Motorola MC54HC4049J, MC54HC4050J, MC74HC4050N, MC74HC4050D Datasheet

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Motorola MC54HC4049J, MC54HC4050J, MC74HC4050N, MC74HC4050D Datasheet

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Hex Buffers/Logic-Level

Down Converters

High±Performance Silicon±Gate CMOS

The MC54/74HC4049 consists of six inverting buffers, and the MC54/74HC4050 consists of six noninverting buffers. They are identical in pinout to the MC14049UB and MC14050B metal±gate CMOS buffers. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.

The input protection circuitry on these devices has been modified by eliminating the VCC diodes to allow the use of input voltages up to 15 volts. Thus, the devices may be used as logic±level translators that convert from a high voltage to a low voltage while operating at the low±voltage power supply. They allow MC14000±series CMOS operating up to 15 volts to be interfaced with High±Speed CMOS at 2 to 6 volts. The protection diodes to GND are Zener diodes, which protect the inputs from both positive and negative voltage transients.

Output Drive Capability: 10 LSTTL Loads

Outputs Directly Interface to CMOS, NMOS, and TTL

Operating Voltage Range: 2 to 6 V

Low Input Current: 5 μA

High Noise Immunity Characteristic of CMOS Devices

In Compliance with the Requirements Defined by JEDEC Standard No. 7A

Chip Complexity: 36 FETs or 9 Equivalent Gates (4049)

24 FETs or 6 Equivalent Gates (4050)

 

 

LOGIC DIAGRAMS

 

 

 

 

HC4049

 

 

 

HC4050

(INVERTING BUFFER)

 

(NONINVERTING BUFFER)

 

 

2

 

 

3

2

 

A0

 

 

 

Y0

A0

 

 

Y0

 

4

 

 

4

 

 

 

 

5

 

A1

 

 

 

Y1

A1

 

 

Y1

 

 

 

 

 

7

6

 

 

7

6

 

A2

 

 

 

Y2

A2

 

 

Y2

 

 

 

 

 

9

10

 

 

9

10

 

A3

 

 

 

Y3

A3

 

 

Y3

 

 

 

 

 

11

12

 

 

11

12

 

A4

 

 

 

Y4

A4

 

 

Y4

 

 

 

 

 

14

15

 

 

14

15

 

A5

 

 

 

Y5

A5

 

 

Y5

 

 

 

 

 

PIN 1 = VCC

PIN 8 = GND

PINS 13, 16 = NO CONNECTION

MC54/74HC4049

MC54/74HC4050

 

 

J SUFFIX

16

CERAMIC PACKAGE

 

CASE 620±10

 

1

 

 

 

N SUFFIX

16

PLASTIC PACKAGE

 

CASE 648±08

 

 

 

1

 

 

 

D SUFFIX

16

 

SOIC PACKAGE

 

1

CASE 751B±05

 

ORDERING INFORMATION

 

MC54HCXXXXJ

Ceramic

 

MC74HCXXXXN

Plastic

 

MC74HCXXXXD

SOIC

PIN ASSIGNMENT

VCC

 

1

16

NC

 

 

Y0

 

2

15

Y5

A0

 

3

14

A5

 

Y1

 

4

13

NC

 

A1

 

5

12

Y4

 

Y2

 

6

11

A4

 

A2

 

7

10

Y3

 

GND

 

8

9

A3

 

 

 

 

 

 

NC = NO CONNECTION

FUNCTION TABLE

A

Y Outputs

Input

HC4049

HC4060

 

 

 

L

H

L

H

L

H

 

 

 

10/95

Motorola, Inc. 1995

REV 6

MC54/74HC4049 MC54/74HC4050

MAXIMUM RATINGS*

Symbol

Parameter

Value

Unit

 

 

 

 

VCC

DC Supply Voltage (Referenced to GND)

± 0.5 to + 7.0

V

Vin

DC Input Voltage (Referenced to GND)

± 1.5 to + 18

V

Vout

DC Output Voltage (Referenced to GND)

± 0.5 to VCC + 0.5

V

Iin

DC Input Current, per Pin

± 20

mA

Iout

DC Output Current, per Pin

± 25

mA

ICC

DC Supply Current, VCC and GND Pins

± 50

mA

PD

Power Dissipation in Still Air, Plastic or Ceramic DIP²

750

mW

 

SOIC Package²

500

 

 

 

 

 

Tstg

Storage Temperature

± 65 to + 150

_C

TL

Lead Temperature, 1 mm from Case for 10 Seconds

260

_C

 

(Plastic DIP or SOIC Package)

 

 

(Ceramic DIP)

300

 

 

 

 

 

This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields referenced to the GND pin, only. Extra precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high±impedance circuit. For proper operation, the ranges GND v Vin v 15 V and

GND v Vout v VCC are recommended.

Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC).

*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions.

²Derating Ð Plastic DIP: ± 10 mW/ _C from 65_ to 125_C Ceramic DIP: ± 10 mW/_C from 100_ to 125_C SOIC Package: ± 7 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

 

Min

Max

Unit

 

 

 

 

 

 

VCC

DC Supply Voltage (Referenced to GND)

 

2.0

6.0

V

Vin

DC Input Voltage (Referenced to GND)

 

0

VCC

V

 

 

 

 

to 15

 

 

 

 

 

 

 

Vout

DC Output Voltage (Referenced to GND)

 

0

VCC

V

TA

Operating Temperature, All Package Types

 

± 55

+ 125

_C

tr, tf

Input Rise and Fall Time

VCC = 2.0 V

0

1000

ns

 

(Figure 1)

VCC = 4.5 V

0

500

 

 

 

VCC = 6.0 V

0

400

 

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

 

 

 

 

 

Guaranteed Limit

 

 

 

 

 

 

VCC

 

 

 

 

 

 

 

 

 

± 55 to

v _

v

_

 

Symbol

Parameter

Test Conditions

V

_

Unit

 

25 C

85 C

 

125 C

VIH

Minimum High±Level Input

Vout = VCC ± 0.1 V

2.0

1.5

1.5

 

1.5

V

 

Voltage

|Iout| v 20 μA

 

4.5

3.15

3.15

 

3.15

 

 

 

 

 

6.0

4.2

4.2

 

4.2

 

 

 

 

 

 

 

 

 

 

VIL

Maximum Low±Level Input

Vout = 0.1 V or VCC ± 0.1 V

2.0

0.3

0.3

 

0.3

V

 

Voltage

|Iout| v 20 μA

 

4.5

0.9

0.9

 

0.9

 

 

 

 

 

6.0

1.2

1.2

 

1.2

 

 

 

 

 

 

 

 

 

 

 

VOH

Minimum High±Level Output

Vin = VIH

 

2.0

1.9

1.9

 

1.9

V

 

Voltage

|Iout| v 20 μA

 

4.5

4.4

4.4

 

4.4

 

 

 

 

 

6.0

5.9

5.9

 

5.9

 

 

 

 

 

 

 

 

 

 

 

 

 

Vin = VIH or VIL

|Iout| v 4.0 mA

4.5

3.98

3.84

 

3.70

 

 

 

 

|Iout| v 5.2 mA

6.0

5.48

5.34

 

5.20

 

VOL

Maximum Low±Level Output

Vin = VIH or VIL

 

2.0

0.1

0.1

 

0.1

V

 

Voltage

|Iout| v 20 μA

 

4.5

0.1

0.1

 

0.1

 

 

 

 

 

6.0

0.1

0.1

 

0.1

 

 

 

 

 

 

 

 

 

 

 

 

 

Vin = VIH or VIL

|Iout| v 4.0 mA

4.5

0.26

0.33

 

0.40

 

 

 

 

|Iout| v 5.2 mA

6.0

0.26

0.33

 

0.40

 

Iin

Maximum Input Leakage Current

Vin = VCC or GND

6.0

± 0.1

± 1.0

 

± 1.0

μA

 

 

Vin = 15 V

 

6.0

0.5

5.0

 

5.0

 

ICC

Maximum Quiescent Supply

Vin = 15 V or GND

6.0

2

20

 

40

μA

 

Current (per Package)

Iout = 0 μA

 

 

 

 

 

 

 

NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D).

MOTOROLA

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