■ RESET vector fetch

The 256 or 4096 CPU clock cycle delay allows the oscillator to stabilise and ensures that recovery has taken place from t he Reset st ate. T he short er or longer clock cycle delay should be selected by option byte to correspond to the stabilization t ime of the external oscillator used in the application (see Section 14.1 on page 172).

The RESET vector fetch phase duration is 2 clock cycles.

Figure 11. RESET Sequence Phases

6.3.2 Async hr onous Extern a l RESET

The RESET

pin is both an input and an open-drain

output with integrated R

weak pull-up resistor. This pull-up has no fixed value but varies in accordance with the input voltage. It

can be pulled low by external circuitry to reset the device. See

“CONTROL PIN CHARACTERISTICS” on page 160 for more details.

A RESET signal originating from an external source must have a duration of at least t

h(RSTL)in

in order to be recognized (see Figure 13). This detection is asynchronous and therefore the MCU can enter reset state even in HALT mode.

Figure 12. Reset Block Diagram

RESET

Active Phase

INTERNAL RESET

256 or 4096 CLOCK CYCLES

FETCH

VECTOR

RESET

WATCHDOG RESET LVD RESET

INTERNAL RESET

PULSE

GENERATOR

Filter

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RESET SEQUENCE MANAGER (Cont’d) The RESET

pin is an asynchronous signal which plays a major role in EMS performance. In a noisy environment, it is recommended to follow the guidelines mentioned in the elect rical characteristics section.

If the external RESET

pulse is shorter than

w(RSTL)out

(see short ext. Reset in Figure 13), the

signal on the RESET

pin may be stretched. Otherwise the delay will not be applied (see long ext. Reset in Figure 13). Starting from the external RESET pulse recognition, the device RESET

pin acts as an output that is pulled low during at least t

w(RSTL)out

6.3.3 External Power-On RESET

If the LVD is disabled by option byte, to start up the microcontroller correctly, the user must ensure by means of an external reset circuit that the reset signal is held low until V

is over the minimum

level specified for the selected f

OSC

frequency.

(see “OPERA TING CONDITIONS” on page 138)

A proper reset signal for a sl ow rising V

supply can generally be p rovided by an e xternal RC ne twork connected to the RESET

pin.

6.3.4 Internal Low Voltage Detector (LVD) RESET

Two differe nt RESET sequences caused by the internal LVD circuitry can be distinguished:

■ Power-On RESET ■ Voltage Drop RESET

The device RESET

pin acts as an output that is

pulled low when V

DD<VIT+

(rising edge) or

DD<VIT-

(falling edge) as shown in Figure 13.

The LVD filters spikes on V

larger than t

g(VDD)

avoid parasitic resets.

6.3.5 Internal Watchdog RESET

The RESET sequence generated by a internal Watchdog counter overflow is shown in Figure 13.

Starting from the Watchdog counter underflow, the device RESET

pin acts as an output that is pulled

low during at least t

w(RSTL)out

Figure 13. RESET Sequences

RUN

RESET PIN

EXTERNAL

WATCHDOG

ACTIVE PHASE

IT+(LVD)

IT-(LVD)

h(RSTL)in

w(RSTL)out

RUN

h(RSTL)in

ACTIVE

WATCHDOG UNDERFLOW

w(RSTL)out

RUN RUN RUN

RESET

RESET SOURCE

SHORT EXT.

RESET

LVD

RESET

LONG EXT.

RESET

WATCHDOG

RESET

INTE RNAL R ES ET (25 6 or 40 96 T

CPU

)

VECTOR FETCH

w(RSTL)out

PHASE

ACTIVE

PHASE

ACTIVE

PHASE

DELAY

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6.4 SYSTEM INTEGRITY MANAGEMENT (SI)

The System Integrity Mana gement block co ntains the Low Voltage Detector (LVD), Auxiliary Voltage Detector (AVD) functions and Clo ck Security System (CSS). It is managed by the SICSR register.

6.4.1 Low Voltage Detector (LVD)

The Low Voltage Dete ctor function (LVD) generates a static reset when the V

supply voltage is

below a V

IT-

reference value. This means that it secures the power-up as well as the power-dow n keeping the ST7 in reset.

The V

IT-

reference value for a voltage drop is lower

than the V

IT+

reference value for power-on in order to avoid a parasitic reset when the MCU starts running and sinks current on the supply (hysteresis).

The LVD Reset circuitry generat es a reset when V

is below:

–V

IT+

when VDD is rising

–V

IT-

when VDD is falling

The LVD func t io n is illustrate d in F igure 14.

Provided the minimum V

value (guaranteed for

the oscillator frequency) is above V

IT-

, the MCU

can only be in two modes:

– under full software control – in static safe reset

In these conditions, secure operation is always ensured for the application without the need for external reset hardware.

During a Low Voltage Detector Reset, the RESET pin is held low, thus p ermitting the MCU to reset other devices.

Notes: The LVD allows the device to be used without any

external RESET circuitry. If the medium or low thresholds are selected, the

detection may occur outside the specified operating voltage range. Below 3.8V, device operation is not guaranteed.

The LVD is an optional func tion which can be selected by option byte.

Figure 14. Low Voltage Detector vs Reset

IT+

RESET

IT-

hys

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SYSTEM INTEGRITY MANAGEMENT (Cont’d)

6.4.2 Auxiliary Voltage Detector (AVD)

The Voltage Detector function (AVD) is based on an analog comparison between a V

IT-(AVD)

and

IT+(AVD)

reference value and the VDD main sup-

ply or the external EVD pin voltage level (V

EVD

The V

IT-

reference value for falling voltage is lower

than the V

IT+

reference value for rising voltage in

order to avoid parasitic detection (hysteresis). The output of the AVD comparator is directly read-

able by the application software through a real time status bit (AVDF) in t he S ICS R regi ster. This bit is read only.

Caution: The AVD function is active only if the LVD is enabled through the option byte.

6.4.2.1 Monitoring the V

Main Supply

This mode is selected by clearing the AVDS bit in the SICSR register.

The AVD voltage threshold value is relative to the selected LVD threshold configured by option byt e (see Section 14.1 on page 172).

If the AVD interrupt is enabled, an interrupt is generated when the voltage crosses the V

IT+(AVD )

IT-(AVD)

threshold (AVDF bit toggles).

In the case of a drop i n v oltage, t he A V D i nterrupt acts as an early warning, allowing software to shut down safely before the LV D resets the microcontroller. See Fi gure 15.

The interrupt on the rising edge is used to info rm the application that the V

warning state is over.

If the voltage rise time t

is less than 256 or 4 096 CPU cycles (depending on the reset delay selected by option byte), no AVD interrupt will be generated when V

IT+(AVD)

is reached.

If t

is greater than 256 or 4096 cycles then:

– If the AVD interrupt is enabled before the

IT+(AVD)

threshold is reached, then 2 AVD interrupts will be received: the first when the AVDIE bit is set, and the second when the threshold is reached.

– If the AVD interrupt is enabled after the V

IT+(AVD)

threshold is reached then only one AVD interrupt will occur.

Figure 15. Using the AVD to Monitor V

(AVDS bit= 0)

IT+(AVD)

IT-(AVD)

AVDF bit 0 0RESET VALUE

IF AVDIE bit = 1

hyst

AVD INTERRUPT REQUEST

INTERRUPT PROCESS

IT+(LVD)

IT-(LVD)

LVD RESET

Early Warning Interrupt

(Power has dropped, MCU not not yet in reset)

VOLTAGE RISE TIME

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SYSTEM INTEGRITY MANAGEMENT (Cont’d)

6.4.2.2 Monitoring a Voltage on the EVD pin

This mode is selected b y setting the AVDS bit in the SICSR register.

The AVD circuitry can generate an interrupt when the AVDIE bit of the SICSR register is set. This interrupt is generated on the rising and falling edges

of the comparator output. This means it is generated when either one of these two events occur:

–V

EVD

rises up to V

IT+(EVD)

–V

EVD

falls down to V

IT-(EVD)

The EVD func t io n is illustrated in F igure 16. For more details, refer to t he E lectrical Ch aracter-

istics sect ion.

Figure 16. Using the Voltage Detector to Monitor the EVD pin (AVDS bit=1)

EVD

IT+(EVD)

IT-(EVD)

AVDF 0 01

IF AVDIE = 1

hyst

AVD INTERRUPT REQUEST

INTERRUPT PROCESS

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SYSTEM INTEGRITY MANAGEMENT (Cont’d)

6.4.3 Clock Security System (CSS)

The Clock Security System (CSS) protects the ST7 against breakdowns, spikes and overfrequencies occurring on the main clock sourc e (f

OSC

). It is based on a clock filter and a clock detection control with an internal safe oscillator (f

SFOSC

Caution: The CSS function is not guaranteed. Refer to Section 15

6.4.3.1 Clock Filter Control

The PLL has an integrated glitch filtering capability making it possible to protect the internal clock from overfrequencies created by individual spikes. This feature is available only when t he PLL is enabled. If glitches occur on f

OSC

(for example, due to loose connection or noise), the CSS filters t hese automatically, so the internal CPU frequency (f

CPU

)

continues deliver a glitch-free signal (see Figure

17).

6.4.3.2 Clock detection Control

If the clock signal disappears (due to a broke n or disconnected resona tor...), the safe os cillator delivers a low frequency clock signal (f

SFOSC

) whi c h allows the ST7 to perform some rescue operations.

Automatically, the ST7 clock source switches back from the safe o scillator (f

SFOSC

) if the main clock

source (f

OSC

) recovers.

When the internal clock (f

CPU

) is driven by the safe

oscillator (f

SFOSC

), the application software is noti-

fied by hardware setting the CSSD bit in the SI C-

SR register. An interrupt can be generated if the CSSIE bit has been previously set. These two bits are described in the SICSR register description.

6.4.4 Low Power Mo des

6.4.4.1 Interrupts

The CSS or AVD interrupt events g enerate an interrupt if the corresponding Enable Control Bit (CSSIE or AVDIE) is set and the interrupt mask in the CC register is reset (RIM instruction).

Figure 17. Clock Filter Function

Mode Description

WAIT

No effect on SI. CSS and AVD interrupts cause the device to exit from Wait mode.

HALT

The CRSR register is frozen. The CSS (including the safe oscillator) is disabled until HALT mode is exited. The previous CSS configuration resumes when the MCU is woken up by an interrupt with “exit from HALT mode” capability or from the counter reset value when the MCU is woken up by a RESET.

Interrupt Event

Event

Flag

Enable

Control

Bit

Exit from Wait

Exit

from

Halt

CSS event detection (safe oscillator activated as main clock)

CSSD CSSIE Yes No

AVD event AVDF AVDIE Yes No

OSC2

CPU

OSC2

CPU

SFOSC

PLL ON

Clock Filter Function

Clock Detection Function

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